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HD6433026XXXFP

16-BIT, MROM, 25MHz, MICROCONTROLLER, PQFP100, QFP-100

器件类别:嵌入式处理器和控制器    微控制器和处理器   

厂商名称:Renesas(瑞萨电子)

厂商官网:https://www.renesas.com/

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器件参数
参数名称
属性值
是否无铅
含铅
是否Rohs认证
不符合
零件包装代码
QFP
包装说明
QFP,
针数
100
Reach Compliance Code
compliant
具有ADC
YES
地址总线宽度
24
位大小
16
最大时钟频率
25 MHz
DAC 通道
YES
DMA 通道
NO
外部数据总线宽度
16
JESD-30 代码
R-PQFP-G100
JESD-609代码
e0
长度
20 mm
I/O 线路数量
79
端子数量
100
最高工作温度
75 °C
最低工作温度
-20 °C
PWM 通道
YES
封装主体材料
PLASTIC/EPOXY
封装代码
QFP
封装形状
RECTANGULAR
封装形式
FLATPACK
峰值回流温度(摄氏度)
NOT SPECIFIED
认证状态
Not Qualified
ROM可编程性
MROM
座面最大高度
3.1 mm
速度
25 MHz
最大供电电压
3.6 V
最小供电电压
3 V
标称供电电压
3.3 V
表面贴装
YES
技术
CMOS
温度等级
COMMERCIAL EXTENDED
端子面层
TIN LEAD
端子形式
GULL WING
端子节距
0.65 mm
端子位置
QUAD
处于峰值回流温度下的最长时间
NOT SPECIFIED
宽度
14 mm
uPs/uCs/外围集成电路类型
MICROCONTROLLER
Base Number Matches
1
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To our customers,
Old Company Name in Catalogs and Other Documents
On April 1
st
, 2010, NEC Electronics Corporation merged with Renesas Technology
Corporation, and Renesas
Electronics Corporation
took over all the business of both
companies.
Therefore, although the old company name remains in this document, it is a valid
Renesas
Electronics document. We appreciate your understanding.
Renesas Electronics website:
http://www.renesas.com
April 1
st
, 2010
Renesas Electronics Corporation
Issued by:
Renesas Electronics Corporation
(http://www.renesas.com)
Send any inquiries to
http://www.renesas.com/inquiry.
Notice
1.
All information included in this document is current as of the date this document is issued. Such information, however, is
subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please
confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to
additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website.
Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights
of third parties by or arising from the use of Renesas Electronics products or technical information described in this document.
No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights
of Renesas Electronics or others.
You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part.
Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of
semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software,
and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by
you or third parties arising from the use of these circuits, software, or information.
When exporting the products or technology described in this document, you should comply with the applicable export control
laws and regulations and follow the procedures required by such laws and regulations. You should not use Renesas
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Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics
does not warrant that such information is error free. Renesas Electronics assumes no liability whatsoever for any damages
incurred by you resulting from errors in or omissions from the information included herein.
Renesas Electronics products are classified according to the following three quality grades: “Standard”, “High Quality”, and
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damages arising out of the use of Renesas Electronics products beyond such specified ranges.
Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have
specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Further,
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Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this
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“Standard”:
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
(Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its majority-
owned subsidiaries.
(Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.
16
User’s Manual
H8/3024
H8/3026
The revision list can be viewed directly by
clicking the title page.
The revision list summarizes the locations of
revisions and additions. Details should always
be checked by referring to the relevant text.
H8/3024 Group,
H8/3024F-ZTAT
TM
,
H8/3026F-ZTAT
TM
Hardware Manual
Renesas 16-Bit Single-Chip Microcomputer
H8 Family/H8/300H Series
HD6433024F,
HD6433024TE,
HD6433024FP
HD6433026F,
HD6433026TE,
HD6433026FP
H8/3024F
H8/3026F
HD64F3024F,
HD64F3024TE,
HD64F3024FP
HD64F3026F,
HD64F3026TE,
HD64F3026FP
Rev.2.00 2005.09
Keep safety first in your circuit designs!
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and
more reliable, but there is always the possibility that trouble may occur with them. Trouble with
semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate
measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or
(iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas
Technology Corp. product best suited to the customer's application; they do not convey any license
under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or
a third party.
2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-
party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or
circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and
algorithms represents information on products at the time of publication of these materials, and are
subject to change by Renesas Technology Corp. without notice due to product improvements or
other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or
an authorized Renesas Technology Corp. product distributor for the latest product information
before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising
from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corp. by various means,
including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data,
diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total
system before making a final decision on the applicability of the information and products. Renesas
Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the
information contained herein.
5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or
system that is used under circumstances in which human life is potentially at stake. Please contact
Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when
considering the use of a product contained herein for any specific purposes, such as apparatus or
systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.
6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in
whole or in part these materials.
7. If these products or technologies are subject to the Japanese export control restrictions, they must
be exported under a license from the Japanese government and cannot be imported into a country
other than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the
country of destination is prohibited.
8. Please contact Renesas Technology Corp. for further details on these materials or the products
contained therein.
Rev. 2.00 Sep 20, 2005 page ii of xxxviii
Preface
The H8/3024 Group is a high-performance single-chip microcomputer that integrates peripheral
functions necessary for system configuration with an H8/300H CPU featuring a 32-bit internal
architecture as its core.
The on-chip peripheral functions include ROM, RAM, 16-bit timers, 8-bit timers, a programmable
timing pattern controller (TPC), a watchdog timer (WDT), a serial communication interface (SCI),
a D/A converter, an A/D converter, and I/O ports, providing an ideal configuration as a
microcomputer for embedding in sophisticated control systems. Flash memory (F-ZTAT™*) and
mask ROM are available as on-chip ROM, enabling users to respond quickly and flexibly to
changing application specifications and the demands of the transition from initial to full-fledged
volume production.
Note: * F-ZTAT is a trademark of Renesas Technology Corp.
Intended Readership: This manual is intended for users undertaking the design of an application
system using the H8/3024 Group. Readers using this manual require a basic
knowledge of electrical circuits, logic circuits, and microcomputers.
Purpose:
The purpose of this manual is to give users an understanding of the hardware
functions and electrical characteristics of the H8/3024 Group. Details of
execution instructions can be found in the H8/300H Series Programming
Manual, which should be read in conjunction with the present manual.
Using this Manual:
For an overall understanding of the H8/3024 Group’s functions
Follow the Table of Contents. This manual is broadly divided into sections on the CPU, system
control functions, peripheral functions, and electrical characteristics.
For a detailed understanding of CPU functions
Refer to the separate publication H8/300H Series Programming Manual.
Note on bit notation: Bits are shown in high-to-low order from left to right.
For a detailed understanding of a register when its name is known
The addresses, bits, and initial values of the registers are summarized in appendix B, Internal
I/O Registers.
Related Material:
The latest information is available at our Web Site. Please make sure that you
have the most up-to-date information available.
(http://www.renesas.com/eng/)
Rev. 2.00 Sep 20, 2005 page iii of xxxviii
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参数对比
与HD6433026XXXFP相近的元器件有:HD6433026XXXTE、HD6433026XXXF、HD64F3026F25V、HD6433024XXXTE、HD6433024XXXF、HD6433024XXXFP。描述及对比如下:
型号 HD6433026XXXFP HD6433026XXXTE HD6433026XXXF HD64F3026F25V HD6433024XXXTE HD6433024XXXF HD6433024XXXFP
描述 16-BIT, MROM, 25MHz, MICROCONTROLLER, PQFP100, QFP-100 16-BIT, MROM, 25MHz, MICROCONTROLLER, PQFP100, TQFP-100 16-BIT, MROM, 25MHz, MICROCONTROLLER, PQFP100, QFP-100 16-BIT, FLASH, 25MHz, MICROCONTROLLER, PQFP100, 14 X 20 MM, 0.65 MM PITCH, PLASTIC, QFP-100 16-BIT, MROM, 25MHz, MICROCONTROLLER, PQFP100, TQFP-100 16-BIT, MROM, 25MHz, MICROCONTROLLER, PQFP100, QFP-100 16-BIT, MROM, 25MHz, MICROCONTROLLER, PQFP100, QFP-100
零件包装代码 QFP QFP QFP QFP QFP QFP QFP
包装说明 QFP, TQFP-100 FQFP, QFP, TFQFP, QFP-100 QFP-100
针数 100 100 100 100 100 100 100
Reach Compliance Code compliant compli compliant compliant compliant compliant compliant
具有ADC YES YES YES YES YES YES YES
地址总线宽度 24 24 24 24 24 24 24
位大小 16 16 16 16 16 16 16
最大时钟频率 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz
DAC 通道 YES YES YES YES YES YES YES
DMA 通道 NO NO NO NO NO NO NO
外部数据总线宽度 16 16 16 16 16 16 16
JESD-30 代码 R-PQFP-G100 S-PQFP-G100 S-PQFP-G100 R-PQFP-G100 S-PQFP-G100 S-PQFP-G100 R-PQFP-G100
长度 20 mm 14 mm 14 mm 20 mm 14 mm 14 mm 20 mm
I/O 线路数量 79 79 79 79 79 79 79
端子数量 100 100 100 100 100 100 100
最高工作温度 75 °C 75 °C 75 °C 75 °C 75 °C 75 °C 75 °C
最低工作温度 -20 °C -20 °C -20 °C -20 °C -20 °C -20 °C -20 °C
PWM 通道 YES YES YES YES YES YES YES
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 QFP TFQFP FQFP QFP TFQFP FQFP QFP
封装形状 RECTANGULAR SQUARE SQUARE RECTANGULAR SQUARE SQUARE RECTANGULAR
封装形式 FLATPACK FLATPACK, THIN PROFILE, FINE PITCH FLATPACK, FINE PITCH FLATPACK FLATPACK, THIN PROFILE, FINE PITCH FLATPACK, FINE PITCH FLATPACK
ROM可编程性 MROM MROM MROM FLASH MROM MROM MROM
座面最大高度 3.1 mm 1.2 mm 3.05 mm 3.1 mm 1.2 mm 3.05 mm 3.1 mm
速度 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz
最大供电电压 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
最小供电电压 3 V 3 V 3 V 3 V 3 V 3 V 3 V
标称供电电压 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL EXTENDED COMMERCIAL EXTENDED COMMERCIAL EXTENDED COMMERCIAL EXTENDED COMMERCIAL EXTENDED COMMERCIAL EXTENDED COMMERCIAL EXTENDED
端子形式 GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
端子节距 0.65 mm 0.5 mm 0.5 mm 0.65 mm 0.5 mm 0.5 mm 0.65 mm
端子位置 QUAD QUAD QUAD QUAD QUAD QUAD QUAD
宽度 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm
uPs/uCs/外围集成电路类型 MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER
是否无铅 含铅 含铅 含铅 - 含铅 含铅 含铅
是否Rohs认证 不符合 不符合 不符合 - 不符合 不符合 不符合
JESD-609代码 e0 e0 e0 - e0 e0 e0
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
认证状态 Not Qualified Not Qualified Not Qualified - Not Qualified Not Qualified Not Qualified
端子面层 TIN LEAD TIN LEAD TIN LEAD - TIN LEAD TIN LEAD TIN LEAD
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Base Number Matches 1 1 1 1 1 - -
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