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MAX3268CUB

SPECIALTY TELECOM CIRCUIT, PDSO10, EXPOSED PAD, MO-187C-BA, MICRO MAX, PACKAGE-10

器件类别:无线/射频/通信    电信电路   

厂商名称:Rochester Electronics

厂商官网:https://www.rocelec.com/

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器件:MAX3268CUB

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器件参数
参数名称
属性值
是否无铅
含铅
厂商名称
Rochester Electronics
Objectid
1380002455
零件包装代码
TSSOP
包装说明
EXPOSED PAD, MO-187C-BA, MICRO MAX, PACKAGE-10
针数
10
Reach Compliance Code
unknown
compound_id
160210968
JESD-30 代码
S-PDSO-G10
JESD-609代码
e0
长度
3 mm
湿度敏感等级
1
功能数量
1
端子数量
10
最高工作温度
70 °C
最低工作温度
封装主体材料
PLASTIC/EPOXY
封装代码
HTSSOP
封装形状
SQUARE
封装形式
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度)
240
认证状态
COMMERCIAL
座面最大高度
1.1 mm
标称供电电压
3.3 V
表面贴装
YES
电信集成电路类型
TELECOM CIRCUIT
温度等级
COMMERCIAL
端子面层
TIN LEAD
端子形式
GULL WING
端子节距
0.5 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
20
宽度
3 mm
参数对比
与MAX3268CUB相近的元器件有:MAX3768CUB、MAX3765CUB、MAX3269CUB、MAX3269CUB+、MAX3265EUE、MAX3265CUB、MAX3265CUE、MAX3264CUE。描述及对比如下:
型号 MAX3268CUB MAX3768CUB MAX3765CUB MAX3269CUB MAX3269CUB+ MAX3265EUE MAX3265CUB MAX3265CUE MAX3264CUE
描述 SPECIALTY TELECOM CIRCUIT, PDSO10, EXPOSED PAD, MO-187C-BA, MICRO MAX, PACKAGE-10 SPECIALTY TELECOM CIRCUIT, PDSO10, EXPOSED PAD, MO-187C-BA, MICRO MAX, PACKAGE-10 SPECIALTY TELECOM CIRCUIT, PDSO10, EXPOSED PAD, MO-187C-BA, MICRO MAX, PACKAGE-10 SPECIALTY TELECOM CIRCUIT, PDSO10, EXPOSED PAD, MO-187C-BA, MICRO MAX, PACKAGE-10 SPECIALTY TELECOM CIRCUIT, PDSO10, LEAD FREE, EXPOSED PAD, MO-187C-BA, MICRO MAX, PACKAGE-10 SPECIALTY TELECOM CIRCUIT, PDSO16, 4.40 MM, EXPOSED PAD, MO-153ABT, TSSOP-16 SPECIALTY TELECOM CIRCUIT, PDSO10, EXPOSED PAD, MO-187C-BA, MICRO MAX, PACKAGE-10 SPECIALTY TELECOM CIRCUIT, PDSO16, 4.40 MM, EXPOSED PAD, MO-153ABT, TSSOP-16 SPECIALTY TELECOM CIRCUIT, PDSO16, 4.40 MM, EXPOSED PAD, MO-153ABT, TSSOP-16
是否无铅 含铅 含铅 含铅 不含铅 含铅 含铅 含铅 含铅 不含铅
零件包装代码 TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP
包装说明 EXPOSED PAD, MO-187C-BA, MICRO MAX, PACKAGE-10 EXPOSED PAD, MO-187C-BA, MICRO MAX, PACKAGE-10 EXPOSED PAD, MO-187C-BA, MICRO MAX, PACKAGE-10 EXPOSED PAD, MO-187C-BA, MICRO MAX, PACKAGE-10 LEAD FREE, EXPOSED PAD, MO-187C-BA, MICRO MAX, PACKAGE-10 4.40 MM, EXPOSED PAD, MO-153ABT, TSSOP-16 EXPOSED PAD, MO-187C-BA, MICRO MAX, PACKAGE-10 4.40 MM, EXPOSED PAD, MO-153ABT, TSSOP-16 4.40 MM, EXPOSED PAD, MO-153ABT, TSSOP-16
针数 10 10 10 10 10 16 10 16 16
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown
JESD-30 代码 S-PDSO-G10 S-PDSO-G10 S-PDSO-G10 S-PDSO-G10 S-PDSO-G10 R-PDSO-G16 S-PDSO-G10 R-PDSO-G16 R-PDSO-G16
JESD-609代码 e0 e0 e0 e0 e3 e3 e0 e3 e0
长度 3 mm 3 mm 3 mm 3 mm 3 mm 5 mm 3 mm 5 mm 5 mm
湿度敏感等级 1 1 1 1 1 1 1 1 1
功能数量 1 1 1 1 1 1 1 1 1
端子数量 10 10 10 10 10 16 10 16 16
最高工作温度 70 °C 70 °C 70 °C 70 °C 70 °C 85 °C 70 °C 70 °C 70 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 HTSSOP HTSSOP HTSSOP HTSSOP HTSSOP HTSSOP HTSSOP HTSSOP HTSSOP
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE RECTANGULAR SQUARE RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度) 240 245 245 240 260 240 240 240 245
认证状态 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
座面最大高度 1.1 mm 1.1 mm 1.1 mm 1.1 mm 1.1 mm 1.1 mm 1.1 mm 1.1 mm 1.1 mm
标称供电电压 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES YES YES YES YES YES YES
电信集成电路类型 TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子面层 TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN MATTE TIN TIN LEAD MATTE TIN TIN LEAD
端子形式 GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
端子节距 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.65 mm 0.5 mm 0.65 mm 0.65 mm
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
处于峰值回流温度下的最长时间 20 NOT SPECIFIED NOT SPECIFIED 20 30 20 20 20 NOT SPECIFIED
宽度 3 mm 3 mm 3 mm 3 mm 3 mm 4.4 mm 3 mm 4.4 mm 4.4 mm
厂商名称 Rochester Electronics Rochester Electronics Rochester Electronics - - Rochester Electronics Rochester Electronics Rochester Electronics Rochester Electronics
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