Analog to Digital Converters - ADC CMOS 5us 10-Bit Complete ADC with Voltage Reference
厂商名称:Maxim(美信半导体)
厂商官网:https://www.maximintegrated.com/en.html
下载文档型号 | MAX173C/D | MAX173EWG | MAX173CWG-T | MAX173ENG+ | MAX173ENG |
---|---|---|---|---|---|
描述 | Analog to Digital Converters - ADC CMOS 5us 10-Bit Complete ADC with Voltage Reference | Analog to Digital Converters - ADC CMOS 5us 10-Bit Complete ADC with Voltage Reference | Analog to Digital Converters - ADC CMOS 5us 10-Bit Complete ADC with Voltage Reference | Analog to Digital Converters - ADC CMOS 5us 10-Bit Complete ADC with Voltage Reference | Analog to Digital Converters - ADC CMOS 5us 10-Bit Complete ADC with Voltage Reference |
是否无铅 | - | 含铅 | 含铅 | 不含铅 | 含铅 |
是否Rohs认证 | - | 不符合 | 不符合 | 符合 | 不符合 |
厂商名称 | - | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
零件包装代码 | - | SOIC | SOIC | DIP | DIP |
包装说明 | - | SOP-24 | SOP-24 | DIP, DIP24,.6 | PLASTIC, DIP-24 |
针数 | - | 24 | 24 | 24 | 24 |
Reach Compliance Code | - | not_compliant | not_compliant | compliant | not_compliant |
ECCN代码 | - | EAR99 | EAR99 | EAR99 | EAR99 |
最大模拟输入电压 | - | 5 V | 5 V | 5 V | 5 V |
最长转换时间 | - | 5.2 µs | 5.2 µs | 5.2 µs | 5.2 µs |
转换器类型 | - | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION |
JESD-30 代码 | - | R-PDSO-G24 | R-PDSO-G24 | R-PDIP-T24 | R-PDIP-T24 |
JESD-609代码 | - | e0 | e0 | e3 | e0 |
长度 | - | 15.4 mm | 15.4 mm | 30.545 mm | 30.545 mm |
最大线性误差 (EL) | - | 0.05% | 0.05% | 0.05% | 0.05% |
湿度敏感等级 | - | 1 | 1 | 1 | 1 |
标称负供电电压 | - | -12 V | -12 V | -12 V | -12 V |
模拟输入通道数量 | - | 1 | 1 | 1 | 1 |
位数 | - | 10 | 10 | 10 | 10 |
功能数量 | - | 1 | 1 | 1 | 1 |
端子数量 | - | 24 | 24 | 24 | 24 |
最高工作温度 | - | 85 °C | 70 °C | 85 °C | 85 °C |
最低工作温度 | - | -40 °C | - | -40 °C | -40 °C |
输出位码 | - | BINARY | BINARY | BINARY | BINARY |
输出格式 | - | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD |
封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | - | SOP | SOP | DIP | DIP |
封装等效代码 | - | SOP24,.4 | SOP24,.4 | DIP24,.6 | DIP24,.6 |
封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | - | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE |
峰值回流温度(摄氏度) | - | 240 | 240 | 260 | 240 |
电源 | - | 5,-12/-15 V | 5,-12/-15 V | 5,-12/-15 V | 5,-12/-15 V |
认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | - | 2.65 mm | 2.65 mm | 4.572 mm | 4.572 mm |
标称供电电压 | - | 5 V | 5 V | 5 V | 5 V |
表面贴装 | - | YES | YES | NO | NO |
技术 | - | CMOS | CMOS | CMOS | CMOS |
温度等级 | - | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | - | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | Tin/Lead (Sn85Pb15) |
端子形式 | - | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | - | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm |
端子位置 | - | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | - | 20 | NOT SPECIFIED | 30 | 20 |
宽度 | - | 7.5 mm | 7.5 mm | 7.62 mm | 7.62 mm |