Dual-Port SRAM, 64KX36, 15ns, CMOS, PQFP208, 28 X 28 MM, 3.50 MM HEIGHT, GREEN, PLASTIC, QFP-208
器件类别:存储
厂商名称:IDT (Integrated Device Technology)
器件标准:
下载文档型号 | IDT70V3589S133DRGI | IDT70V3589S133DRGI8 | IDT70V3599S133BFGI | IDT70V3599S133BFGI8 | IDT70V3599S133BCGI | IDT70V3599S166DRG | IDT70V3599S166BFG8 | IDT70V3589S133DRG | IDT70V3589S133DRG8 | IDT70V3599S133DRGI |
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描述 | Dual-Port SRAM, 64KX36, 15ns, CMOS, PQFP208, 28 X 28 MM, 3.50 MM HEIGHT, GREEN, PLASTIC, QFP-208 | Application Specific SRAM, 64KX36, 4.2ns, CMOS, PQFP208 | Dual-Port SRAM, 128KX36, 15ns, CMOS, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, GREEN, FBGA-208 | Dual-Port SRAM, 128KX36, 15ns, CMOS, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FBGA-208 | Dual-Port SRAM, 128KX36, 15ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, GREEN, BGA-256 | Dual-Port SRAM, 128KX36, 12ns, CMOS, PQFP208, 28 X 28 MM, 3.50 MM HEIGHT, GREEN, PLASTIC, QFP-208 | Dual-Port SRAM, 128KX36, 12ns, CMOS, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FBGA-208 | Dual-Port SRAM, 64KX36, 15ns, CMOS, PQFP208, 28 X 28 MM, 3.50 MM HEIGHT, GREEN, PLASTIC, QFP-208 | Application Specific SRAM, 64KX36, 4.2ns, CMOS, PQFP208 | Dual-Port SRAM, 128KX36, 15ns, CMOS, PQFP208, 28 X 28 MM, 3.50 MM HEIGHT, GREEN, PLASTIC, QFP-208 |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
ECCN代码 | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
最长访问时间 | 15 ns | 4.2 ns | 15 ns | 15 ns | 15 ns | 12 ns | 12 ns | 15 ns | 4.2 ns | 15 ns |
最大时钟频率 (fCLK) | 133 MHz | 133 MHz | 133 MHz | 133 MHz | 133 MHz | 166 MHz | 166 MHz | 133 MHz | 133 MHz | 133 MHz |
I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 代码 | S-PQFP-G208 | S-PQFP-G208 | S-PBGA-B208 | S-PBGA-B208 | S-PBGA-B256 | S-PQFP-G208 | S-PBGA-B208 | S-PQFP-G208 | S-PQFP-G208 | S-PQFP-G208 |
JESD-609代码 | e3 | e3 | e1 | e1 | e1 | e3 | e1 | e3 | e3 | e3 |
内存密度 | 2359296 bit | 2359296 bit | 4718592 bit | 4718592 bit | 4718592 bit | 4718592 bit | 4718592 bit | 2359296 bit | 2359296 bit | 4718592 bit |
内存集成电路类型 | DUAL-PORT SRAM | APPLICATION SPECIFIC SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM | APPLICATION SPECIFIC SRAM | DUAL-PORT SRAM |
内存宽度 | 36 | 36 | 36 | 36 | 36 | 36 | 36 | 36 | 36 | 36 |
湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
端口数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
端子数量 | 208 | 208 | 208 | 208 | 256 | 208 | 208 | 208 | 208 | 208 |
字数 | 65536 words | 65536 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 65536 words | 65536 words | 131072 words |
字数代码 | 64000 | 64000 | 128000 | 128000 | 128000 | 128000 | 128000 | 64000 | 64000 | 128000 |
工作模式 | SYNCHRONOUS | ASYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | ASYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 70 °C | 70 °C | 70 °C | 70 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | - | - | - | - | -40 °C |
组织 | 64KX36 | 64KX36 | 128KX36 | 128KX36 | 128KX36 | 128KX36 | 128KX36 | 64KX36 | 64KX36 | 128KX36 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | FQFP | QFP | LFBGA | LFBGA | LBGA | FQFP | LFBGA | FQFP | QFP | FQFP |
封装等效代码 | QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | BGA208,17X17,32 | BGA208,17X17,32 | BGA256,16X16,40 | QFP208,1.2SQ,20 | BGA208,17X17,32 | QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | QFP208,1.2SQ,20 |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | FLATPACK, FINE PITCH | FLATPACK | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE | FLATPACK, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | FLATPACK, FINE PITCH | FLATPACK | FLATPACK, FINE PITCH |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
电源 | 2.5/3.3,3.3 V | 2.5/3.3,3.3 V | 2.5/3.3,3.3 V | 2.5/3.3,3.3 V | 2.5/3.3,3.3 V | 2.5/3.3,3.3 V | 2.5/3.3,3.3 V | 2.5/3.3,3.3 V | 2.5/3.3,3.3 V | 2.5/3.3,3.3 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大待机电流 | 0.04 A | 0.04 A | 0.04 A | 0.04 A | 0.04 A | 0.03 A | 0.03 A | 0.03 A | 0.03 A | 0.04 A |
最小待机电流 | 3.15 V | 3.15 V | 3.15 V | 3.15 V | 3.15 V | 3.15 V | 3.15 V | 3.15 V | 3.15 V | 3.15 V |
最大压摆率 | 0.48 mA | 0.48 mA | 0.48 mA | 0.48 mA | 0.48 mA | 0.5 mA | 0.5 mA | 0.4 mA | 0.4 mA | 0.48 mA |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL |
端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Matte Tin (Sn) | Tin/Silver/Copper (Sn/Ag/Cu) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
端子形式 | GULL WING | GULL WING | BALL | BALL | BALL | GULL WING | BALL | GULL WING | GULL WING | GULL WING |
端子节距 | 0.5 mm | 0.5 mm | 0.8 mm | 0.8 mm | 1 mm | 0.5 mm | 0.8 mm | 0.5 mm | 0.5 mm | 0.5 mm |
端子位置 | QUAD | QUAD | BOTTOM | BOTTOM | BOTTOM | QUAD | BOTTOM | QUAD | QUAD | QUAD |
处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
零件包装代码 | QFP | - | BGA | BGA | BGA | QFP | BGA | QFP | - | QFP |
包装说明 | FQFP, QFP208,1.2SQ,20 | QFP, QFP208,1.2SQ,20 | LFBGA, BGA208,17X17,32 | LFBGA, BGA208,17X17,32 | LBGA, BGA256,16X16,40 | FQFP, QFP208,1.2SQ,20 | LFBGA, BGA208,17X17,32 | FQFP, QFP208,1.2SQ,20 | - | FQFP, QFP208,1.2SQ,20 |
针数 | 208 | - | 208 | 208 | 256 | 208 | 208 | 208 | - | 208 |
其他特性 | PIPELINED OR FLOW-THROUGH ARCHITECTURE | - | PIPELINED OR FLOW-THROUGH ARCHITECTURE | FLOW-THROUGH OR PIPELINED ARCHITECTURE | PIPELINED OR FLOW-THROUGH ARCHITECTURE | PIPELINED OR FLOW-THROUGH ARCHITECTURE | FLOW-THROUGH OR PIPELINED ARCHITECTURE | PIPELINED OR FLOW-THROUGH ARCHITECTURE | - | PIPELINED OR FLOW-THROUGH ARCHITECTURE |
长度 | 28 mm | - | 15 mm | 15 mm | 17 mm | 28 mm | 15 mm | 28 mm | - | 28 mm |
功能数量 | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 | - | 1 |
座面最大高度 | 4.1 mm | - | 1.7 mm | 1.7 mm | 1.7 mm | 4.1 mm | 1.7 mm | 4.1 mm | - | 4.1 mm |
最大供电电压 (Vsup) | 3.45 V | - | 3.45 V | 3.45 V | 3.45 V | 3.45 V | 3.45 V | 3.45 V | - | 3.45 V |
最小供电电压 (Vsup) | 3.15 V | - | 3.15 V | 3.15 V | 3.15 V | 3.15 V | 3.15 V | 3.15 V | - | 3.15 V |
标称供电电压 (Vsup) | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | - | 3.3 V |
宽度 | 28 mm | - | 15 mm | 15 mm | 17 mm | 28 mm | 15 mm | 28 mm | - | 28 mm |