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参数对比

与LP621024DM-70LLQ相近的元器件有：LP621024D-55LLF、LP621024DM-55LLF、LP621024DM-70LLF、LP621024DV-55LLF、LP621024DV-70LLF、LP621024D-70LLF、LP621024DX-70LLF、LP621024DM-70LLFQ、LP621024DX-55LLF。描述及对比如下：

型号	LP621024DM-70LLQ	LP621024D-55LLF	LP621024DM-55LLF	LP621024DM-70LLF	LP621024DV-55LLF	LP621024DV-70LLF	LP621024D-70LLF	LP621024DX-70LLF	LP621024DM-70LLFQ	LP621024DX-55LLF
描述	Standard SRAM, 128KX8, 70ns, CMOS, PDSO32, SOP-32	Standard SRAM, 128KX8, 55ns, CMOS, PDIP32, LEAD FREE, PLASTIC, DIP-32	Standard SRAM, 128KX8, 55ns, CMOS, PDSO32, LEAD FREE, SOP-32	Standard SRAM, 128KX8, 70ns, CMOS, PDSO32, LEAD FREE, SOP-32	Standard SRAM, 128KX8, 55ns, CMOS, PDSO32, 8 X 20 MM, LEAD FREE, TSOP1-32	Standard SRAM, 128KX8, 70ns, CMOS, PDSO32, 8 X 20 MM, LEAD FREE, TSOP1-32	Standard SRAM, 128KX8, 70ns, CMOS, PDIP32, LEAD FREE, PLASTIC, DIP-32	Standard SRAM, 128KX8, 70ns, CMOS, PDSO32, 8 X 13.40 MM, LEAD FREE, TSSOP1-32	Standard SRAM, 128KX8, 70ns, CMOS, PDSO32, LEAD FREE, SOP-32	Standard SRAM, 128KX8, 55ns, CMOS, PDSO32, 8 X 13.40 MM, LEAD FREE, TSSOP1-32
是否Rohs认证	不符合	符合	符合	符合	符合	符合	符合	符合	符合	符合
零件包装代码	SOIC	DIP	SOIC	SOIC	TSOP1	TSOP1	DIP	TSSOP	SOIC	TSSOP
包装说明	SOP,	DIP, DIP32,.6	SOP, SOP32,.56	SOP, SOP32,.56	TSOP1, TSSOP32,.8,20	TSOP1, TSSOP32,.8,20	DIP, DIP32,.6	LSSOP, TSSOP32,.56,20	SOP,	LSSOP, TSSOP32,.56,20
针数	32	32	32	32	32	32	32	32	32	32
Reach Compliance Code	unknown	unknown	unknown	unknow	unknow	unknow	unknown	unknown	unknown	unknown
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
最长访问时间	70 ns	55 ns	55 ns	70 ns	55 ns	70 ns	70 ns	70 ns	70 ns	55 ns
JESD-30 代码	R-PDSO-G32	R-PDIP-T32	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32	R-PDIP-T32	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32
长度	20.45 mm	41.91 mm	20.45 mm	20.45 mm	18.4 mm	18.4 mm	41.91 mm	11.8 mm	20.45 mm	11.8 mm
内存密度	1048576 bit	1048576 bit	1048576 bit	1048576 bi	1048576 bi	1048576 bi	1048576 bit	1048576 bit	1048576 bit	1048576 bit
内存集成电路类型	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
内存宽度	8	8	8	8	8	8	8	8	8	8
功能数量	1	1	1	1	1	1	1	1	1	1
端子数量	32	32	32	32	32	32	32	32	32	32
字数	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words
字数代码	128000	128000	128000	128000	128000	128000	128000	128000	128000	128000
工作模式	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
组织	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	SOP	DIP	SOP	SOP	TSOP1	TSOP1	DIP	LSSOP	SOP	LSSOP
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	SMALL OUTLINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	IN-LINE	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SMALL OUTLINE	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
峰值回流温度（摄氏度）	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
座面最大高度	3 mm	5.33 mm	3 mm	3 mm	1.2 mm	1.2 mm	5.33 mm	1.25 mm	3 mm	1.25 mm
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	YES	NO	YES	YES	YES	YES	NO	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
端子形式	GULL WING	THROUGH-HOLE	GULL WING	GULL WING	GULL WING	GULL WING	THROUGH-HOLE	GULL WING	GULL WING	GULL WING
端子节距	1.27 mm	2.54 mm	1.27 mm	1.27 mm	0.5 mm	0.5 mm	2.54 mm	0.5 mm	1.27 mm	0.5 mm
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
处于峰值回流温度下的最长时间	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
宽度	11.3 mm	15.24 mm	11.3 mm	11.3 mm	8 mm	8 mm	15.24 mm	8 mm	11.3 mm	8 mm
厂商名称	AMICC [AMIC TECHNOLOGY]	AMICC [AMIC TECHNOLOGY]	AMICC [AMIC TECHNOLOGY]	AMICC [AMIC TECHNOLOGY]	AMICC [AMIC TECHNOLOGY]	AMICC [AMIC TECHNOLOGY]	AMICC [AMIC TECHNOLOGY]	AMICC [AMIC TECHNOLOGY]	AMICC [AMIC TECHNOLOGY]	-
是否无铅	-	不含铅	不含铅	不含铅	不含铅	不含铅	不含铅	不含铅	-	不含铅
I/O 类型	-	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	-	COMMON
输出特性	-	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	-	3-STATE
封装等效代码	-	DIP32,.6	SOP32,.56	SOP32,.56	TSSOP32,.8,20	TSSOP32,.8,20	DIP32,.6	TSSOP32,.56,20	-	TSSOP32,.56,20
电源	-	5 V	5 V	5 V	5 V	5 V	5 V	5 V	-	5 V
认证状态	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified
最大待机电流	-	0.00001 A	0.00001 A	0.00001 A	0.00001 A	0.00001 A	0.00001 A	0.00001 A	-	0.00001 A
最小待机电流	-	2 V	2 V	2 V	2 V	2 V	2 V	2 V	-	2 V
最大压摆率	-	0.07 mA	0.07 mA	0.07 mA	0.07 mA	0.07 mA	0.07 mA	0.07 mA	-	0.07 mA