型号
- 型号
- 关键词
MASK ROM, 64KX8, 200ns, CMOS, PQCC32
厂商名称：SAMSUNG(三星)
厂商官网：http://www.samsung.com/Products/Semiconductor/
下载文档| 型号 | KM23C512J-20 | KM23C512JI-20 | KM23C512J-15 | KM23C512JI-15 | KM23C512JI-25 |
|---|---|---|---|---|---|
| 描述 | MASK ROM, 64KX8, 200ns, CMOS, PQCC32 | MASK ROM, 64KX8, 200ns, CMOS, PQCC32 | MASK ROM, 64KX8, 150ns, CMOS, PQCC32 | MASK ROM, 64KX8, 150ns, CMOS, PQCC32 | MASK ROM, 64KX8, 250ns, CMOS, PQCC32 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| Objectid | 1164789450 | 1164789453 | 1164789449 | 1164789452 | 1164789454 |
| 包装说明 | QCCJ, LDCC32,.5X.6 | QCCJ, LDCC32,.5X.6 | QCCJ, LDCC32,.5X.6 | QCCJ, LDCC32,.5X.6 | QCCJ, LDCC32,.5X.6 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 200 ns | 200 ns | 150 ns | 150 ns | 250 ns |
| JESD-30 代码 | R-PQCC-J32 | R-PQCC-J32 | R-PQCC-J32 | R-PQCC-J32 | R-PQCC-J32 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
| 内存密度 | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bit |
| 内存集成电路类型 | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 |
| 湿度敏感等级 | 3 | 3 | 3 | 3 | 3 |
| 端子数量 | 32 | 32 | 32 | 32 | 32 |
| 字数 | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words |
| 字数代码 | 64000 | 64000 | 64000 | 64000 | 64000 |
| 最高工作温度 | 70 °C | 85 °C | 70 °C | 85 °C | 85 °C |
| 最低工作温度 | - | -40 °C | - | -40 °C | -40 °C |
| 组织 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ |
| 封装等效代码 | LDCC32,.5X.6 | LDCC32,.5X.6 | LDCC32,.5X.6 | LDCC32,.5X.6 | LDCC32,.5X.6 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大待机电流 | 0.00004 A | 0.00004 A | 0.00004 A | 0.00004 A | 0.00004 A |
| 最大压摆率 | 0.04 mA | 0.04 mA | 0.04 mA | 0.04 mA | 0.04 mA |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND | J BEND | J BEND | J BEND | J BEND |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | 40 | 40 | 40 | 40 | 40 |
