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HD6432653XXXF

Microcontroller, 32-Bit, MROM, H8S/2600 CPU, 20MHz, CMOS, PQFP128, QFP-128

器件类别:嵌入式处理器和控制器    微控制器和处理器   

厂商名称:Hitachi (Renesas )

厂商官网:http://www.renesas.com/eng/

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器件参数
参数名称
属性值
厂商名称
Hitachi (Renesas )
零件包装代码
QFP
包装说明
FQFP, QFP128,.63X.87,20
针数
128
Reach Compliance Code
unknown
位大小
16
CPU系列
H8S/2600
JESD-30 代码
R-PQFP-G128
长度
20 mm
端子数量
128
最高工作温度
70 °C
最低工作温度
-20 °C
封装主体材料
PLASTIC/EPOXY
封装代码
FQFP
封装等效代码
QFP128,.63X.87,20
封装形状
RECTANGULAR
封装形式
FLATPACK, FINE PITCH
电源
3/5 V
认证状态
Not Qualified
RAM(字节)
4096
ROM(单词)
65536
ROM可编程性
MROM
座面最大高度
3.15 mm
速度
20 MHz
最大压摆率
122 mA
表面贴装
YES
技术
CMOS
温度等级
COMMERCIAL
端子形式
GULL WING
端子节距
0.5 mm
端子位置
QUAD
宽度
14 mm
uPs/uCs/外围集成电路类型
MICROCONTROLLER
Base Number Matches
1
文档预览
H8S/2655 Series
H8S/2655
HD6432655, HD6472655,
H8S/2653
HD6432653
Hardware Manual
ADE-602-094C
Rev. 4.0
11/12/98
Hitachi, Ltd.
MC-Setsu
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s
patent, copyright, trademark, or other intellectual property rights for information contained in
this document. Hitachi bears no responsibility for problems that may arise with third party’s
rights, including intellectual property rights, in connection with use of the information
contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you
have received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability.
However, contact Hitachi’s sales office before using the product in an application that demands
especially high quality and reliability or where its failure or malfunction may directly threaten
human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power,
combustion control, transportation, traffic, safety equipment or medical equipment for life
support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi
particularly for maximum rating, operating supply voltage range, heat radiation characteristics,
installation conditions and other characteristics. Hitachi bears no responsibility for failure or
damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider
normally foreseeable failure rates or failure modes in semiconductor devices and employ
systemic measures such as fail-safes, so that the equipment incorporating Hitachi product does
not cause bodily injury, fire or other consequential damage due to operation of the Hitachi
product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document
without written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi
semiconductor products.
Preface
The H8S/2655 Series is a series of high-performance microcontrollers with a 32-bit H8S/2600
CPU core, and a set of on-chip supporting functions required for system configuration.
The H8S/2600 CPU can execute basic instructions in one state, and is provided with sixteen 16-bit
general registers with a 32-bit internal configuration, and a concise and optimized instruction set.
The CPU can handle a 16 Mbyte linear address space (architecturally 4 Gbytes). Programs based
on the high-level language C can also be run efficiently.
The address space is divided into eight areas. The data bus width and access states can be selected
for each of these areas, and various kinds of memory can be connected fast and easily.
On-chip memory consists of large-capacity ROM and RAM. PROM (ZTAT™*) and mask ROM
versions are available, providing a quick and flexible response to conditions from ramp-up through
full-scale volume production, even for applications with frequently changing specifications.
On-chip supporting functions include a 16-bit timer pulse unit (TPU), programmable pulse
generator (PPG), 8-bit timers, watchdog timer (WDT), serial communication interface (SCI), A/D
converter, D/A converter, and I/O ports.
In addition, an on-chip DMA controller (DMAC) and data transfer controller (DTC) are provided,
enabling high-speed data transfer without CPU intervention.
Use of the H8S/2655 Series enables compact, high-performance systems to be implemented easily.
This manual describes the hardware of the H8S/2655 Series. Refer to the H8S/2600 Series and
H8S/2000 Series Programming Manual for a detailed description of the instruction set.
Note: * ZTAT is a trademark of Hitachi, Ltd.
Main Revisions and Additions in This Edition
Page
144
169
211
265
277
430
435
437
459
511
511
605
629
635
649
651
715
718
Section
Revision Contents
6.2.6. Memory Control Register (MCR): description of Bit 5 Description amendments
Figure 6-14 Example of Wait State Insertion Timing
Figure 6-47 Bus-Released State Transition Timing
Table 7-9 Register Functions in Single Address Mode
7.5.8 DMAC Activation Sources
Single Address Mode
10.2.1 Timer Control Register (TCR)
10.2.2 Timer Mode Register (TMDR)
10.2.3 Timer I/O Control Register (TIOR)
10.2.8 Timer Start Register (TSTR)
10.7 Usage Notes: Contention between TCNT Write and
Overflow/Underflow
10.7 Usage Notes: Interrupts and Module Stop Mode
14.2.9 Smart Card Mode Register (SCMR): description of
Bit 3
Figure 14-15 Sample SCI Initialization Flowchart
Figure 14-20 Sample Flowchart of Simultaneous Serial
Transmit and Receive Operations
15.2.3 Serial Mode Register (SMR): description of Bit 7
15.2.4 Serial Control Register (SCR)
Figure amended
Figure amended
Table amendments
Description amendments
Description amendments
Descriptive text added
Note amended
Description amendments
Descriptive text added
addition
Descriptive text added
Note added
Note amended
Amended
Amended
19.2.1 Bus Control Register L (BCRL): description of Bits 4 Added
and 3
Figure 19-2 Wiring of Socket Adapter
Figure amended
Table amendments
Note deleted
802 to 804 Table A.1 Instruction Set
1005
1006
1007
1008
1009
1010
1011
1026
Figure C-1 (a) Port1 Block Diagram (Pins P1
0
and P1
1
)
Figure C-1 (b) Port1 Block Diagram (Pins P1
2
, P1
3
, P1
5
, and Note deleted
P1
7
)
Figure C-1 (c) Port1 Block Diagram (Pins P1
4
and P1
6
)
Figure C-2 (a) Port2 Block Diagram (Pins P2
0
and P2
1
)
Figure C-2 (b) Port2 Block Diagram (Pins P2
2
and P2
4
)
Figure C-2 (c) Port2 Block Diagram (Pins P2
3
and P2
5
)
Figure C-2 (d) Port2 Block Diagram (Pins P2
6
and P2
7
)
Figure C-7 (a) PortA Block Diagram (Pins PA
0
to PA
3
)
Note deleted
Note deleted
Note deleted
Note deleted
Note deleted
Figure amended
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参数对比
与HD6432653XXXF相近的元器件有:HD6432655XXXTE、HD6432653XXXTE、HD6432653XXXVF、HD6432655XXXF、HD6432655XXXVF、HD6432655XXXVTE。描述及对比如下:
型号 HD6432653XXXF HD6432655XXXTE HD6432653XXXTE HD6432653XXXVF HD6432655XXXF HD6432655XXXVF HD6432655XXXVTE
描述 Microcontroller, 32-Bit, MROM, H8S/2600 CPU, 20MHz, CMOS, PQFP128, QFP-128 Microcontroller, 32-Bit, MROM, H8S/2600 CPU, 20MHz, CMOS, PQFP120, TQFP-120 Microcontroller, 32-Bit, MROM, H8S/2600 CPU, 20MHz, CMOS, PQFP120, TQFP-120 Microcontroller, 32-Bit, MROM, 20MHz, CMOS, PQFP128, QFP-128 Microcontroller, 32-Bit, MROM, H8S/2600 CPU, 20MHz, CMOS, PQFP128, QFP-128 Microcontroller, 32-Bit, MROM, 20MHz, CMOS, PQFP128, QFP-128 Microcontroller, 32-Bit, MROM, 20MHz, CMOS, PQFP120, TQFP-120
厂商名称 Hitachi (Renesas ) Hitachi (Renesas ) Hitachi (Renesas ) Hitachi (Renesas ) Hitachi (Renesas ) Hitachi (Renesas ) Hitachi (Renesas )
零件包装代码 QFP QFP QFP QFP QFP QFP QFP
包装说明 FQFP, QFP128,.63X.87,20 TFQFP, TQFP120,.64SQ,16 TFQFP, TQFP120,.64SQ,16 FQFP, FQFP, QFP128,.63X.87,20 FQFP, TFQFP,
针数 128 120 120 128 128 128 120
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown
JESD-30 代码 R-PQFP-G128 S-PQFP-G120 S-PQFP-G120 R-PQFP-G128 R-PQFP-G128 R-PQFP-G128 S-PQFP-G120
长度 20 mm 14 mm 14 mm 20 mm 20 mm 20 mm 14 mm
端子数量 128 120 120 128 128 128 120
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 FQFP TFQFP TFQFP FQFP FQFP FQFP TFQFP
封装形状 RECTANGULAR SQUARE SQUARE RECTANGULAR RECTANGULAR RECTANGULAR SQUARE
封装形式 FLATPACK, FINE PITCH FLATPACK, THIN PROFILE, FINE PITCH FLATPACK, THIN PROFILE, FINE PITCH FLATPACK, FINE PITCH FLATPACK, FINE PITCH FLATPACK, FINE PITCH FLATPACK, THIN PROFILE, FINE PITCH
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 3.15 mm 1.2 mm 1.2 mm 3.15 mm 3.15 mm 3.15 mm 1.2 mm
表面贴装 YES YES YES YES YES YES YES
端子形式 GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
端子节距 0.5 mm 0.4 mm 0.4 mm 0.5 mm 0.5 mm 0.5 mm 0.4 mm
端子位置 QUAD QUAD QUAD QUAD QUAD QUAD QUAD
宽度 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm
uPs/uCs/外围集成电路类型 MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER
位大小 16 16 16 - 16 - -
CPU系列 H8S/2600 H8S/2600 H8S/2600 - H8S/2600 - -
最高工作温度 70 °C 70 °C 70 °C - 70 °C - -
最低工作温度 -20 °C -20 °C -20 °C - -20 °C - -
封装等效代码 QFP128,.63X.87,20 TQFP120,.64SQ,16 TQFP120,.64SQ,16 - QFP128,.63X.87,20 - -
电源 3/5 V 3/5 V 3/5 V - 3/5 V - -
RAM(字节) 4096 4096 4096 - 4096 - -
ROM(单词) 65536 131072 65536 - 131072 - -
ROM可编程性 MROM MROM MROM - MROM - -
速度 20 MHz 20 MHz 20 MHz - 20 MHz - -
最大压摆率 122 mA 122 mA 122 mA - 122 mA - -
技术 CMOS CMOS CMOS - CMOS - -
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL - COMMERCIAL - -
Base Number Matches 1 1 1 1 - - -
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