H5PS5162FLFR-E3I,H5PS5162FLFR-E3I pdf中文资料,H5PS5162FLFR-E3I引脚图,H5PS5162FLFR-E3I电路-Datasheet-电子工程世界

参数对比

与H5PS5162FLFR-E3I相近的元器件有：H5PS5162FFR-E3、H5PS5162FFR-S5、H5PS5162FLFR-Y5、H5PS5162FLFR-S5、H5PS5162FFR-Y5、H5PS5162FLFR-C4、H5PS5162FLFR-S6、H5PS5162FLFR-S6I、H5PS5162FLFR-E3。描述及对比如下：

型号	H5PS5162FLFR-E3I	H5PS5162FFR-E3	H5PS5162FFR-S5	H5PS5162FLFR-Y5	H5PS5162FLFR-S5	H5PS5162FFR-Y5	H5PS5162FLFR-C4	H5PS5162FLFR-S6	H5PS5162FLFR-S6I	H5PS5162FLFR-E3
描述	DDR DRAM, 32MX16, 0.6ns, CMOS, PBGA84,	DDR DRAM, 32MX16, 0.6ns, CMOS, PZMA84, 8 X 13 MM, HALOGEN FREE AND ROHS COMPLIANT, FPBGA-84	DDR DRAM, 32MX16, 0.45ns, CMOS, PZMA84, 8 X 13 MM, HALOGEN FREE AND ROHS COMPLIANT, FPBGA-84	DDR DRAM, 32MX16, 0.45ns, CMOS, PZMA84, 8 X 13 MM, HALOGEN FREE AND ROHS COMPLIANT, FPBGA-84	DDR DRAM, 32MX16, 0.45ns, CMOS, PZMA84, 8 X 13 MM, HALOGEN FREE AND ROHS COMPLIANT, FPBGA-84	DDR DRAM, 32MX16, 0.45ns, CMOS, PZMA84, 8 X 13 MM, HALOGEN FREE AND ROHS COMPLIANT, FPBGA-84	DDR DRAM, 32MX16, 0.5ns, CMOS, PZMA84, 8 X 13 MM, HALOGEN FREE AND ROHS COMPLIANT, FPBGA-84	DDR DRAM, 32MX16, 0.4ns, CMOS, PZMA84, 8 X 13 MM, HALOGEN FREE AND ROHS COMPLIANT, FPBGA-84	DDR DRAM, 32MX16, 0.4ns, CMOS, PBGA84,	DDR DRAM, 32MX16, 0.6ns, CMOS, PZMA84, 8 X 13 MM, HALOGEN FREE AND ROHS COMPLIANT, FPBGA-84
是否Rohs认证	符合	符合	符合	符合	符合	符合	符合	符合	符合	符合
厂商名称	SK Hynix(海力士)	SK Hynix(海力士)	SK Hynix(海力士)	SK Hynix(海力士)	SK Hynix(海力士)	SK Hynix(海力士)	SK Hynix(海力士)	SK Hynix(海力士)	SK Hynix(海力士)	SK Hynix(海力士)
包装说明	FBGA, BGA84,9X15,32	TFBGA, BGA63,9X11,32	TFBGA, BGA63,9X11,32	TFBGA, BGA63,9X11,32	TFBGA, BGA63,9X11,32	TFBGA, BGA63,9X11,32	TFBGA, BGA63,9X11,32	TFBGA, BGA63,9X11,32	FBGA, BGA84,9X15,32	TFBGA, BGA63,9X11,32
Reach Compliance Code	compli	unknown	unknown	compliant	compliant	unknown	compliant	compliant	compliant	compliant
最长访问时间	0.6 ns	0.6 ns	0.45 ns	0.45 ns	0.45 ns	0.45 ns	0.5 ns	0.4 ns	0.4 ns	0.6 ns
最大时钟频率 (fCLK)	200 MHz	200 MHz	400 MHz	333 MHz	400 MHz	333 MHz	266 MHz	400 MHz	400 MHz	200 MHz
I/O 类型	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
交错的突发长度	4,8	4,8	4,8	4,8	4,8	4,8	4,8	4,8	4,8	4,8
JESD-30 代码	R-PBGA-B84	R-XZMA-N203	R-XZMA-N203	R-XZMA-N203	R-XZMA-N203	R-XZMA-N203	R-XZMA-N203	R-XZMA-N203	R-PBGA-B84	R-XZMA-N203
内存密度	536870912 bi	536870912 bit	536870912 bit	536870912 bit	536870912 bit	536870912 bit	536870912 bit	536870912 bit	536870912 bit	536870912 bit
内存集成电路类型	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM
内存宽度	16	16	16	16	16	16	16	16	16	16
端子数量	84	84	84	84	84	84	84	84	84	84
字数	33554432 words	33554432 words	33554432 words	33554432 words	33554432 words	33554432 words	33554432 words	33554432 words	33554432 words	33554432 words
字数代码	32000000	32000000	32000000	32000000	32000000	32000000	32000000	32000000	32000000	32000000
最高工作温度	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
最低工作温度	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
组织	32MX16	32MX16	32MX16	32MX16	32MX16	32MX16	32MX16	32MX16	32MX16	32MX16
输出特性	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	FBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	FBGA	TFBGA
封装等效代码	BGA84,9X15,32	BGA63,9X11,32	BGA63,9X11,32	BGA63,9X11,32	BGA63,9X11,32	BGA63,9X11,32	BGA63,9X11,32	BGA63,9X11,32	BGA84,9X15,32	BGA63,9X11,32
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	GRID ARRAY, FINE PITCH	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	GRID ARRAY, FINE PITCH	MICROELECTRONIC ASSEMBLY
电源	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
刷新周期	8192	8192	8192	8192	8192	8192	8192	8192	8192	8192
连续突发长度	4,8	4,8	4,8	4,8	4,8	4,8	4,8	4,8	4,8	4,8
最大待机电流	0.008 A	0.008 A	0.008 A	0.008 A	0.008 A	0.008 A	0.008 A	0.008 A	0.008 A	0.008 A
最大压摆率	0.32 mA	0.32 mA	0.34 mA	0.32 mA	0.34 mA	0.32 mA	0.32 mA	0.34 mA	0.34 mA	0.32 mA
标称供电电压 (Vsup)	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
表面贴装	YES	NO	NO	NO	NO	NO	NO	NO	YES	NO
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
端子形式	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
端子节距	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm
端子位置	BOTTOM	ZIG-ZAG	ZIG-ZAG	ZIG-ZAG	ZIG-ZAG	ZIG-ZAG	ZIG-ZAG	ZIG-ZAG	BOTTOM	ZIG-ZAG
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	-	EAR99
零件包装代码	-	BGA	BGA	BGA	BGA	BGA	BGA	BGA	-	BGA
针数	-	84	84	84	84	84	84	84	-	84
访问模式	-	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	-	FOUR BANK PAGE BURST
其他特性	-	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	-	AUTO/SELF REFRESH
长度	-	13 mm	13 mm	13 mm	13 mm	13 mm	13 mm	13 mm	-	13 mm
功能数量	-	1	1	1	1	1	1	1	-	1
端口数量	-	1	1	1	1	1	1	1	-	1
工作模式	-	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	-	SYNCHRONOUS
峰值回流温度（摄氏度）	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED
座面最大高度	-	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	-	1.2 mm
自我刷新	-	YES	YES	YES	YES	YES	YES	YES	-	YES
最大供电电压 (Vsup)	-	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	-	1.9 V
最小供电电压 (Vsup)	-	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	-	1.7 V
处于峰值回流温度下的最长时间	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED
宽度	-	8 mm	8 mm	8 mm	8 mm	8 mm	8 mm	8 mm	-	8 mm
Base Number Matches	-	1	1	1	1	1	1	-	-	-