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IDT71V67603S150PFI8

Cache SRAM, 256KX36, 3.8ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100

器件类别:存储    存储   

厂商名称:IDT (Integrated Device Technology)

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器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
IDT (Integrated Device Technology)
零件包装代码
QFP
包装说明
14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100
针数
100
Reach Compliance Code
not_compliant
ECCN代码
3A991.B.2.A
最长访问时间
3.8 ns
其他特性
PIPELINED ARCHITECTURE
最大时钟频率 (fCLK)
150 MHz
I/O 类型
COMMON
JESD-30 代码
R-PQFP-G100
JESD-609代码
e0
长度
20 mm
内存密度
9437184 bit
内存集成电路类型
CACHE SRAM
内存宽度
36
湿度敏感等级
3
功能数量
1
端子数量
100
字数
262144 words
字数代码
256000
工作模式
SYNCHRONOUS
最高工作温度
85 °C
最低工作温度
-40 °C
组织
256KX36
输出特性
3-STATE
封装主体材料
PLASTIC/EPOXY
封装代码
LQFP
封装等效代码
QFP100,.63X.87
封装形状
RECTANGULAR
封装形式
FLATPACK, LOW PROFILE
并行/串行
PARALLEL
峰值回流温度(摄氏度)
240
电源
3.3 V
认证状态
Not Qualified
座面最大高度
1.6 mm
最大待机电流
0.07 A
最小待机电流
3.14 V
最大压摆率
0.325 mA
最大供电电压 (Vsup)
3.465 V
最小供电电压 (Vsup)
3.135 V
标称供电电压 (Vsup)
3.3 V
表面贴装
YES
技术
CMOS
温度等级
INDUSTRIAL
端子面层
Tin/Lead (Sn85Pb15)
端子形式
GULL WING
端子节距
0.65 mm
端子位置
QUAD
处于峰值回流温度下的最长时间
20
宽度
14 mm
Base Number Matches
1
参数对比
与IDT71V67603S150PFI8相近的元器件有:IDT71V67803S166PFG8、IDT71V67803S166PF8、IDT71V67603S166PFG8、IDT71V67603S166PF8、IDT71V67803S150PFGI8、IDT71V67603S150PF8、IDT71V67603S150PFG8、IDT71V67603S150PFGI8、IDT71V67803S150PFG8。描述及对比如下:
型号 IDT71V67603S150PFI8 IDT71V67803S166PFG8 IDT71V67803S166PF8 IDT71V67603S166PFG8 IDT71V67603S166PF8 IDT71V67803S150PFGI8 IDT71V67603S150PF8 IDT71V67603S150PFG8 IDT71V67603S150PFGI8 IDT71V67803S150PFG8
描述 Cache SRAM, 256KX36, 3.8ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 Cache SRAM, 512KX18, 3.5ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 Cache SRAM, 512KX18, 3.5ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 Cache SRAM, 256KX36, 3.5ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, GREEN, PLASTIC, TQFP-100 Cache SRAM, 256KX36, 3.5ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 Cache SRAM, 512KX18, 3.8ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 Cache SRAM, 256KX36, 3.8ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 Cache SRAM, 256KX36, 3.8ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 Cache SRAM, 256KX36, 3.8ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, GREEN, PLASTIC, TQFP-100 Cache SRAM, 512KX18, 3.8ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100
是否Rohs认证 不符合 符合 不符合 符合 不符合 符合 不符合 符合 符合 符合
零件包装代码 QFP QFP QFP QFP QFP QFP QFP QFP QFP QFP
包装说明 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 LQFP, QFP100,.63X.87 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 LQFP, LQFP, LQFP, QFP100,.63X.87 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 LQFP, QFP100,.63X.87 LQFP, LQFP, QFP100,.63X.87
针数 100 100 100 100 100 100 100 100 100 100
Reach Compliance Code not_compliant compliant not_compliant compliant compliant compliant not_compliant compliant compliant compliant
ECCN代码 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
最长访问时间 3.8 ns 3.5 ns 3.5 ns 3.5 ns 3.5 ns 3.8 ns 3.8 ns 3.8 ns 3.8 ns 3.8 ns
其他特性 PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE
JESD-30 代码 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100
JESD-609代码 e0 e3 e0 e3 e0 e3 e0 e3 e3 e3
长度 20 mm 20 mm 20 mm 20 mm 20 mm 20 mm 20 mm 20 mm 20 mm 20 mm
内存密度 9437184 bit 9437184 bit 9437184 bit 9437184 bit 9437184 bit 9437184 bit 9437184 bit 9437184 bit 9437184 bit 9437184 bit
内存集成电路类型 CACHE SRAM CACHE SRAM CACHE SRAM CACHE SRAM CACHE SRAM CACHE SRAM CACHE SRAM CACHE SRAM CACHE SRAM CACHE SRAM
内存宽度 36 18 18 36 36 18 36 36 36 18
湿度敏感等级 3 3 3 3 3 3 3 3 3 3
功能数量 1 1 1 1 1 1 1 1 1 1
端子数量 100 100 100 100 100 100 100 100 100 100
字数 262144 words 524288 words 524288 words 262144 words 262144 words 524288 words 262144 words 262144 words 262144 words 524288 words
字数代码 256000 512000 512000 256000 256000 512000 256000 256000 256000 512000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 85 °C 70 °C 70 °C 70 °C 70 °C 85 °C 70 °C 70 °C 85 °C 70 °C
组织 256KX36 512KX18 512KX18 256KX36 256KX36 512KX18 256KX36 256KX36 256KX36 512KX18
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 LQFP LQFP LQFP LQFP LQFP LQFP LQFP LQFP LQFP LQFP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) 240 260 240 260 240 260 240 260 260 260
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm
最大供电电压 (Vsup) 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V
最小供电电压 (Vsup) 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL
端子面层 Tin/Lead (Sn85Pb15) Matte Tin (Sn) - annealed Tin/Lead (Sn85Pb15) MATTE TIN TIN LEAD Matte Tin (Sn) - annealed Tin/Lead (Sn85Pb15) Matte Tin (Sn) - annealed MATTE TIN Matte Tin (Sn) - annealed
端子形式 GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
端子节距 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm
端子位置 QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD
处于峰值回流温度下的最长时间 20 30 20 30 20 30 20 30 30 30
宽度 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) - IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
最大时钟频率 (fCLK) 150 MHz 166 MHz 166 MHz - - 150 MHz 150 MHz 150 MHz - 150 MHz
I/O 类型 COMMON COMMON COMMON - - COMMON COMMON COMMON - COMMON
输出特性 3-STATE 3-STATE 3-STATE - - 3-STATE 3-STATE 3-STATE - 3-STATE
封装等效代码 QFP100,.63X.87 QFP100,.63X.87 QFP100,.63X.87 - - QFP100,.63X.87 QFP100,.63X.87 QFP100,.63X.87 - QFP100,.63X.87
电源 3.3 V 3.3 V 3.3 V - - 3.3 V 3.3 V 3.3 V - 3.3 V
最大待机电流 0.07 A 0.05 A 0.05 A - - 0.07 A 0.05 A 0.05 A - 0.05 A
最小待机电流 3.14 V 3.14 V 3.14 V - - 3.14 V 3.14 V 3.14 V - 3.14 V
最大压摆率 0.325 mA 0.34 mA 0.34 mA - - 0.325 mA 0.305 mA 0.305 mA - 0.305 mA
Base Number Matches 1 1 1 1 1 1 1 - - -
是否无铅 - 不含铅 - 不含铅 - 不含铅 - 不含铅 不含铅 不含铅
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E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ
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