If Military/Aerospace specified devices are required, contact the National Semiconductor Sales Office/Distributors for
availability and specifications.
LF155/6
Supply Voltage
Differential Input Voltage
Input Voltage Range (Note 2)
Output Short Circuit Duration
T
JMAX
H-Package
N-Package
M-Package
Power Dissipation at T
A
= 25˚C (Notes
1, 8)
H-Package (Still Air)
H-Package (400 LF/Min Air Flow)
N-Package
M-Package
Thermal Resistance (Typical)
θ
JA
H-Package (Still Air)
H-Package (400 LF/Min Air Flow)
N-Package
M-Package
(Typical)
θ
JC
H-Package
Storage Temperature Range
Soldering Information (Lead Temp.)
Metal Can Package
Soldering (10 sec.)
Dual-In-Line Package
Soldering (10 sec.)
Small Outline Package
Vapor Phase (60 sec.)
Infrared (15 sec.)
215˚C
220˚C
215˚C
220˚C
260˚C
260˚C
260˚C
300˚C
300˚C
300˚C
23˚C/W
−65˚C to +150˚C
23˚C/W
−65˚C to +150˚C
23˚C/W
−65˚C to +150˚C
160˚C/W
65˚C/W
160˚C/W
65˚C/W
130˚C/W
195˚C/W
160˚C/W
65˚C/W
130˚C/W
195˚C/W
560 mW
1200 mW
400 mW
1000 mW
670 mW
380 mW
400 mW
1000 mW
670 mW
380 mW
150˚C
115˚C
100˚C
100˚C
115˚C
100˚C
100˚C
LF256/7/LF356B
LF355/6/7
±
22V
±
40V
±
20V
Continuous
±
22V
±
40V
±
20V
Continuous
±
18V
±
30V
±
16V
Continuous
See AN-450 “Surface Mounting Methods and Their Effect on Product Reliability” for other methods of
soldering surface mount devices.
ESD tolerance
(100 pF discharged through 1.5kΩ)
1000V
1000V
1000V
DC Electrical Characteristics
(Note 3)
Symbol
V
OS
∆V
OS
/∆T
∆TC/∆V
OS
I
OS
Parameter
Input Offset Voltage
Average TC of Input
Offset Voltage
Change in Average TC
with V
OS
Adjust
Input Offset Current
Conditions
Min
R
S
=50Ω, T
A
=25˚C
Over Temperature
R
S
=50Ω
R
S
=50Ω, (Note 4)
T
J
=25˚C, (Notes 3, 5)
T
J
≤T
HIGH
5
0.5
3
20
20
LF155/6
Typ
3
Max Min
5
7
5
0.5
3
20
1
LF256/7
LF356B
Typ
3
Max Min
5
6.5
5
0.5
3
50
2
LF355/6/7
Typ
3
Max
10
13
mV
mV
µV/˚C
µV/˚C
per mV
pA
nA
Units
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2
LF155/LF156/LF256/LF257/LF355/LF356/LF357
DC Electrical Characteristics
(Note 3)
Symbol
I
B
R
IN
A
VOL
Parameter
Input Bias Current
Input Resistance
Large Signal Voltage
Gain
Output Voltage Swing
Input Common-Mode
Voltage Range
Common-Mode
Rejection Ratio
Supply Voltage
Rejection Ratio
(Note 6)
(Continued)
LF256/7
LF356B
Max Min
100
50
10
12
50
25
200
50
25
10
12
200
25
15
Typ
30
Max Min
100
5
10
12
200
Conditions
Min
T
J
=25˚C, (Notes 3, 5)
T
J
≤T
HIGH
T
J
=25˚C
V
S
=
±
15V, T
A
=25˚C
V
O
=
±
10V, R
L
=2k
Over Temperature
LF155/6
Typ
30
LF355/6/7
Typ
30
Max
200
8
Units
pA
nA
Ω
V/mV
V/mV
V
O
V
CM
CMRR
PSRR
V
S
=
±
15V, R
L
=10k
V
S
=
±
15V, R
L
=2k
V
S
=
±
15V
±
12
±
10
±
11
85
85
±
13
±
12
+15.1
−12
100
100
±
12
±
10
±
11
85
85
±
13
±
12
±
15.1
−12
100
100
±
12
±
10
+10
80
80
±
13
±
12
+15.1
−12
100
100
V
V
V
V
dB
dB
DC Electrical Characteristics
T
A
= T
J
= 25˚C, V
S
=
±
15V
Parameter
Supply
Current
LF155
Typ
2
Max
4
LF355
Typ
2
Max
4
LF156/256/257/356B
Typ
5
Max
7
LF356
Typ
5
Max
10
LF357
Typ
5
Max
10
Units
mA
AC Electrical Characteristics
T
A
= T
J
= 25˚C, V
S
=
±
15V
LF155/355
Symbol
SR
Parameter
Slew Rate
Conditions
Typ
LF155/6:
A
V
=1,
LF357: A
V
=5
GBW
t
s
e
n
Gain Bandwidth Product
Settling Time to 0.01%
Equivalent Input Noise
Voltage
(Note 7)
R
S
=100Ω
f=100 Hz
f=1000 Hz
i
n
Equivalent Input Current
Noise
Input Capacitance
f=100 Hz
f=1000 Hz
25
20
0.01
0.01
3
15
12
0.01
0.01
3
15
12
0.01
0.01
3
pF
2.5
4
5
1.5
5
LF156/256/
356B
Min
7.5
LF156/256/356/
LF356B
Typ
12
50
20
1.5
LF257/357
Units
Typ
V/µs
V/µs
MHz
µs
C
IN
Notes for Electrical Characteristics
Note 1:
The maximum power dissipation for these devices must be derated at elevated temperatures and is dictated by T
JMAX
,
θ
JA
, and the ambient temperature,
T
A
. The maximum available power dissipation at any temperature is P
D
=(T
JMAX
−T
A
)/θ
JA
or the 25˚C P
dMAX
, whichever is less.
Note 2:
Unless otherwise specified the absolute maximum negative input voltage is equal to the negative power supply voltage.
Note 3:
Unless otherwise stated, these test conditions apply:
3
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LF155/LF156/LF256/LF257/LF355/LF356/LF357
Notes for Electrical Characteristics
LF155/156
Supply Voltage, V
S
T
A
T
HIGH
(Continued)
LF256/257
LF356B
LF355/6/7
V
S
=
±
15V
0˚C
≤
T
A
≤
+70˚C
+70˚C
±
15V
≤
V
S
≤
±
20V
−55˚C
≤
T
A
≤
+125˚C
+125˚C
±
15V
≤
V
S
≤
±
20V
−25˚C
≤
T
A
≤
+85˚C
+85˚C
±
15V
≤
V
S
±
20V
0˚C
≤
T
A
≤
+70˚C
+70˚C
and V
OS
, I
B
and I
OS
are measured at V
CM
= 0.
Note 4:
The Temperature Coefficient of the adjusted input offset voltage changes only a small amount (0.5µV/˚C typically) for each mV of adjustment from its original
unadjusted value. Common-mode rejection and open loop voltage gain are also unaffected by offset adjustment.
Note 5:
The input bias currents are junction leakage currents which approximately double for every 10˚C increase in the junction temperature, T
J
. Due to limited
production test time, the input bias currents measured are correlated to junction temperature. In normal operation the junction temperature rises above the ambient
temperature as a result of internal power dissipation, Pd. T
J
= T
A
+
θ
JA
Pd where
θ
JA
is the thermal resistance from junction to ambient. Use of a heat sink is
recommended if input bias current is to be kept to a minimum.
Note 6:
Supply Voltage Rejection is measured for both supply magnitudes increasing or decreasing simultaneously, in accordance with common practice.
Note 7:
Settling time is defined here, for a unity gain inverter connection using 2 kΩ resistors for the LF155/6. It is the time required for the error voltage (the voltage
at the inverting input pin on the amplifier) to settle to within 0.01% of its final value from the time a 10V step input is applied to the inverter. For the LF357, A
V
= −5,
the feedback resistor from output to input is 2kΩ and the output step is 10V (See Settling Time Test Circuit).
Note 8:
Max. Power Dissipation is defined by the package characteristics. Operating the part near the Max. Power Dissipation may cause the part to operate outside
模拟与混合信号
