型号
- 型号
- 关键词
| 型号 | MC10H603FNR2 | MC100H603FNR2 | MC10H603FNG |
|---|---|---|---|
| 描述 | Translation - Voltage Levels 9-Bit ECL to TTL | Translation - Voltage Levels 9-Bit ECL to TTL | Translation - Voltage Levels BBG ECL TRNSLTR 9BIT |
| 是否Rohs认证 | 不符合 | 不符合 | 符合 |
| 厂商名称 | ON Semiconductor(安森美) | ON Semiconductor(安森美) | ON Semiconductor(安森美) |
| 零件包装代码 | QLCC | QLCC | QLCC |
| 包装说明 | PLASTIC, LCC-28 | QCCJ, LDCC28,.5SQ | LEAD FREE, PLASTIC, LCC-28 |
| 针数 | 28 | 28 | 28 |
| Reach Compliance Code | not_compliant | not_compliant | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 |
| 最大延迟 | 12 ns | 12 ns | 12 ns |
| 接口集成电路类型 | ECL TO TTL TRANSLATOR | ECL TO TTL TRANSLATOR | ECL TO TTL TRANSLATOR |
| JESD-30 代码 | S-PQCC-J28 | S-PQCC-J28 | S-PQCC-J28 |
| JESD-609代码 | e0 | e0 | e3 |
| 长度 | 11.505 mm | 11.505 mm | 11.505 mm |
| 标称负供电电压 | -5.2 V | -4.5 V | -5.2 V |
| 位数 | 1 | 1 | 1 |
| 功能数量 | 9 | 9 | 9 |
| 端子数量 | 28 | 28 | 28 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE |
| 输出锁存器或寄存器 | LATCH | LATCH | LATCH |
| 输出极性 | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QCCJ | QCCJ | QCCJ |
| 封装等效代码 | LDCC28,.5SQ | LDCC28,.5SQ | LDCC28,.5SQ |
| 封装形状 | SQUARE | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
| 峰值回流温度（摄氏度） | 240 | 240 | 260 |
| 电源 | 5,-5.2 V | 5,-4.5 V | 5,-5.2 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 4.57 mm | 4.57 mm | 4.57 mm |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES |
| 技术 | ECL | ECL | ECL |
| 温度等级 | OTHER | OTHER | OTHER |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin (Sn) |
| 端子形式 | J BEND | J BEND | J BEND |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 40 |
| 宽度 | 11.505 mm | 11.505 mm | 11.505 mm |
| Is Samacsys | N | - | N |
| 湿度敏感等级 | 1 | 1 | - |
| Base Number Matches | 1 | - | 1 |
