Bus Driver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, CQCC20, LCC-20
厂商名称:IDT (Integrated Device Technology)
下载文档型号 | IDT54FCT373CTLB | IDT54FCT373TDB | IDT54FCT373TLB | IDT54FCT373ATDB | IDT54FCT373ATE | IDT54FCT373TE | IDT54FCT373TD | IDT54FCT373CTE | IDT54FCT373CTD | IDT54FCT373ATD |
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描述 | Bus Driver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, CQCC20, LCC-20 | Bus Driver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, CDIP20, CERAMIC, DIP-20 | Bus Driver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, CQCC20, LCC-20 | Bus Driver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, CDIP20, CERAMIC, DIP-20 | Bus Driver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, CDFP20, CERPACK-20 | Bus Driver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, CDFP20, CERPACK-20 | Bus Driver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, CDIP20, CERDIP-20 | Bus Driver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, CDFP20, CERPACK-20 | Bus Driver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, CDIP20, CERDIP-20 | Bus Driver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, CDIP20, CERDIP-20 |
零件包装代码 | QLCC | DIP | QLCC | DIP | DFP | DFP | DIP | DFP | DIP | DIP |
包装说明 | QCCN, LCC20,.35SQ | DIP, DIP20,.3 | QCCN, LCC20,.35SQ | DIP, DIP20,.3 | CERPACK-20 | DFP, | CERDIP-20 | CERPACK-20 | DIP, | DIP, |
针数 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
Reach Compliance Code | not_compliant | _compli | not_compliant | not_compliant | unknown | unknown | unknown | unknown | unknown | unknown |
系列 | FCT | FCT | FCT | FCT | FCT | FCT | FCT | FCT | FCT | FCT |
JESD-30 代码 | S-CQCC-N20 | R-GDIP-T20 | S-CQCC-N20 | R-GDIP-T20 | R-GDFP-F20 | R-GDFP-F20 | R-GDIP-T20 | R-GDFP-F20 | R-GDIP-T20 | R-GDIP-T20 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
位数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
封装代码 | QCCN | DIP | QCCN | DIP | DFP | DFP | DIP | DFP | DIP | DIP |
封装形状 | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | CHIP CARRIER | IN-LINE | CHIP CARRIER | IN-LINE | FLATPACK | FLATPACK | IN-LINE | FLATPACK | IN-LINE | IN-LINE |
传播延迟(tpd) | 8 ns | 15 ns | 15 ns | 9.8 ns | 9.8 ns | 15 ns | 15 ns | 8 ns | 8 ns | 9.8 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 2.54 mm | 5.08 mm | 2.54 mm | 5.08 mm | 2.337 mm | 2.337 mm | 5.08 mm | 2.337 mm | 5.08 mm | 5.08 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | NO | YES | NO | YES | YES | NO | YES | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn63Pb37) | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
端子形式 | NO LEAD | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | FLAT | FLAT | THROUGH-HOLE | FLAT | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm |
端子位置 | QUAD | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | 8.89 mm | 7.62 mm | 8.89 mm | 7.62 mm | 6.9215 mm | 6.9215 mm | 7.62 mm | 6.9215 mm | 7.62 mm | 7.62 mm |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | 3A001.A.2.C | 3A001.A.2.C | - | 3A001.A.2.C | - | - |
长度 | 8.89 mm | 25.3365 mm | 8.89 mm | 25.3365 mm | - | - | 25.3365 mm | - | 25.3365 mm | 25.3365 mm |
厂商名称 | - | - | - | - | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |