型号
- 型号
- 关键词
| 型号 | HYB25M288180C-745 | HYB25R288180C-745 | HYB25M288180C-653 | HYB25R288180C-653 | HYB25R288180C-840 | HYB25R288180C-845 | HYB25M288180C-845 | HYB25M288180C-840 |
|---|---|---|---|---|---|---|---|---|
| 描述 | Rambus DRAM, 16MX18, 45ns, CMOS, PBGA62, FBGA-62 | Rambus DRAM, 16MX18, 45ns, CMOS, PBGA62, FBGA-62 | Rambus DRAM, 16MX18, 53ns, CMOS, PBGA62, FBGA-62 | Rambus DRAM, 16MX18, 53ns, CMOS, PBGA62, FBGA-62 | Rambus DRAM, 16MX18, 40ns, CMOS, PBGA62, FBGA-62 | Rambus DRAM, 16MX18, 45ns, CMOS, PBGA62, FBGA-62 | Rambus DRAM, 16MX18, 45ns, CMOS, PBGA62, FBGA-62 | Rambus DRAM, 16MX18, 40ns, CMOS, PBGA62, FBGA-62 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA |
| 包装说明 | TBGA, BGA66,10X13,32 | TBGA, BGA66,10X13,32 | TBGA, BGA66,10X13,32 | FBGA-62 | FBGA-62 | FBGA-62 | FBGA-62 | FBGA-62 |
| 针数 | 62 | 62 | 62 | 62 | 62 | 62 | 62 | 62 |
| Reach Compliance Code | unknown | unknown | unknown | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 访问模式 | BLOCK ORIENTED PROTOCOL | BLOCK ORIENTED PROTOCOL | BLOCK ORIENTED PROTOCOL | BLOCK ORIENTED PROTOCOL | BLOCK ORIENTED PROTOCOL | BLOCK ORIENTED PROTOCOL | BLOCK ORIENTED PROTOCOL | BLOCK ORIENTED PROTOCOL |
| 最长访问时间 | 45 ns | 45 ns | 53 ns | 53 ns | 40 ns | 45 ns | 45 ns | 40 ns |
| 其他特性 | SELF CONTAINED REFRESH | SELF CONTAINED REFRESH | SELF CONTAINED REFRESH | SELF CONTAINED REFRESH | SELF CONTAINED REFRESH | SELF CONTAINED REFRESH | SELF CONTAINED REFRESH | SELF CONTAINED REFRESH |
| 最大时钟频率 (fCLK) | 711 MHz | 711 MHz | 600 MHz | 600 MHz | 800 MHz | 800 MHz | 800 MHz | 800 MHz |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | R-PBGA-B62 | R-PBGA-B62 | R-PBGA-B62 | R-PBGA-B62 | R-PBGA-B62 | R-PBGA-B62 | R-PBGA-B62 | R-PBGA-B62 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 11 mm | 11 mm | 11 mm | 11 mm | 11 mm | 11 mm | 11 mm | 11 mm |
| 内存密度 | 301989888 bit | 301989888 bit | 301989888 bit | 301989888 bit | 301989888 bit | 301989888 bit | 301989888 bit | 301989888 bit |
| 内存集成电路类型 | RAMBUS DRAM | RAMBUS DRAM | RAMBUS DRAM | RAMBUS DRAM | RAMBUS DRAM | RAMBUS DRAM | RAMBUS DRAM | RAMBUS DRAM |
| 内存宽度 | 18 | 18 | 18 | 18 | 18 | 18 | 18 | 18 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 62 | 62 | 62 | 62 | 62 | 62 | 62 | 62 |
| 字数 | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words |
| 字数代码 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 组织 | 16MX18 | 16MX18 | 16MX18 | 16MX18 | 16MX18 | 16MX18 | 16MX18 | 16MX18 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TBGA | TBGA | TBGA | TBGA | TBGA | TBGA | TBGA | TBGA |
| 封装等效代码 | BGA66,10X13,32 | BGA66,10X13,32 | BGA66,10X13,32 | BGA66,10X13,32 | BGA66,10X13,32 | BGA66,10X13,32 | BGA66,10X13,32 | BGA66,10X13,32 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY, THIN PROFILE | GRID ARRAY, THIN PROFILE | GRID ARRAY, THIN PROFILE | GRID ARRAY, THIN PROFILE | GRID ARRAY, THIN PROFILE | GRID ARRAY, THIN PROFILE | GRID ARRAY, THIN PROFILE | GRID ARRAY, THIN PROFILE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 1.8/2.5,2.5 V | 1.8/2.5,2.5 V | 1.8/2.5,2.5 V | 1.8/2.5,2.5 V | 1.8/2.5,2.5 V | 1.8/2.5,2.5 V | 1.8/2.5,2.5 V | 1.8/2.5,2.5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.05 mm | 1.05 mm | 1.05 mm | 1.05 mm | 1.05 mm | 1.05 mm | 1.05 mm | 1.05 mm |
| 自我刷新 | YES | YES | YES | YES | YES | YES | YES | YES |
| 最大供电电压 (Vsup) | 2.63 V | 2.63 V | 2.63 V | 2.63 V | 2.63 V | 2.63 V | 2.63 V | 2.63 V |
| 最小供电电压 (Vsup) | 2.37 V | 2.37 V | 2.37 V | 2.37 V | 2.37 V | 2.37 V | 2.37 V | 2.37 V |
| 标称供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
| 端子节距 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 10.5 mm | 10.5 mm | 10.5 mm | 10.5 mm | 10.5 mm | 10.5 mm | 10.5 mm | 10.5 mm |
| 厂商名称 | Infineon(英飞凌) | - | Infineon(英飞凌) | Infineon(英飞凌) | Infineon(英飞凌) | Infineon(英飞凌) | Infineon(英飞凌) | Infineon(英飞凌) |