型号
- 型号
- 关键词
Speech Synthesizer With RCDG, PDSO28, SOIC-28
器件类别：消费电路
厂商名称：Winbond(华邦电子)
厂商官网：http://www.winbond.com.tw
下载文档| 型号 | ISD1212GI | ISD1210PI | ISD1212PI | ISD1210GI |
|---|---|---|---|---|
| 描述 | Speech Synthesizer With RCDG, PDSO28, SOIC-28 | Speech Synthesizer With RCDG, PDIP28, PLASTIC, DIP-28 | Speech Synthesizer With RCDG, PDIP28, PLASTIC, DIP-28 | Speech Synthesizer With RCDG, PDSO28, SOIC-28 |
| 厂商名称 | Winbond(华邦电子) | Winbond(华邦电子) | Winbond(华邦电子) | Winbond(华邦电子) |
| 零件包装代码 | SOIC | DIP | DIP | SOIC |
| 包装说明 | SOP, | DIP, | DIP, | SOP, |
| 针数 | 28 | 28 | 28 | 28 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| Is Samacsys | N | N | N | N |
| 商用集成电路类型 | SPEECH SYNTHESIZER WITH RCDG | SPEECH SYNTHESIZER WITH RCDG | SPEECH SYNTHESIZER WITH RCDG | SPEECH SYNTHESIZER WITH RCDG |
| JESD-30 代码 | R-PDSO-G28 | R-PDIP-T28 | R-PDIP-T28 | R-PDSO-G28 |
| 长度 | 18.14 mm | 36.83 mm | 36.83 mm | 18.14 mm |
| 端子数量 | 28 | 28 | 28 | 28 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | DIP | DIP | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.54 mm | 4.83 mm | 4.83 mm | 2.54 mm |
| 表面贴装 | YES | NO | NO | YES |
| 端子形式 | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 8.79 mm | 15.24 mm | 15.24 mm | 8.79 mm |
| Base Number Matches | 1 | 1 | 1 | 1 |