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M24C08-x M24C04-x M24C02-x M24C01-x

8-Kbit, 4-Kbit, 2-Kbit, and 1-Kbit serial I²C bus EEPROM

Datasheet

−

production data

Features

■

Supports both the 100 kHz I

C Standard-mode

and the 400 kHz I

C Fast-mode

Single supply voltage:

– 2.5 V to 5.5 V for M24Cxx-W

– 1.8 V to 5.5 V for M24Cxx

– 1.7 V to 5.5 V for M24Cxx-F

Write Control input

Byte and Page Write (up to 8 bytes)

Random and Sequential Read modes

Self-timed programming cycle

Automatic address incrementing

Enhanced ESD/latch-up protection

More than 1 million write cycles

More than 40-year data retention

Packages:

– SO8, TSSOP8, UFDFPN8: ECOPACK2

(RoHS-compliant and Halogen-free)

– PDIP8: ECOPACK1

(RoHS-compliant)

Device summary

Reference

Part number

M24C08-W

M24C08-x

M24C08-R

M24C08-F

M24C04-W

M24C04-x

M24C04-R

M24C04-F

M24C02-W

M24C02-x

M24C02-R

M24C01-W

M24C01-x

M24C01-R

1. Only M24C08-F devices are offered in the WLCSP

package.

2. Only M24C08-F devices are offered in the Thin

WLCSP package.

PDIP8 (BN)

■

SO8 (MN)

150 mils width

TSSOP8 (DW)

169 mils width

Table 1.

UFDFPN8 (MB, MC)

2 × 3 mm (MLP)

WLCSP (CS)

Thin WLCSP (CT)

July 2012

This is information on a product in full production.

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www.st.com

Contents

M24C08-x M24C04-x M24C02-x M24C01-x

Contents

Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Signal description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

2.1

2.2

2.3

2.4

Serial Clock (SCL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Serial Data (SDA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Chip Enable (E0, E1, E2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

2.3.1

Write Control (WC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Supply voltage (V

) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

2.4.1

2.4.2

2.4.3

2.4.4

Operating supply voltage V

CC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Power-up conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Device reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Power-down conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Device operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

3.1

3.2

3.3

3.4

3.5

3.6

Start condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Stop condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Acknowledge bit (ACK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Data input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Memory addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Write operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

3.6.1

3.6.2

3.6.3

Byte Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Page Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Minimizing system delays by polling on ACK . . . . . . . . . . . . . . . . . . . . . 15

3.7

Read operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

3.7.1

3.7.2

3.7.3

3.7.4

Random Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Current Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Sequential Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Acknowledge in Read mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

2/37

Initial delivery state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

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Contents

Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

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List of tables

M24C08-x M24C04-x M24C02-x M24C01-x

List of tables

Table 1.

Table 2.

Table 3.

Table 4.

Table 5.

Table 6.

Table 7.

Table 8.

Table 9.

Table 10.

Table 11.

Table 12.

Table 13.

Table 14.

Table 15.

Table 16.

Table 17.

Table 18.

Table 19.

Table 20.

Table 21.

Table 22.

Table 23.

Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Device select code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Operating modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Operating conditions (M24Cxx-W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Operating conditions (M24Cxx-R) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Operating conditions (M24Cxx-F) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

DC characteristics (M24Cxx-W, device grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

DC characteristics (M24Cxx-R) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

DC characteristics (M24Cxx-F). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

AC measurement conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Input parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

AC characteristics at 400 kHz (I

C Fast mode) (M24Cxx-W,

M24Cxx-R, M24Cxx-F) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

AC characteristics at 100 kHz (I

C Standard mode) (M24Cxx-W,

M24Cxx-R, M24Cxx-F) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

M24C08: WLCSP (0.5 mm height) 0.4 mm pitch, 5 bumps, package data . . . . . . . . . . . . 26

M24C08: Thin WLCSP (0.3 mm height), 0.4 mm pitch, 5 bumps, package data . . . . . . . . 27

SO8 narrow – 8 lead plastic small outline, 150 mils body width,

package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead

2 x 3 mm, data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

TSSOP8 – 8 lead thin shrink small outline, package mechanical data. . . . . . . . . . . . . . . . 30

PDIP8 – 8 pin plastic DIP, 0.25 mm lead frame, package mechanical data. . . . . . . . . . . . 31

Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

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M24C08-x M24C04-x M24C02-x M24C01-x

List of figures

Figure 1.

Figure 2.

Figure 3.

Figure 4.

Figure 5.

Figure 6.

Figure 7.

Figure 8.

Figure 9.

Figure 10.

Figure 11.

Figure 12.

Figure 13.

Figure 14.

Figure 15.

Figure 16.

Figure 17.

Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

8-pin package connections (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

WLCSP and thin WLCSP connections

(top view, marking side, with balls on the underside) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Device select code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

C Fast mode (f

= 400 kHz): maximum Rbus value versus bus parasitic

capacitance (C

bus

) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

I²C bus protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Write mode sequences with WC = 1 (data write inhibited) . . . . . . . . . . . . . . . . . . . . . . . . . 13

Write mode sequences with WC = 0 (data write enabled) . . . . . . . . . . . . . . . . . . . . . . . . . 15

Write cycle polling flowchart using ACK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Read mode sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

AC measurement I/O waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

WLCSP (0.5 mm) and Thin WLCSP (0.3 mm) 0.4 mm pitch 5 bumps,

package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

SO8 narrow – 8 lead plastic small outline, 150 mils body width, package outline . . . . . . . 28

UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead

2 x 3 mm, outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

TSSOP8 – 8 lead thin shrink small outline, package outline . . . . . . . . . . . . . . . . . . . . . . . 30

PDIP8 – 8 pin plastic DIP, 0.25 mm lead frame, package outline . . . . . . . . . . . . . . . . . . . 31

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参数对比

与M24C04-RMC6TP/S相近的元器件有：M24C04-WMC6TP/S、M24C01-RMC6TP/S、M24C08-FMB5TP/S、M24C04-RMB5TP/S、M24C02-RMC6TP/S、M24C02-RMC5TP/S、M24C01-WMC6TP/S、M24C08-FMC5TP/S。描述及对比如下：

型号	M24C04-RMC6TP/S	M24C04-WMC6TP/S	M24C01-RMC6TP/S	M24C08-FMB5TP/S	M24C04-RMB5TP/S	M24C02-RMC6TP/S	M24C02-RMC5TP/S	M24C01-WMC6TP/S	M24C08-FMC5TP/S
描述	SPI BUS SERIAL EEPROM	SPI BUS SERIAL EEPROM	SPI BUS SERIAL EEPROM	SPI BUS SERIAL EEPROM	SPI BUS SERIAL EEPROM	SPI BUS SERIAL EEPROM	SPI BUS SERIAL EEPROM	SPI BUS SERIAL EEPROM	SPI BUS SERIAL EEPROM
包装说明	HVSON,	HVSON,	HVSON,	HVSON,	,	HVSON,	,	HVSON,	HVSON,
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
内存集成电路类型	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM
串行总线类型	SPI	SPI	SPI	SPI	SPI	SPI	SPI	SPI	SPI
厂商名称	ST(意法半导体)	-	ST(意法半导体)	ST(意法半导体)	ST(意法半导体)	ST(意法半导体)	ST(意法半导体)	ST(意法半导体)	ST(意法半导体)
最大时钟频率 (fCLK)	0.4 MHz	0.4 MHz	0.4 MHz	0.4 MHz	-	0.4 MHz	-	0.4 MHz	0.4 MHz
JESD-30 代码	R-PDSO-N8	R-PDSO-N8	R-PDSO-N8	R-PDSO-N8	-	R-PDSO-N8	-	R-PDSO-N8	R-PDSO-N8
长度	3 mm	3 mm	3 mm	3 mm	-	3 mm	-	3 mm	3 mm
内存密度	4096 bit	4096 bit	1024 bit	8192 bit	-	2048 bit	-	1024 bit	8192 bit
内存宽度	8	8	8	8	-	8	-	8	8
功能数量	1	1	1	1	-	1	-	1	1
端子数量	8	8	8	8	-	8	-	8	8
字数	512 words	512 words	128 words	1024 words	-	256 words	-	128 words	1024 words
字数代码	512	512	128	1000	-	256	-	128	1000
工作模式	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	-	SYNCHRONOUS	-	SYNCHRONOUS	SYNCHRONOUS
最高工作温度	85 °C	85 °C	85 °C	85 °C	-	85 °C	-	85 °C	85 °C
最低工作温度	-40 °C	-40 °C	-40 °C	-20 °C	-	-40 °C	-	-40 °C	-20 °C
组织	512X8	512X8	128X8	1KX8	-	256X8	-	128X8	1KX8
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	HVSON	HVSON	HVSON	HVSON	-	HVSON	-	HVSON	HVSON
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	-	RECTANGULAR	RECTANGULAR
封装形式	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	-	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	-	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
并行/串行	SERIAL	SERIAL	SERIAL	SERIAL	-	SERIAL	-	SERIAL	SERIAL
座面最大高度	0.6 mm	0.6 mm	0.6 mm	0.6 mm	-	0.6 mm	-	0.6 mm	0.6 mm
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	-	5.5 V	-	5.5 V	5.5 V
最小供电电压 (Vsup)	1.8 V	2.5 V	1.8 V	1.7 V	-	1.8 V	-	2.5 V	1.7 V
表面贴装	YES	YES	YES	YES	-	YES	-	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	-	CMOS	-	CMOS	CMOS
温度等级	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	OTHER	-	INDUSTRIAL	-	INDUSTRIAL	OTHER
端子形式	NO LEAD	NO LEAD	NO LEAD	NO LEAD	-	NO LEAD	-	NO LEAD	NO LEAD
端子节距	0.5 mm	0.5 mm	0.5 mm	0.5 mm	-	0.5 mm	-	0.5 mm	0.5 mm
端子位置	DUAL	DUAL	DUAL	DUAL	-	DUAL	-	DUAL	DUAL
宽度	2 mm	2 mm	2 mm	2 mm	-	2 mm	-	2 mm	2 mm
最长写入周期时间 (tWC)	5 ms	5 ms	5 ms	5 ms	-	5 ms	-	5 ms	5 ms