Differential Multiplexer, 1 Func, 4 Channel, CMOS, PDIP20, PLASTIC, DIP-20
厂商名称:Motorola ( NXP )
厂商官网:https://www.nxp.com
下载文档型号 | MC74HC4352N | MC54HC4352J | MC74HC4352DWR2 | MC74HC4352DW |
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描述 | Differential Multiplexer, 1 Func, 4 Channel, CMOS, PDIP20, PLASTIC, DIP-20 | 4-CHANNEL, DIFFERENTIAL MULTIPLEXER, CDIP20, CERAMIC, DIP-20 | 4-CHANNEL, DIFFERENTIAL MULTIPLEXER, PDSO20, SOIC-20 | 4-CHANNEL, DIFFERENTIAL MULTIPLEXER, PDSO20, SOIC-20 |
包装说明 | DIP, DIP20,.3 | DIP, | SOP, SOP20,.4 | SOP, SOP20,.4 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
模拟集成电路 - 其他类型 | DIFFERENTIAL MULTIPLEXER | DIFFERENTIAL MULTIPLEXER | DIFFERENTIAL MULTIPLEXER | DIFFERENTIAL MULTIPLEXER |
JESD-30 代码 | R-PDIP-T20 | R-CDIP-T20 | R-PDSO-G20 | R-PDSO-G20 |
JESD-609代码 | e0 | e0 | e0 | e0 |
长度 | 26.415 mm | 24.515 mm | 12.8 mm | 12.8 mm |
标称负供电电压 (Vsup) | -6 V | -6 V | -6 V | -6 V |
信道数量 | 4 | 4 | 4 | 4 |
功能数量 | 1 | 1 | 1 | 1 |
端子数量 | 20 | 20 | 20 | 20 |
标称断态隔离度 | 40 dB | 40 dB | 40 dB | 40 dB |
最大通态电阻 (Ron) | 140 Ω | 140 Ω | 140 Ω | 140 Ω |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C |
封装主体材料 | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | DIP | SOP | SOP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 4.57 mm | 5.08 mm | 2.65 mm | 2.65 mm |
最大供电电流 (Isup) | 0.16 mA | 0.16 mA | 0.16 mA | 0.16 mA |
标称供电电压 (Vsup) | 6 V | 6 V | 6 V | 6 V |
表面贴装 | NO | NO | YES | YES |
最长断开时间 | 15 ns | 15 ns | 15 ns | 15 ns |
最长接通时间 | 15 ns | 15 ns | 15 ns | 15 ns |
技术 | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING |
端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL |
宽度 | 7.62 mm | 7.62 mm | 7.5 mm | 7.5 mm |
封装等效代码 | DIP20,.3 | - | SOP20,.4 | SOP20,.4 |
电源 | 2/12 V | - | 2/12 V | 2/12 V |
切换 | BREAK-BEFORE-MAKE | - | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
Base Number Matches | 1 | 1 | 1 | - |
零件包装代码 | - | DIP | SOIC | SOIC |
针数 | - | 20 | 20 | 20 |