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LM741AH-MIL

OP-AMP, 4000uV OFFSET-MAX, 1.5MHz BAND WIDTH, MBCY8, METAL CAN-8

器件类别:模拟混合信号IC    放大器电路   

厂商名称:Texas Instruments(德州仪器)

厂商官网:http://www.ti.com.cn/

敬请期待
器件参数
参数名称
属性值
是否无铅
含铅
是否Rohs认证
不符合
厂商名称
Texas Instruments(德州仪器)
零件包装代码
BCY
包装说明
, CAN8,.2
针数
8
Reach Compliance Code
unknown
ECCN代码
EAR99
放大器类型
OPERATIONAL AMPLIFIER
架构
VOLTAGE-FEEDBACK
最大平均偏置电流 (IIB)
0.21 µA
25C 时的最大偏置电流 (IIB)
0.08 µA
标称共模抑制比
95 dB
频率补偿
YES
最大输入失调电压
4000 µV
JESD-30 代码
O-MBCY-W8
JESD-609代码
e0
低-失调
NO
负供电电压上限
-22 V
标称负供电电压 (Vsup)
-15 V
功能数量
1
端子数量
8
最高工作温度
125 °C
最低工作温度
-55 °C
封装主体材料
METAL
封装等效代码
CAN8,.2
封装形状
ROUND
封装形式
CYLINDRICAL
峰值回流温度(摄氏度)
NOT SPECIFIED
电源
+-15 V
认证状态
Not Qualified
筛选级别
MIL-STD-883
最小摆率
0.3 V/us
标称压摆率
0.7 V/us
最大压摆率
2.8 mA
供电电压上限
22 V
标称供电电压 (Vsup)
15 V
表面贴装
NO
技术
BIPOLAR
温度等级
MILITARY
端子面层
Tin/Lead (Sn/Pb)
端子形式
WIRE
端子位置
BOTTOM
处于峰值回流温度下的最长时间
NOT SPECIFIED
标称均一增益带宽
1500 kHz
最小电压增益
10000
参数对比
与LM741AH-MIL相近的元器件有:LM741、LM741W/883、LM741WG/883X、LM741EHC、LM741J/NOPB、LM741J/883C、LM741AJ-14/883、LM741J-14/883、LM741WG/883。描述及对比如下:
型号 LM741AH-MIL LM741 LM741W/883 LM741WG/883X LM741EHC LM741J/NOPB LM741J/883C LM741AJ-14/883 LM741J-14/883 LM741WG/883
描述 OP-AMP, 4000uV OFFSET-MAX, 1.5MHz BAND WIDTH, MBCY8, METAL CAN-8 LM741 Operational Amplifier OP-AMP, 5000uV OFFSET-MAX, 0.25MHz BAND WIDTH, CDFP10, CERAMIC, FLATPAK-10 OP-AMP, 5000uV OFFSET-MAX, 0.25MHz BAND WIDTH, CDSO10, CERAMIC, SOIC-10 OP-AMP, 3000uV OFFSET-MAX, 1.5MHz BAND WIDTH, MBCY8, METAL CAN-8 OP-AMP, 6000uV OFFSET-MAX, 1MHz BAND WIDTH, CDIP8, CERDIP-8 OP-AMP, 6000uV OFFSET-MAX, CDIP8, CERAMIC, DIP-8 OP-AMP, 4000uV OFFSET-MAX, 1.5MHz BAND WIDTH, CDIP14, CERAMIC, DIP-14 OP-AMP, 6000uV OFFSET-MAX, 1MHz BAND WIDTH, CDIP14, CERAMIC, DIP-14 OP-AMP, 5000uV OFFSET-MAX, 0.25MHz BAND WIDTH, CDSO10, CERAMIC, SOIC-10
厂商名称 Texas Instruments(德州仪器) - Texas Instruments(德州仪器) - Texas Instruments(德州仪器) Texas Instruments(德州仪器) Texas Instruments(德州仪器) Texas Instruments(德州仪器) Texas Instruments(德州仪器) Texas Instruments(德州仪器)
零件包装代码 BCY - DFP SOIC BCY DIP DIP DIP DIP SOIC
包装说明 , CAN8,.2 - CERAMIC, PACKAGE-8 CERAMIC, SOIC-10 , DIP, DIP, DIP, DIP14,.3 DIP, DIP14,.3 SOP,
针数 8 - 10 10 8 8 8 14 14 10
Reach Compliance Code unknown - unknown unknown unknown compliant compliant unknown unknown unknown
ECCN代码 EAR99 - EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
放大器类型 OPERATIONAL AMPLIFIER - OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
最大平均偏置电流 (IIB) 0.21 µA - 1.5 µA 0.5 µA 0.08 µA 1.5 µA 1.5 µA 0.21 µA 1.5 µA 1.5 µA
标称共模抑制比 95 dB - 70 dB 70 dB 95 dB 90 dB 90 dB 95 dB 90 dB 70 dB
最大输入失调电压 4000 µV - 6000 µV 5000 µV 3000 µV 6000 µV 6000 µV 4000 µV 6000 µV 6000 µV
JESD-30 代码 O-MBCY-W8 - S-CDFP-F8 R-GDSO-G10 O-MBCY-W8 R-GDIP-T8 R-GDIP-T8 R-GDIP-T14 R-GDIP-T14 R-CDSO-G10
负供电电压上限 -22 V - -22 V -22 V -22 V -22 V -22 V -22 V -22 V -22 V
标称负供电电压 (Vsup) -15 V - -15 V -15 V -15 V -15 V -15 V -15 V -15 V -15 V
功能数量 1 - 1 1 1 1 1 1 1 1
端子数量 8 - 8 10 8 8 8 14 14 10
最高工作温度 125 °C - 125 °C 125 °C 70 °C 125 °C 125 °C 125 °C 125 °C 125 °C
最低工作温度 -55 °C - -55 °C -55 °C - -55 °C -55 °C -55 °C -55 °C -55 °C
封装主体材料 METAL - CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED METAL CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
封装形状 ROUND - SQUARE RECTANGULAR ROUND RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 CYLINDRICAL - FLATPACK SMALL OUTLINE CYLINDRICAL IN-LINE IN-LINE IN-LINE IN-LINE SMALL OUTLINE
认证状态 Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
筛选级别 MIL-STD-883 - MIL-STD-883 MIL-STD-883 - - MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883
标称压摆率 0.7 V/us - 0.2 V/us 0.2 V/us 700 V/us 0.5 V/us 0.5 V/us 0.7 V/us 0.5 V/us 0.2 V/us
供电电压上限 22 V - 22 V 22 V 22 V 22 V 22 V 22 V 22 V 22 V
标称供电电压 (Vsup) 15 V - 15 V 15 V 15 V 15 V 15 V 15 V 15 V 15 V
表面贴装 NO - YES YES NO NO NO NO NO YES
技术 BIPOLAR - BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR
温度等级 MILITARY - MILITARY MILITARY COMMERCIAL MILITARY MILITARY MILITARY MILITARY MILITARY
端子形式 WIRE - FLAT GULL WING WIRE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE GULL WING
端子位置 BOTTOM - DUAL DUAL BOTTOM DUAL DUAL DUAL DUAL DUAL
标称均一增益带宽 1500 kHz - 250 kHz 250 kHz 1500 kHz 1000 kHz - 1500 kHz 1000 kHz 250 kHz
封装代码 - - DFP SOP - DIP DIP DIP DIP SOP
座面最大高度 - - 2.032 mm 2.33 mm - 5.08 mm 5.08 mm 5.08 mm 5.08 mm 2.23 mm
端子节距 - - 1.27 mm 1.27 mm - 2.54 mm 2.54 mm 2.54 mm 2.54 mm 1.27 mm
宽度 - - 6.858 mm 6.12 mm - 7.62 mm 7.62 mm 7.62 mm 7.62 mm 6.12 mm
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