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M74HC294C1

HC/UH SERIES, PRESCALER, PQCC20, PLASTIC, LCC-20

器件类别:逻辑    逻辑   

厂商名称:ST(意法半导体)

厂商官网:http://www.st.com/

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器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
ST(意法半导体)
零件包装代码
QLCC
包装说明
PLASTIC, LCC-20
针数
20
Reach Compliance Code
not_compliant
系列
HC/UH
JESD-30 代码
S-PQCC-J20
JESD-609代码
e0
长度
8.9662 mm
逻辑集成电路类型
PRESCALER
最大频率@ Nom-Sup
26000000 Hz
数据/时钟输入次数
2
功能数量
1
端子数量
20
最高工作温度
85 °C
最低工作温度
-40 °C
输出极性
INVERTED
封装主体材料
PLASTIC/EPOXY
封装代码
QCCJ
封装等效代码
LDCC20,.4SQ
封装形状
SQUARE
封装形式
CHIP CARRIER
峰值回流温度(摄氏度)
NOT SPECIFIED
电源
2/6 V
传播延迟(tpd)
571 ns
认证状态
Not Qualified
座面最大高度
4.57 mm
最大供电电压 (Vsup)
6 V
最小供电电压 (Vsup)
2 V
表面贴装
YES
技术
CMOS
温度等级
INDUSTRIAL
端子面层
Tin/Lead (Sn/Pb)
端子形式
J BEND
端子节距
1.27 mm
端子位置
QUAD
处于峰值回流温度下的最长时间
NOT SPECIFIED
宽度
8.9662 mm
最小 fmax
31 MHz
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参数对比
与M74HC294C1相近的元器件有:M74HC292B1N、M74HC292C1、M74HC292F1、M74HC292M1、M74HC294B1N、M74HC294M1、M74HC294F1、M54HC292F1、M54HC294F1。描述及对比如下:
型号 M74HC294C1 M74HC292B1N M74HC292C1 M74HC292F1 M74HC292M1 M74HC294B1N M74HC294M1 M74HC294F1 M54HC292F1 M54HC294F1
描述 HC/UH SERIES, PRESCALER, PQCC20, PLASTIC, LCC-20 HC/UH SERIES, PRESCALER, PDIP16, PLASTIC, DIP-16 HC/UH SERIES, PRESCALER, PQCC20, PLASTIC, LCC-20 HC/UH SERIES, PRESCALER, CDIP16, FRIT SEALED, CERAMIC, DIP-16 HC/UH SERIES, PRESCALER, PDSO16, MICRO, PLASTIC, SOP-16 HC/UH SERIES, PRESCALER, PDIP16, PLASTIC, DIP-16 HC/UH SERIES, PRESCALER, PDSO16, MICRO, PLASTIC, SOP-16 HC/UH SERIES, PRESCALER, CDIP16, FRIT SEALED, CERAMIC, DIP-16 HC/UH SERIES, PRESCALER, CDIP16, FRIT SEALED, CERAMIC, DIP-16 HC/UH SERIES, PRESCALER, CDIP16, FRIT SEALED, CERAMIC, DIP-16
是否Rohs认证 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合
厂商名称 ST(意法半导体) ST(意法半导体) ST(意法半导体) ST(意法半导体) ST(意法半导体) ST(意法半导体) ST(意法半导体) ST(意法半导体) ST(意法半导体) ST(意法半导体)
零件包装代码 QLCC DIP QLCC DIP SOIC DIP SOIC DIP DIP DIP
包装说明 PLASTIC, LCC-20 PLASTIC, DIP-16 PLASTIC, LCC-20 FRIT SEALED, CERAMIC, DIP-16 MICRO, PLASTIC, SOP-16 PLASTIC, DIP-16 MICRO, PLASTIC, SOP-16 FRIT SEALED, CERAMIC, DIP-16 FRIT SEALED, CERAMIC, DIP-16 FRIT SEALED, CERAMIC, DIP-16
针数 20 16 20 16 16 16 16 16 16 16
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant
系列 HC/UH HC/UH HC/UH HC/UH HC/UH HC/UH HC/UH HC/UH HC/UH HC/UH
JESD-30 代码 S-PQCC-J20 R-PDIP-T16 S-PQCC-J20 R-GDIP-T16 R-PDSO-G16 R-PDIP-T16 R-PDSO-G16 R-GDIP-T16 R-GDIP-T16 R-GDIP-T16
JESD-609代码 e0 e0 e0 e0 e0 e0 e0 e0 e0 e0
逻辑集成电路类型 PRESCALER PRESCALER PRESCALER PRESCALER PRESCALER PRESCALER PRESCALER PRESCALER PRESCALER PRESCALER
最大频率@ Nom-Sup 26000000 Hz 20000000 Hz 20000000 Hz 20000000 Hz 20000000 Hz 26000000 Hz 26000000 Hz 26000000 Hz 17000000 Hz 21000000 Hz
数据/时钟输入次数 2 2 2 2 2 2 2 2 2 2
功能数量 1 1 1 1 1 1 1 1 1 1
端子数量 20 16 20 16 16 16 16 16 16 16
最高工作温度 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 125 °C 125 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -55 °C -55 °C
输出极性 INVERTED INVERTED INVERTED INVERTED INVERTED INVERTED INVERTED INVERTED INVERTED INVERTED
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC, GLASS-SEALED PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
封装代码 QCCJ DIP QCCJ DIP SOP DIP SOP DIP DIP DIP
封装等效代码 LDCC20,.4SQ DIP16,.3 LDCC20,.4SQ DIP16,.3 SOP16,.4 DIP16,.3 SOP16,.4 DIP16,.3 DIP16,.3 DIP16,.3
封装形状 SQUARE RECTANGULAR SQUARE RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 CHIP CARRIER IN-LINE CHIP CARRIER IN-LINE SMALL OUTLINE IN-LINE SMALL OUTLINE IN-LINE IN-LINE IN-LINE
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
电源 2/6 V 2/6 V 2/6 V 2/6 V 2/6 V 2/6 V 2/6 V 2/6 V 2/6 V 2/6 V
传播延迟(tpd) 571 ns 635 ns 635 ns 635 ns 635 ns 571 ns 571 ns 571 ns 750 ns 676 ns
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 4.57 mm 5.1 mm 4.57 mm 5 mm 1.75 mm 5.1 mm 1.75 mm 5 mm 5 mm 5 mm
最大供电电压 (Vsup) 6 V 6 V 6 V 6 V 6 V 6 V 6 V 6 V 6 V 6 V
最小供电电压 (Vsup) 2 V 2 V 2 V 2 V 2 V 2 V 2 V 2 V 2 V 2 V
表面贴装 YES NO YES NO YES NO YES NO NO NO
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL MILITARY MILITARY
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 J BEND THROUGH-HOLE J BEND THROUGH-HOLE GULL WING THROUGH-HOLE GULL WING THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
端子节距 1.27 mm 2.54 mm 1.27 mm 2.54 mm 1.27 mm 2.54 mm 1.27 mm 2.54 mm 2.54 mm 2.54 mm
端子位置 QUAD DUAL QUAD DUAL DUAL DUAL DUAL DUAL DUAL DUAL
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
宽度 8.9662 mm 7.62 mm 8.9662 mm 7.62 mm 3.9 mm 7.62 mm 3.9 mm 7.62 mm 7.62 mm 7.62 mm
最小 fmax 31 MHz 24 MHz 24 MHz 24 MHz 24 MHz 31 MHz 31 MHz 31 MHz 20 MHz 25 MHz
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