型号
- 型号
- 关键词
Analog to Digital Converters - ADC CMOS 5us 10-Bit Complete ADC with Voltage Reference
厂商名称：Maxim(美信半导体)
厂商官网：https://www.maximintegrated.com/en.html
下载文档| 型号 | MAX173ENG | MAX173EWG | MAX173CWG-T | MAX173ENG+ | MAX173C/D |
|---|---|---|---|---|---|
| 描述 | Analog to Digital Converters - ADC CMOS 5us 10-Bit Complete ADC with Voltage Reference | Analog to Digital Converters - ADC CMOS 5us 10-Bit Complete ADC with Voltage Reference | Analog to Digital Converters - ADC CMOS 5us 10-Bit Complete ADC with Voltage Reference | Analog to Digital Converters - ADC CMOS 5us 10-Bit Complete ADC with Voltage Reference | Analog to Digital Converters - ADC CMOS 5us 10-Bit Complete ADC with Voltage Reference |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 不含铅 | - |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 符合 | - |
| 厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | - |
| 零件包装代码 | DIP | SOIC | SOIC | DIP | - |
| 包装说明 | PLASTIC, DIP-24 | SOP-24 | SOP-24 | DIP, DIP24,.6 | - |
| 针数 | 24 | 24 | 24 | 24 | - |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | compliant | - |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | - |
| 最大模拟输入电压 | 5 V | 5 V | 5 V | 5 V | - |
| 最长转换时间 | 5.2 µs | 5.2 µs | 5.2 µs | 5.2 µs | - |
| 转换器类型 | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | - |
| JESD-30 代码 | R-PDIP-T24 | R-PDSO-G24 | R-PDSO-G24 | R-PDIP-T24 | - |
| JESD-609代码 | e0 | e0 | e0 | e3 | - |
| 长度 | 30.545 mm | 15.4 mm | 15.4 mm | 30.545 mm | - |
| 最大线性误差 (EL) | 0.05% | 0.05% | 0.05% | 0.05% | - |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | - |
| 标称负供电电压 | -12 V | -12 V | -12 V | -12 V | - |
| 模拟输入通道数量 | 1 | 1 | 1 | 1 | - |
| 位数 | 10 | 10 | 10 | 10 | - |
| 功能数量 | 1 | 1 | 1 | 1 | - |
| 端子数量 | 24 | 24 | 24 | 24 | - |
| 最高工作温度 | 85 °C | 85 °C | 70 °C | 85 °C | - |
| 最低工作温度 | -40 °C | -40 °C | - | -40 °C | - |
| 输出位码 | BINARY | BINARY | BINARY | BINARY | - |
| 输出格式 | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | DIP | SOP | SOP | DIP | - |
| 封装等效代码 | DIP24,.6 | SOP24,.4 | SOP24,.4 | DIP24,.6 | - |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | - |
| 峰值回流温度（摄氏度） | 240 | 240 | 240 | 260 | - |
| 电源 | 5,-12/-15 V | 5,-12/-15 V | 5,-12/-15 V | 5,-12/-15 V | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 座面最大高度 | 4.572 mm | 2.65 mm | 2.65 mm | 4.572 mm | - |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | - |
| 表面贴装 | NO | YES | YES | NO | - |
| 技术 | CMOS | CMOS | CMOS | CMOS | - |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | - |
| 端子面层 | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | - |
| 端子形式 | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | - |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | - |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | - |
| 处于峰值回流温度下的最长时间 | 20 | 20 | NOT SPECIFIED | 30 | - |
| 宽度 | 7.62 mm | 7.5 mm | 7.5 mm | 7.62 mm | - |
