型号
- 型号
- 关键词
| 型号 | HI3-0301-5 | HI2-0301-2 | HI2-0301-5 | HI9P-0303-9 | HI9P-0303-5 | HI1-0301-2 | HI3-0307-5 | HI1-0301-5 | HI1-0307-2 |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | IC,ANALOG SWITCH,SINGLE,SPDT,CMOS,DIP,14PIN,PLASTIC | IC,ANALOG SWITCH,SINGLE,SPDT,CMOS,CAN,10PIN,METAL | IC,ANALOG SWITCH,SINGLE,SPDT,CMOS,CAN,10PIN,METAL | IC DUAL 1-CHANNEL, SGL POLE DOUBLE THROW SWITCH, PDSO14, Multiplexer or Switch | IC DUAL 1-CHANNEL, SGL POLE DOUBLE THROW SWITCH, PDSO14, Multiplexer or Switch | IC,ANALOG SWITCH,SINGLE,SPDT,CMOS,DIP,14PIN,CERAMIC | IC,ANALOG SWITCH,DUAL,SPDT,CMOS,DIP,14PIN,PLASTIC | HI1-0301-5 | IC,ANALOG SWITCH,DUAL,SPDT,CMOS,DIP,14PIN,CERAMIC |
| Reach Compliance Code | _compli | not_compliant | not_compliant | unknown | unknown | not_compliant | not_compliant | not_compliant | not_compliant |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | - | - | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Renesas(瑞萨电子) | Renesas(瑞萨电子) | - | - | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) |
| 模拟集成电路 - 其他类型 | SPDT | SPDT | SPDT | SPDT | SPDT | SPDT | SPDT | SPDT | - |
| JESD-30 代码 | R-PDIP-T14 | O-MBCY-W10 | O-MBCY-W10 | R-PDSO-G14 | R-PDSO-G14 | R-XDIP-T14 | R-PDIP-T14 | R-XDIP-T14 | - |
| JESD-609代码 | e0 | e0 | e0 | - | - | e0 | e0 | e0 | - |
| 标称负供电电压 (Vsup) | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V | - |
| 功能数量 | 1 | 1 | 1 | 2 | 2 | 1 | 2 | 1 | - |
| 端子数量 | 14 | 10 | 10 | 14 | 14 | 14 | 14 | 14 | - |
| 最大通态电阻 (Ron) | 75 Ω | 75 Ω | 75 Ω | 50 Ω | 50 Ω | 75 Ω | 75 Ω | 75 Ω | - |
| 最高工作温度 | 70 °C | 125 °C | 70 °C | 85 °C | 75 °C | 125 °C | 70 °C | 70 °C | - |
| 封装主体材料 | PLASTIC/EPOXY | METAL | METAL | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | CERAMIC | - |
| 封装等效代码 | DIP14,.3 | CAN10,.23 | CAN10,.23 | - | - | DIP14,.3 | DIP14,.3 | DIP14,.3 | - |
| 封装形状 | RECTANGULAR | ROUND | ROUND | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | IN-LINE | CYLINDRICAL | CYLINDRICAL | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE | - |
| 电源 | +-15 V | +-15 V | +-15 V | - | - | +-15 V | +-15 V | +-15 V | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 标称供电电压 (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | - |
| 表面贴装 | NO | - | - | YES | YES | NO | NO | NO | - |
| 最长接通时间 | 300 ns | 300 ns | 300 ns | 300 ns | 300 ns | 300 ns | 250 ns | 300 ns | - |
| 切换 | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | - | - | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | - |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | - |
| 温度等级 | COMMERCIAL | MILITARY | COMMERCIAL | INDUSTRIAL | COMMERCIAL EXTENDED | MILITARY | COMMERCIAL | COMMERCIAL | - |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| 端子形式 | THROUGH-HOLE | WIRE | WIRE | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | - |
| 端子位置 | DUAL | BOTTOM | BOTTOM | DUAL | DUAL | DUAL | DUAL | DUAL | - |
FPGA/CPLD
RF/无线
模拟电子
WindowsCE
EE_FPGA学习乐园
PCB设计