型号 | HV0923X | RBHV0923DJ | HV0923DJ | HV0923PJ |
---|---|---|---|---|
描述 | AC Plasma Driver, 32-Segment, CMOS, 5.02 X 5.84 MM, DIE-44 | AC Plasma Driver, 32-Segment, CMOS, CQCC44, CERAMIC, QCC-44 | AC Plasma Driver, 32-Segment, CMOS, CQCC44, CERAMIC, QCC-44 | AC Plasma Driver, 32-Segment, CMOS, PQCC44, PLASTIC, QCC-44 |
厂商名称 | Supertex | Supertex | Supertex | Supertex |
零件包装代码 | DIE | LCC | LCC | LCC |
包装说明 | DIE, | QCCJ, | QCCJ, | QCCJ, |
针数 | 44 | 44 | 44 | 44 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
数据输入模式 | SERIAL | SERIAL | SERIAL | SERIAL |
接口集成电路类型 | AC PLASMA DISPLAY DRIVER | AC PLASMA DISPLAY DRIVER | AC PLASMA DISPLAY DRIVER | AC PLASMA DISPLAY DRIVER |
JESD-30 代码 | R-XUUC-N44 | S-CQCC-J44 | S-CQCC-J44 | S-PQCC-J44 |
复用显示功能 | NO | NO | NO | NO |
功能数量 | 1 | 1 | 1 | 1 |
区段数 | 32 | 32 | 32 | 32 |
端子数量 | 44 | 44 | 44 | 44 |
最高工作温度 | 70 °C | 125 °C | 70 °C | 70 °C |
封装主体材料 | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY |
封装代码 | DIE | QCCJ | QCCJ | QCCJ |
封装形状 | RECTANGULAR | SQUARE | SQUARE | SQUARE |
封装形式 | UNCASED CHIP | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大供电电压 | 13.2 V | 13.2 V | 13.2 V | 13.2 V |
最小供电电压 | 10.8 V | 10.8 V | 10.8 V | 10.8 V |
标称供电电压 | 12 V | 12 V | 12 V | 12 V |
电源电压1-最大 | 230 V | 230 V | 230 V | 230 V |
表面贴装 | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL |
端子形式 | NO LEAD | J BEND | J BEND | J BEND |
端子位置 | UPPER | QUAD | QUAD | QUAD |
最小 fmax | 4 MHz | 4 MHz | 4 MHz | 4 MHz |
是否Rohs认证 | - | 不符合 | 不符合 | 不符合 |
长度 | - | 16.51 mm | 16.51 mm | 16.5862 mm |
湿度敏感等级 | - | 1 | 1 | 1 |
峰值回流温度(摄氏度) | - | 225 | 225 | 225 |
座面最大高度 | - | 4.9276 mm | 4.9276 mm | 4.57 mm |
端子节距 | - | 1.27 mm | 1.27 mm | 1.27 mm |
处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | - | 16.51 mm | 16.51 mm | 16.5862 mm |