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M74HC292B1N

HC/UH SERIES, PRESCALER, PDIP16, PLASTIC, DIP-16

器件类别:逻辑    逻辑   

厂商名称:ST(意法半导体)

厂商官网:http://www.st.com/

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器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
ST(意法半导体)
零件包装代码
DIP
包装说明
PLASTIC, DIP-16
针数
16
Reach Compliance Code
not_compliant
系列
HC/UH
JESD-30 代码
R-PDIP-T16
JESD-609代码
e0
逻辑集成电路类型
PRESCALER
最大频率@ Nom-Sup
20000000 Hz
数据/时钟输入次数
2
功能数量
1
端子数量
16
最高工作温度
85 °C
最低工作温度
-40 °C
输出极性
INVERTED
封装主体材料
PLASTIC/EPOXY
封装代码
DIP
封装等效代码
DIP16,.3
封装形状
RECTANGULAR
封装形式
IN-LINE
峰值回流温度(摄氏度)
NOT SPECIFIED
电源
2/6 V
传播延迟(tpd)
635 ns
认证状态
Not Qualified
座面最大高度
5.1 mm
最大供电电压 (Vsup)
6 V
最小供电电压 (Vsup)
2 V
表面贴装
NO
技术
CMOS
温度等级
INDUSTRIAL
端子面层
Tin/Lead (Sn/Pb)
端子形式
THROUGH-HOLE
端子节距
2.54 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
NOT SPECIFIED
宽度
7.62 mm
最小 fmax
24 MHz
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参数对比
与M74HC292B1N相近的元器件有:M74HC292C1、M74HC292F1、M74HC292M1、M74HC294B1N、M74HC294M1、M74HC294F1、M74HC294C1、M54HC292F1、M54HC294F1。描述及对比如下:
型号 M74HC292B1N M74HC292C1 M74HC292F1 M74HC292M1 M74HC294B1N M74HC294M1 M74HC294F1 M74HC294C1 M54HC292F1 M54HC294F1
描述 HC/UH SERIES, PRESCALER, PDIP16, PLASTIC, DIP-16 HC/UH SERIES, PRESCALER, PQCC20, PLASTIC, LCC-20 HC/UH SERIES, PRESCALER, CDIP16, FRIT SEALED, CERAMIC, DIP-16 HC/UH SERIES, PRESCALER, PDSO16, MICRO, PLASTIC, SOP-16 HC/UH SERIES, PRESCALER, PDIP16, PLASTIC, DIP-16 HC/UH SERIES, PRESCALER, PDSO16, MICRO, PLASTIC, SOP-16 HC/UH SERIES, PRESCALER, CDIP16, FRIT SEALED, CERAMIC, DIP-16 HC/UH SERIES, PRESCALER, PQCC20, PLASTIC, LCC-20 HC/UH SERIES, PRESCALER, CDIP16, FRIT SEALED, CERAMIC, DIP-16 HC/UH SERIES, PRESCALER, CDIP16, FRIT SEALED, CERAMIC, DIP-16
是否Rohs认证 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合
厂商名称 ST(意法半导体) ST(意法半导体) ST(意法半导体) ST(意法半导体) ST(意法半导体) ST(意法半导体) ST(意法半导体) ST(意法半导体) ST(意法半导体) ST(意法半导体)
零件包装代码 DIP QLCC DIP SOIC DIP SOIC DIP QLCC DIP DIP
包装说明 PLASTIC, DIP-16 PLASTIC, LCC-20 FRIT SEALED, CERAMIC, DIP-16 MICRO, PLASTIC, SOP-16 PLASTIC, DIP-16 MICRO, PLASTIC, SOP-16 FRIT SEALED, CERAMIC, DIP-16 PLASTIC, LCC-20 FRIT SEALED, CERAMIC, DIP-16 FRIT SEALED, CERAMIC, DIP-16
针数 16 20 16 16 16 16 16 20 16 16
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant
系列 HC/UH HC/UH HC/UH HC/UH HC/UH HC/UH HC/UH HC/UH HC/UH HC/UH
JESD-30 代码 R-PDIP-T16 S-PQCC-J20 R-GDIP-T16 R-PDSO-G16 R-PDIP-T16 R-PDSO-G16 R-GDIP-T16 S-PQCC-J20 R-GDIP-T16 R-GDIP-T16
JESD-609代码 e0 e0 e0 e0 e0 e0 e0 e0 e0 e0
逻辑集成电路类型 PRESCALER PRESCALER PRESCALER PRESCALER PRESCALER PRESCALER PRESCALER PRESCALER PRESCALER PRESCALER
最大频率@ Nom-Sup 20000000 Hz 20000000 Hz 20000000 Hz 20000000 Hz 26000000 Hz 26000000 Hz 26000000 Hz 26000000 Hz 17000000 Hz 21000000 Hz
数据/时钟输入次数 2 2 2 2 2 2 2 2 2 2
功能数量 1 1 1 1 1 1 1 1 1 1
端子数量 16 20 16 16 16 16 16 20 16 16
最高工作温度 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 125 °C 125 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -55 °C -55 °C
输出极性 INVERTED INVERTED INVERTED INVERTED INVERTED INVERTED INVERTED INVERTED INVERTED INVERTED
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC, GLASS-SEALED PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC, GLASS-SEALED PLASTIC/EPOXY CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
封装代码 DIP QCCJ DIP SOP DIP SOP DIP QCCJ DIP DIP
封装等效代码 DIP16,.3 LDCC20,.4SQ DIP16,.3 SOP16,.4 DIP16,.3 SOP16,.4 DIP16,.3 LDCC20,.4SQ DIP16,.3 DIP16,.3
封装形状 RECTANGULAR SQUARE RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR SQUARE RECTANGULAR RECTANGULAR
封装形式 IN-LINE CHIP CARRIER IN-LINE SMALL OUTLINE IN-LINE SMALL OUTLINE IN-LINE CHIP CARRIER IN-LINE IN-LINE
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
电源 2/6 V 2/6 V 2/6 V 2/6 V 2/6 V 2/6 V 2/6 V 2/6 V 2/6 V 2/6 V
传播延迟(tpd) 635 ns 635 ns 635 ns 635 ns 571 ns 571 ns 571 ns 571 ns 750 ns 676 ns
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 5.1 mm 4.57 mm 5 mm 1.75 mm 5.1 mm 1.75 mm 5 mm 4.57 mm 5 mm 5 mm
最大供电电压 (Vsup) 6 V 6 V 6 V 6 V 6 V 6 V 6 V 6 V 6 V 6 V
最小供电电压 (Vsup) 2 V 2 V 2 V 2 V 2 V 2 V 2 V 2 V 2 V 2 V
表面贴装 NO YES NO YES NO YES NO YES NO NO
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL MILITARY MILITARY
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 THROUGH-HOLE J BEND THROUGH-HOLE GULL WING THROUGH-HOLE GULL WING THROUGH-HOLE J BEND THROUGH-HOLE THROUGH-HOLE
端子节距 2.54 mm 1.27 mm 2.54 mm 1.27 mm 2.54 mm 1.27 mm 2.54 mm 1.27 mm 2.54 mm 2.54 mm
端子位置 DUAL QUAD DUAL DUAL DUAL DUAL DUAL QUAD DUAL DUAL
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
宽度 7.62 mm 8.9662 mm 7.62 mm 3.9 mm 7.62 mm 3.9 mm 7.62 mm 8.9662 mm 7.62 mm 7.62 mm
最小 fmax 24 MHz 24 MHz 24 MHz 24 MHz 31 MHz 31 MHz 31 MHz 31 MHz 20 MHz 25 MHz
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器件捷径:
E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ
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