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MAX5925BEUB+T

Hot Swap Voltage Controllers 1-13.2V Hot-Swap Controller

器件类别:电源/电源管理    电源电路   

厂商名称:Maxim(美信半导体)

厂商官网:https://www.maximintegrated.com/en.html

器件标准:

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器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
零件包装代码
TSSOP
包装说明
TSSOP, TSSOP10,.19,20
针数
10
Reach Compliance Code
compliant
ECCN代码
EAR99
可调阈值
YES
模拟集成电路 - 其他类型
POWER SUPPLY MANAGEMENT CIRCUIT
JESD-30 代码
S-PDSO-G10
JESD-609代码
e3
长度
3 mm
湿度敏感等级
1
信道数量
1
功能数量
1
端子数量
10
最高工作温度
85 °C
最低工作温度
-40 °C
封装主体材料
PLASTIC/EPOXY
封装代码
TSSOP
封装等效代码
TSSOP10,.19,20
封装形状
SQUARE
封装形式
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度)
260
电源
2.25/13.2 V
认证状态
Not Qualified
座面最大高度
1.1 mm
最大供电电流 (Isup)
2.5 mA
最大供电电压 (Vsup)
13.2 V
最小供电电压 (Vsup)
2.25 V
标称供电电压 (Vsup)
5 V
表面贴装
YES
技术
BICMOS
温度等级
INDUSTRIAL
端子面层
Matte Tin (Sn)
端子形式
GULL WING
端子节距
0.5 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
NOT SPECIFIED
宽度
3 mm
Base Number Matches
1
参数对比
与MAX5925BEUB+T相近的元器件有:MAX5926EEE-T、MAX5925BEUB+、MAX5925CEUB+、MAX5926EEE+、MAX5926EEE、MAX5925AEUB+、MAX5924BEUB+、MAX5924DEUB+、MAX5924AEUB+。描述及对比如下:
型号 MAX5925BEUB+T MAX5926EEE-T MAX5925BEUB+ MAX5925CEUB+ MAX5926EEE+ MAX5926EEE MAX5925AEUB+ MAX5924BEUB+ MAX5924DEUB+ MAX5924AEUB+
描述 Hot Swap Voltage Controllers 1-13.2V Hot-Swap Controller Hot Swap Voltage Controllers 1-13.2V Hot-Swap Controller Hot Swap Voltage Controllers 1-13.2V Hot-Swap Controller Hot Swap Voltage Controllers 1-13.2V Hot-Swap Controller Hot Swap Voltage Controllers 1-13.2V Hot-Swap Controller Hot Swap Voltage Controllers 1V to 13.2V, n-Channel Hot-Swap Controller Requires No Sense Resistor Hot Swap Voltage Controllers 1-13.2V Hot-Swap Controller Hot Swap Voltage Controllers 1-13.2V Hot-Swap Controller Hot Swap Voltage Controllers 1-13.2V Hot-Swap Controller Hot Swap Voltage Controllers 1-13.2V Hot-Swap Controller
是否无铅 不含铅 含铅 不含铅 不含铅 不含铅 含铅 不含铅 不含铅 不含铅 不含铅
是否Rohs认证 符合 不符合 符合 符合 符合 不符合 符合 符合 符合 符合
零件包装代码 TSSOP SOIC TSSOP TSSOP SOIC SOIC TSSOP TSSOP TSSOP TSSOP
包装说明 TSSOP, TSSOP10,.19,20 0.150 INCH, QSOP-16 TSSOP, TSSOP10,.19,20 TSSOP, TSSOP10,.19,20 HLSSOP, SSOP16,.25 0.150 INCH, QSOP-16 TSSOP, TSSOP10,.19,20 TSSOP, TSSOP10,.19,20 TSSOP, TSSOP10,.19,20 TSSOP, TSSOP10,.19,20
针数 10 16 10 10 16 16 10 10 10 10
Reach Compliance Code compliant not_compliant compliant compliant compliant not_compliant compliant compliant compliant compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
可调阈值 YES YES YES YES YES YES YES YES YES YES
模拟集成电路 - 其他类型 POWER SUPPLY MANAGEMENT CIRCUIT POWER SUPPLY MANAGEMENT CIRCUIT POWER SUPPLY MANAGEMENT CIRCUIT POWER SUPPLY MANAGEMENT CIRCUIT POWER SUPPLY MANAGEMENT CIRCUIT POWER SUPPLY MANAGEMENT CIRCUIT POWER SUPPLY MANAGEMENT CIRCUIT POWER SUPPLY MANAGEMENT CIRCUIT POWER SUPPLY MANAGEMENT CIRCUIT POWER SUPPLY MANAGEMENT CIRCUIT
JESD-30 代码 S-PDSO-G10 R-PDSO-G16 S-PDSO-G10 S-PDSO-G10 R-PDSO-G16 R-PDSO-G16 S-PDSO-G10 S-PDSO-G10 S-PDSO-G10 S-PDSO-G10
JESD-609代码 e3 e0 e4 e4 e3 e0 e4 e4 e4 e4
长度 3 mm 4.89 mm 3 mm 3 mm 4.89 mm 4.89 mm 3 mm 3 mm 3 mm 3 mm
信道数量 1 1 1 1 1 1 1 1 1 1
功能数量 1 1 1 1 1 1 1 1 1 1
端子数量 10 16 10 10 16 16 10 10 10 10
最高工作温度 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TSSOP HLSSOP TSSOP TSSOP HLSSOP HLSSOP TSSOP TSSOP TSSOP TSSOP
封装等效代码 TSSOP10,.19,20 SSOP16,.25 TSSOP10,.19,20 TSSOP10,.19,20 SSOP16,.25 SSOP16,.25 TSSOP10,.19,20 TSSOP10,.19,20 TSSOP10,.19,20 TSSOP10,.19,20
封装形状 SQUARE RECTANGULAR SQUARE SQUARE RECTANGULAR RECTANGULAR SQUARE SQUARE SQUARE SQUARE
封装形式 SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度) 260 NOT SPECIFIED 260 260 260 245 260 260 260 260
电源 2.25/13.2 V 2.25/13.2 V 2.25/13.2 V 2.25/13.2 V 2.25/13.2 V 2.25/13.2 V 2.25/13.2 V 2.25/13.2 V 2.25/13.2 V 2.25/13.2 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.1 mm 1.65 mm 1.1 mm 1.1 mm 1.65 mm 1.65 mm 1.1 mm 1.1 mm 1.1 mm 1.1 mm
最大供电电流 (Isup) 2.5 mA 2.5 mA 2.5 mA 2.5 mA 2.5 mA 2.5 mA 2.5 mA 2.5 mA 2.5 mA 2.5 mA
最大供电电压 (Vsup) 13.2 V 13.2 V 13.2 V 13.2 V 13.2 V 13.2 V 13.2 V 13.2 V 13.2 V 13.2 V
最小供电电压 (Vsup) 2.25 V 2.25 V 2.25 V 2.25 V 2.25 V 2.25 V 2.25 V 2.25 V 2.25 V 2.25 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 YES YES YES YES YES YES YES YES YES YES
技术 BICMOS BICMOS BICMOS BICMOS BICMOS BICMOS BICMOS BICMOS BICMOS BICMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子面层 Matte Tin (Sn) Tin/Lead (Sn/Pb) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Matte Tin (Sn) Tin/Lead (Sn85Pb15) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式 GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
端子节距 0.5 mm 0.635 mm 0.5 mm 0.5 mm 0.635 mm 0.635 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
宽度 3 mm 3.9 mm 3 mm 3 mm 3.9 mm 3.9 mm 3 mm 3 mm 3 mm 3 mm
湿度敏感等级 1 - 1 1 1 1 1 1 1 1
厂商名称 - - Maxim(美信半导体) Maxim(美信半导体) - Maxim(美信半导体) Maxim(美信半导体) Maxim(美信半导体) Maxim(美信半导体) Maxim(美信半导体)
Factory Lead Time - - 1 week 1 week 9 weeks - 6 weeks 9 weeks 9 weeks 1 week
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