MAX3265CUE,MAX3265CUE pdf中文资料,MAX3265CUE引脚图,MAX3265CUE电路-Datasheet-电子工程世界

参数对比

与MAX3265CUE相近的元器件有：MAX3768CUB、MAX3765CUB、MAX3269CUB、MAX3269CUB+、MAX3265EUE、MAX3265CUB、MAX3264CUE、MAX3268CUB。描述及对比如下：

型号	MAX3265CUE	MAX3768CUB	MAX3765CUB	MAX3269CUB	MAX3269CUB+	MAX3265EUE	MAX3265CUB	MAX3264CUE	MAX3268CUB
描述	SPECIALTY TELECOM CIRCUIT, PDSO16, 4.40 MM, EXPOSED PAD, MO-153ABT, TSSOP-16	SPECIALTY TELECOM CIRCUIT, PDSO10, EXPOSED PAD, MO-187C-BA, MICRO MAX, PACKAGE-10	SPECIALTY TELECOM CIRCUIT, PDSO10, EXPOSED PAD, MO-187C-BA, MICRO MAX, PACKAGE-10	SPECIALTY TELECOM CIRCUIT, PDSO10, EXPOSED PAD, MO-187C-BA, MICRO MAX, PACKAGE-10	SPECIALTY TELECOM CIRCUIT, PDSO10, LEAD FREE, EXPOSED PAD, MO-187C-BA, MICRO MAX, PACKAGE-10	SPECIALTY TELECOM CIRCUIT, PDSO16, 4.40 MM, EXPOSED PAD, MO-153ABT, TSSOP-16	SPECIALTY TELECOM CIRCUIT, PDSO10, EXPOSED PAD, MO-187C-BA, MICRO MAX, PACKAGE-10	SPECIALTY TELECOM CIRCUIT, PDSO16, 4.40 MM, EXPOSED PAD, MO-153ABT, TSSOP-16	SPECIALTY TELECOM CIRCUIT, PDSO10, EXPOSED PAD, MO-187C-BA, MICRO MAX, PACKAGE-10
是否无铅	含铅	含铅	含铅	不含铅	含铅	含铅	含铅	不含铅	含铅
零件包装代码	TSSOP	TSSOP	TSSOP	TSSOP	TSSOP	TSSOP	TSSOP	TSSOP	TSSOP
包装说明	4.40 MM, EXPOSED PAD, MO-153ABT, TSSOP-16	EXPOSED PAD, MO-187C-BA, MICRO MAX, PACKAGE-10	EXPOSED PAD, MO-187C-BA, MICRO MAX, PACKAGE-10	EXPOSED PAD, MO-187C-BA, MICRO MAX, PACKAGE-10	LEAD FREE, EXPOSED PAD, MO-187C-BA, MICRO MAX, PACKAGE-10	4.40 MM, EXPOSED PAD, MO-153ABT, TSSOP-16	EXPOSED PAD, MO-187C-BA, MICRO MAX, PACKAGE-10	4.40 MM, EXPOSED PAD, MO-153ABT, TSSOP-16	EXPOSED PAD, MO-187C-BA, MICRO MAX, PACKAGE-10
针数	16	10	10	10	10	16	10	16	10
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
JESD-30 代码	R-PDSO-G16	S-PDSO-G10	S-PDSO-G10	S-PDSO-G10	S-PDSO-G10	R-PDSO-G16	S-PDSO-G10	R-PDSO-G16	S-PDSO-G10
JESD-609代码	e3	e0	e0	e0	e3	e3	e0	e0	e0
长度	5 mm	3 mm	3 mm	3 mm	3 mm	5 mm	3 mm	5 mm	3 mm
湿度敏感等级	1	1	1	1	1	1	1	1	1
功能数量	1	1	1	1	1	1	1	1	1
端子数量	16	10	10	10	10	16	10	16	10
最高工作温度	70 °C	70 °C	70 °C	70 °C	70 °C	85 °C	70 °C	70 °C	70 °C
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	HTSSOP	HTSSOP	HTSSOP	HTSSOP	HTSSOP	HTSSOP	HTSSOP	HTSSOP	HTSSOP
封装形状	RECTANGULAR	SQUARE	SQUARE	SQUARE	SQUARE	RECTANGULAR	SQUARE	RECTANGULAR	SQUARE
封装形式	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
峰值回流温度（摄氏度）	240	245	245	240	260	240	240	245	240
认证状态	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
座面最大高度	1.1 mm	1.1 mm	1.1 mm	1.1 mm	1.1 mm	1.1 mm	1.1 mm	1.1 mm	1.1 mm
标称供电电压	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES	YES
电信集成电路类型	TELECOM CIRCUIT	TELECOM CIRCUIT	TELECOM CIRCUIT	TELECOM CIRCUIT	TELECOM CIRCUIT	TELECOM CIRCUIT	TELECOM CIRCUIT	TELECOM CIRCUIT	TELECOM CIRCUIT
温度等级	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
端子面层	MATTE TIN	TIN LEAD	TIN LEAD	TIN LEAD	TIN	MATTE TIN	TIN LEAD	TIN LEAD	TIN LEAD
端子形式	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
端子节距	0.65 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.65 mm	0.5 mm	0.65 mm	0.5 mm
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
处于峰值回流温度下的最长时间	20	NOT SPECIFIED	NOT SPECIFIED	20	30	20	20	NOT SPECIFIED	20
宽度	4.4 mm	3 mm	3 mm	3 mm	3 mm	4.4 mm	3 mm	4.4 mm	3 mm
厂商名称	Rochester Electronics	Rochester Electronics	Rochester Electronics	-	-	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics