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L6613A
IN
Data
L6613, IS
Sheet
12A, IS
2, ISL66 4, ISL6614A
ISL661
ISL661
®
HIP6602B
July 22, 2005
FN9076.5
Dual Channel Synchronous Rectified
Buck MOSFET Driver
The HIP6602B is a high frequency, two power channel
MOSFET driver specifically designed to drive four power
N-Channel MOSFETs in a synchronous rectified buck
converter topology. This device is available in either a
14-lead SOIC or a 16-lead QFN package with a PAD to
thermally enhance the package. These drivers combined
with a HIP63xx or ISL65xx series of Multi-Phase Buck PWM
controllers and MOSFETs form a complete core voltage
regulator solution for advanced microprocessors.
The HIP6602B drives both upper and lower gates over a
range of 5V to 12V. This drive-voltage flexibility provides the
advantage of optimizing applications involving trade-offs
between switching losses and conduction losses.
The output drivers in the HIP6602B have the capacity to
efficiently switch power MOSFETs at high frequencies. Each
driver is capable of driving a 3000pF load with a 30ns
propagation delay and 50ns transition time. This device
implements bootstrapping on the upper gates with a single
external capacitor and resistor required for each power
channel. This reduces implementation complexity and allows
the use of higher performance, cost effective, N-Channel
MOSFETs. Adaptive shoot-through protection is integrated
to prevent both MOSFETs from conducting simultaneously.
Features
• Drives Four N-Channel MOSFETs
• Adaptive Shoot-Through Protection
• Internal Bootstrap Devices
• Supports High Switching Frequency
- Fast Output Rise Time
- Propagation Delay 30ns
• Small 14-Lead SOIC Package
• Smaller 16-Lead QFN Thermally Enhanced Package
• 5V to 12V Gate-Drive Voltages for Optimal Efficiency
• Three-State Input for Bridge Shutdown
• Supply Undervoltage Protection
• Pb-Free Plus Anneal Available (RoHS Compliant)
• QFN Package:
- Compliant to JEDEC PUB95 MO-220
QFN - Quad Flat No Leads - Package Outline
- Near Chip Scale Package footprint, which improves
PCB efficiency and has a thinner profile
Applications
• Core Voltage Supplies for Intel Pentium® III and AMD®
Athlon
TM
Microprocessors.
Ordering Information
PART NUMBER
HIP6602BCB
HIP6602BCB-T
HIP6602BCBZ (Note 1)
HIP6602BCBZ-T (Note 1)
HIP6602BCR
HIP6602BCR-T
HIP6602BCRZ (Note 1)
HIP6602BCRZ-T (Note 1)
HIP6602BCRZA (Note 1)
TEMP.
RANGE (°C)
0 to 85
PACKAGE
14 Ld SOIC
PKG.
DWG. #
M14.15
• High-Frequency, Low-Profile DC/DC Converters
• High-Current, Low-Voltage DC/DC Converters
14 Ld SOIC Tape and Reel
0 to 85
14 Ld SOIC
(Pb-Free)
M14.15
14 Ld SOIC Tape and Reel (Pb-Free)
0 to 85
16 Ld 5x5 QFN
L16.5x5
16 Ld 5x5 QFN Tape and Reel
0 to 85
16 Ld 5x5 QFN
(Pb-Free)
L16.5x5
16 Ld 5x5 QFN Tape and Reel (Pb-Free)
0 to 85
16 Ld 5x5 QFN
(Pb-Free)
L16.5x5
HIP6602BCRZA-T (Note 1) 16 Ld 5x5 QFN Tape and Reel (Pb-Free)
NOTE:
1. Intersil Pb-free plus anneal products employ special Pb-free
material sets; molding compounds/die attach materials and 100%
matte tin plate termination finish, which are RoHS compliant and
compatible with both SnPb and Pb-free soldering operations.
Intersil Pb-free products are MSL classified at Pb-free peak reflow
temperatures that meet or exceed the Pb-free requirements of
IPC/JEDEC J STD-020.
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774
|
Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2002-2005. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
1
HIP6602B
Pinouts
HIP6602B (SOIC)
TOP VIEW
PWM1
PWM2
GND
LGATE1
PVCC
PGND
LGATE2
1
2
3
4
5
6
7
14 VCC
13 PHASE1
12 UGATE1
11 BOOT1
10 BOOT2
9 UGATE2
8 PHASE2
GND 1
LG1 2
PVCC 3
PGND 4
5
NC
6
LG2
7
PHASE2
8
NC
HIP6602 (16 LD QFN)
TOP VIEW
PHASE1
13
12 UG1
11 BOOT1
10 BOOT2
9
UG2
PWM2
PWM1
15
16
Block Diagram
PVCC
BOOT1
UGATE1
VCC
+5V
SHOOT-
THROUGH
PROTECTION
PHASE1
10K
PWM1
PVCC
10K
LGATE1
PGND
+5V
CONTROL
LOGIC
PVCC
PGND
BOOT2
UGATE2
10K
PWM2
10K
GND
SHOOT-
THROUGH
PROTECTION
PHASE2
PVCC
HIP6602B
PGND
PAD
LGATE2
For HIP6602BCR, the PAD on the bottom side of the
package MUST be soldered to the PC board
2
VCC
14
FN9076.5
July 22, 2005
HIP6602B
Typical Application - 2 Channel Converter Using a HIP6302 and a HIP6602B Gate Driver
+5V
+12V
BOOT1
+12V
FB
VSEN
COMP
VCC
V
CC
ISEN1
UGATE1
PHASE1
PGOOD
PWM1
MAIN
CONTROL
HIP6302
PWM1
DUAL
DRIVER
HIP6602B
LGATE1
+V
CORE
+5V/12V
BOOT2
+12V
PVCC
VID
PWM2
ISEN2
PWM2
UGATE2
PHASE2
LGATE2
FS/DIS
GND
GND
PGND
3
FN9076.5
July 22, 2005
HIP6602B
Typical Application - 4 Channel Converter Using a HIP6303 and HIP6602B Gate Driver
+12V
BOOT1
+12V
UGATE1
VCC
PHASE1
LGATE1
+5V
DUAL
DRIVER
HIP6602B
FB
VSEN
COMP
V
CC
UGATE2
ISEN1
PGOOD
EN
PWM1
PWM2
MAIN ISEN2
CONTROL
HIP6303
PWM1
PWM2
LGATE2
PHASE2
PVCC
+5V/12V
BOOT2
+12V
GND
PGND
VID
+V
CORE
ISEN3
FS/DIS
PWM3
PWM4
GND
ISEN4
UGATE3
VCC
PHASE3
+12V
BOOT3
+12V
LGATE3
DUAL
DRIVER
HIP6602B
PVCC
+5V/12V
BOOT4
+12V
UGATE4
PWM3
PWM4
LGATE4
PHASE4
GND
PGND
4
FN9076.5
July 22, 2005
单片机
