HM23C1025E,HM23C1025E pdf中文资料,HM23C1025E引脚图,HM23C1025E电路-Datasheet-电子工程世界

器件参数

参数名称

属性值

厂商名称

Hualon Microelectronics Corp

零件包装代码

DIP

包装说明

DIP,

针数

Reach Compliance Code

unknow

ECCN代码

EAR99

最长访问时间

150 ns

其他特性

PIN COMPATIBLE WITH 27C010

JESD-30 代码

R-PDIP-T32

内存密度

1048576 bi

内存集成电路类型

MASK ROM

内存宽度

功能数量

端子数量

字数

131072 words

字数代码

128000

工作模式

ASYNCHRONOUS

最高工作温度

70 °C

最低工作温度

组织

128KX8

输出特性

3-STATE

封装主体材料

PLASTIC/EPOXY

封装代码

DIP

封装形状

RECTANGULAR

封装形式

IN-LINE

并行/串行

PARALLEL

认证状态

Not Qualified

最大供电电压 (Vsup)

5.5 V

最小供电电压 (Vsup)

4.5 V

标称供电电压 (Vsup)

5 V

表面贴装

技术

CMOS

温度等级

COMMERCIAL

端子形式

THROUGH-HOLE

端子位置

DUAL

参数对比

与HM23C1025E相近的元器件有：HM23C1025AEM、HM23C1025AM、HM23C1025EM、HM23C1025M、HM23C1025、HM23C1025A、HM23C1025AE。描述及对比如下：

型号	HM23C1025E	HM23C1025AEM	HM23C1025AM	HM23C1025EM	HM23C1025M	HM23C1025	HM23C1025A	HM23C1025AE
描述	MASK ROM, 128KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32	MASK ROM, 128KX8, 150ns, CMOS, PDSO32, 0.450 INCH, PLASTIC, SOP-32	MASK ROM, 128KX8, 150ns, CMOS, PDSO32, 0.450 INCH, PLASTIC, SOP-32	MASK ROM, 128KX8, 150ns, CMOS, PDSO32, 0.450 INCH, PLASTIC, SOP-32	MASK ROM, 128KX8, 150ns, CMOS, PDSO32, 0.450 INCH, PLASTIC, SOP-32	MASK ROM, 128KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32	MASK ROM, 128KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32	MASK ROM, 128KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32
厂商名称	Hualon Microelectronics Corp	Hualon Microelectronics Corp	Hualon Microelectronics Corp	Hualon Microelectronics Corp	Hualon Microelectronics Corp	Hualon Microelectronics Corp	Hualon Microelectronics Corp	Hualon Microelectronics Corp
零件包装代码	DIP	SOIC	SOIC	SOIC	SOIC	DIP	DIP	DIP
包装说明	DIP,	SOP,	SOP,	SOP,	SOP,	DIP,	DIP,	DIP,
针数	32	32	32	32	32	32	32	32
Reach Compliance Code	unknow	unknow	unknow	unknow	unknow	unknow	unknow	unknow
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
最长访问时间	150 ns	150 ns	150 ns	150 ns	150 ns	150 ns	150 ns	150 ns
JESD-30 代码	R-PDIP-T32	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32	R-PDIP-T32	R-PDIP-T32	R-PDIP-T32
内存密度	1048576 bi	1048576 bi	1048576 bi	1048576 bi	1048576 bi	1048576 bi	1048576 bi	1048576 bi
内存集成电路类型	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM
内存宽度	8	8	8	8	8	8	8	8
功能数量	1	1	1	1	1	1	1	1
端子数量	32	32	32	32	32	32	32	32
字数	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words
字数代码	128000	128000	128000	128000	128000	128000	128000	128000
工作模式	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
组织	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8
输出特性	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	DIP	SOP	SOP	SOP	SOP	DIP	DIP	DIP
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	IN-LINE	IN-LINE	IN-LINE
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	NO	YES	YES	YES	YES	NO	NO	NO
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
端子形式	THROUGH-HOLE	GULL WING	GULL WING	GULL WING	GULL WING	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
其他特性	PIN COMPATIBLE WITH 27C010	AUTOMATIC POWER-DOWN; PIN COMPATIBLE WITH 27C010	AUTOMATIC POWER-DOWN	PIN COMPATIBLE WITH 27C010	-	-	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN; PIN COMPATIBLE WITH 27C010