型号
- 型号
- 关键词
Memory Circuit, Flash+SRAM, 1MX16, CMOS, PBGA69, PLASTIC, BGA-69
厂商名称：FUJITSU(富士通)
厂商官网：http://edevice.fujitsu.com/fmd/en/index.html
下载文档| 型号 | MB84VD21183DA-85PBS | MB84VD21193DA-85PBS | MB84VD21181DA-85PBS | MB84VD21182DA-85PBS | MB84VD21192DA-85PBS | MB84VD21184DA-85PBS | MB84VD21191DA-85PBS | MB84VD21194DA-85PBS |
|---|---|---|---|---|---|---|---|---|
| 描述 | Memory Circuit, Flash+SRAM, 1MX16, CMOS, PBGA69, PLASTIC, BGA-69 | Memory Circuit, Flash+SRAM, 1MX16, CMOS, PBGA69, PLASTIC, BGA-69 | Memory Circuit, Flash+SRAM, 1MX16, CMOS, PBGA69, PLASTIC, BGA-69 | Memory Circuit, Flash+SRAM, 1MX16, CMOS, PBGA69, PLASTIC, BGA-69 | Memory Circuit, Flash+SRAM, 1MX16, CMOS, PBGA69, PLASTIC, BGA-69 | Memory Circuit, Flash+SRAM, 1MX16, CMOS, PBGA69, PLASTIC, BGA-69 | Memory Circuit, Flash+SRAM, 1MX16, CMOS, PBGA69, PLASTIC, BGA-69 | Memory Circuit, Flash+SRAM, 1MX16, CMOS, PBGA69, PLASTIC, BGA-69 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA |
| 包装说明 | LFBGA, BGA69,10X10,32 | LFBGA, BGA69,10X10,32 | LFBGA, BGA69,10X10,32 | LFBGA, BGA69,10X10,32 | LFBGA, BGA69,10X10,32 | LFBGA, BGA69,10X10,32 | LFBGA, BGA69,10X10,32 | LFBGA, BGA69,10X10,32 |
| 针数 | 69 | 69 | 69 | 69 | 69 | 69 | 69 | 69 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| 最长访问时间 | 85 ns | 85 ns | 85 ns | 85 ns | 85 ns | 85 ns | 85 ns | 85 ns |
| 其他特性 | SRAM IS CONFIGURED AS 256K X 16/512K X 8 | SRAM IS CONFIGURED AS 256K X 16/512K X 8 | SRAM IS CONFIGURED AS 256K X 16/512K X 8 | SRAM IS CONFIGURED AS 256K X 16/512K X 8 | SRAM IS CONFIGURED AS 256K X 16/512K X 8 | SRAM IS CONFIGURED AS 256K X 16/512K X 8 | SRAM IS CONFIGURED AS 256K X 16/512K X 8 | SRAM IS CONFIGURED AS 256K X 16/512K X 8 |
| JESD-30 代码 | R-PBGA-B69 | R-PBGA-B69 | R-PBGA-B69 | R-PBGA-B69 | R-PBGA-B69 | R-PBGA-B69 | R-PBGA-B69 | R-PBGA-B69 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 11 mm | 11 mm | 11 mm | 11 mm | 11 mm | 11 mm | 11 mm | 11 mm |
| 内存密度 | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit |
| 内存集成电路类型 | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT |
| 内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 混合内存类型 | FLASH+SRAM | FLASH+SRAM | FLASH+SRAM | FLASH+SRAM | FLASH+SRAM | FLASH+SRAM | FLASH+SRAM | FLASH+SRAM |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 69 | 69 | 69 | 69 | 69 | 69 | 69 | 69 |
| 字数 | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
| 字数代码 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -25 °C | -25 °C | -25 °C | -25 °C | -25 °C | -25 °C | -25 °C | -25 °C |
| 组织 | 1MX16 | 1MX16 | 1MX16 | 1MX16 | 1MX16 | 1MX16 | 1MX16 | 1MX16 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LFBGA | LFBGA | LFBGA | LFBGA | LFBGA | LFBGA | LFBGA | LFBGA |
| 封装等效代码 | BGA69,10X10,32 | BGA69,10X10,32 | BGA69,10X10,32 | BGA69,10X10,32 | BGA69,10X10,32 | BGA69,10X10,32 | BGA69,10X10,32 | BGA69,10X10,32 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.4 mm | 1.4 mm | 1.4 mm | 1.4 mm | 1.4 mm | 1.4 mm | 1.4 mm | 1.4 mm |
| 最大压摆率 | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA |
| 最大供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 最小供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| 标称供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
| 端子节距 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 8 mm | 8 mm | 8 mm | 8 mm | 8 mm | 8 mm | 8 mm | 8 mm |
| 厂商名称 | FUJITSU(富士通) | - | FUJITSU(富士通) | FUJITSU(富士通) | FUJITSU(富士通) | FUJITSU(富士通) | FUJITSU(富士通) | FUJITSU(富士通) |