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MCM63P733ATQ150R

128KX32 CACHE SRAM, 3.8ns, PQFP100, TQFP-100

器件类别:存储    存储   

厂商名称:Motorola ( NXP )

厂商官网:https://www.nxp.com

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器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
Motorola ( NXP )
零件包装代码
QFP
包装说明
LQFP,
针数
100
Reach Compliance Code
unknown
ECCN代码
3A991.B.2.A
最长访问时间
3.8 ns
其他特性
SELF-TIMED WRITE CYCLE
JESD-30 代码
R-PQFP-G100
JESD-609代码
e0
长度
20 mm
内存密度
4194304 bit
内存集成电路类型
CACHE SRAM
内存宽度
32
功能数量
1
端子数量
100
字数
131072 words
字数代码
128000
工作模式
SYNCHRONOUS
最高工作温度
70 °C
最低工作温度
组织
128KX32
封装主体材料
PLASTIC/EPOXY
封装代码
LQFP
封装形状
RECTANGULAR
封装形式
FLATPACK, LOW PROFILE
并行/串行
PARALLEL
峰值回流温度(摄氏度)
NOT SPECIFIED
认证状态
Not Qualified
座面最大高度
1.6 mm
最大供电电压 (Vsup)
3.63 V
最小供电电压 (Vsup)
3.135 V
标称供电电压 (Vsup)
3.3 V
表面贴装
YES
技术
CMOS
温度等级
COMMERCIAL
端子面层
Tin/Lead (Sn/Pb)
端子形式
GULL WING
端子节距
0.65 mm
端子位置
QUAD
处于峰值回流温度下的最长时间
NOT SPECIFIED
宽度
14 mm
文档预览
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Order this document
by MCM63P733A/D
128K x 32 Bit Pipelined
BurstRAM Synchronous
Fast Static RAM
The MCM63P733A and SCM63P733A are 4M–bit synchronous fast static
RAMs designed to provide a burstable, high performance, secondary cache.
The MCM63P733A and SCM63P733A (organized as 128K words by 32 bits)
are fabricated in Motorola’s high performance silicon gate CMOS technology.
These devices integrate input registers, an output register, a 2–bit address
counter, and high speed SRAM onto a single monolithic circuit for reduced
parts count in cache data RAM applications. Synchronous design allows
precise cycle control with the use of an external clock (K). CMOS circuitry re-
duces the overall power consumption of the integrated functions for greater
reliability.
Addresses (SA), data inputs (DQx), and all control signals except output
enable (G) and Linear Burst Order (LBO) are clock (K) controlled through
positive–edge–triggered noninverting registers.
Bursts can be initiated with either ADSP or ADSC input pins. Subsequent burst
addresses can be generated internally by the MCM63P733A and SCM63P733A
(burst sequence operates in linear or interleaved mode dependent upon the state
of LBO) and controlled by the burst address advance (ADV) input pin.
Write cycles are internally self–timed and are initiated by the rising edge of the
clock (K) input. This feature eliminates complex off–chip write pulse generation
and provides increased timing flexibility for incoming signals.
Synchronous byte write (SBx), synchronous global write (SGW), and synchro-
nous write enable (SW) are provided to allow writes to either individual bytes or
to all bytes. The four bytes are designated as “a”, “b”, “c”, and “d”. SBa controls
DQa, SBb controls DQb, etc. Individual bytes are written if the selected byte
writes SBx are asserted with SW. All bytes are written if either SGW is asserted
or if all SBx and SW are asserted.
For read cycles, pipelined SRAMs output data is temporarily stored by an
edge–triggered output register and then released to the output buffers at the next
rising edge of clock (K).
The MCM63P733A and SCM63P733A operate from a 3.3 V core power supply
and all outputs operate on a 2.5 V or 3.3 V power supply. All inputs and outputs
are JEDEC standard JESD8–5 compatible.
MCM63P733A–150 = 3.8 ns Access / 6.7 ns Cycle (150 MHz)
MCM63P733A / SCM63P733A–133 = 4 ns Access / 7.5 ns Cycle (133 MHz)
MCM63P733A–117 = 4.2 ns Access / 8.5 ns Cycle (117 MHz)
MCM63P733A–100 = 4.5 ns Access / 10 ns Cycle (100 MHz)
MCM63P733A–90 = 5 ns Access / 11 ns Cycle (90 MHz)
3.3 V +10% , –5% Core, Power Supply, 2.5 V or 3.3 V I/O Supply
ADSP, ADSC, and ADV Burst Control Pins
Selectable Burst Sequencing Order (Linear/Interleaved)
Internally Self–Timed Write Cycle
Byte Write and Global Write Control
Single–Cycle Deselect
Sleep Mode (ZZ)
–40° to 85°C Extended Operating Temperatures (SCM63P733A only)
100–Pin TQFP Package
MCM63P733A
SCM63P733A
TQ PACKAGE
TQFP
CASE 983A–01
REV 5
9/21/99
©
Motorola, Inc. 1999
MOTOROLA FAST SRAM
MCM63P733A•SCM63P733A
1
FUNCTIONAL BLOCK DIAGRAM
LBO
ADV
K
ADSC
ADSP
K2
BURST
COUNTER
CLR
2
2
17
128K x 32 ARRAY
SA
SA1
SA0
ADDRESS
REGISTER
17
15
SGW
SW
WRITE
REGISTER
a
32
32
SBa
SBb
WRITE
REGISTER
b
4
WRITE
REGISTER
c
DATA–IN
REGISTER
K
DATA–OUT
REGISTER
SBc
SBd
WRITE
REGISTER
d
K2
K
SE1
SE2
SE3
G
ENABLE
REGISTER
ENABLE
REGISTER
DQa – DQd
MCM63P733A•SCM63P733A
2
MOTOROLA FAST SRAM
PIN ASSIGNMENT
SA
SA
SE1
SE2
SBd
SBc
SBb
SBa
SE3
VDD
VSS
K
SGW
SW
G
ADSC
ADSP
ADV
SA
SA
NC
DQc
DQc
VDDQ
VSS
DQc
DQc
DQc
DQc
VSS
VDDQ
DQc
DQc
NC
VDD
NC
VSS
DQd
DQd
VDDQ
VSS
DQd
DQd
DQd
DQd
VSS
VDDQ
DQd
DQd
NC
100 99 98 97 9695 94 93 92 91 90 89 88 87 86 85 84 83 82 81
1
80
2
79
3
78
4
77
5
76
6
75
7
74
8
73
9
72
10
71
11
70
12
69
13
68
14
67
15
66
16
65
17
64
18
63
19
62
20
61
21
60
22
59
23
58
24
57
25
56
26
55
27
54
28
53
29
52
30
51
31 32 33 34 35 36 3738 39 40 41 42 43 44 4546 47 48 49 50
LBO
SA
SA
SA
SA
SA1
SA0
NC
NC
VSS
VDD
NC
NC
SA
SA
SA
SA
SA
SA
SA
NC
DQb
DQb
VDDQ
VSS
DQb
DQb
DQb
DQb
VSS
VDDQ
DQb
DQb
VSS
NC
VDD
ZZ
DQa
DQa
VDDQ
VSS
DQa
DQa
DQa
DQa
VSS
VDDQ
DQa
DQa
NC
MOTOROLA FAST SRAM
MCM63P733A•SCM63P733A
3
PIN DESCRIPTIONS
Pin Locations
85
Symbol
ADSC
Type
Input
Description
Synchronous Address Status Controller: Active low, interrupts any
ongoing burst and latches a new external address. Used to initiate a
READ, WRITE, or chip deselect.
Synchronous Address Status Processor: Active low, interrupts any
ongoing burst and latches a new external address. Used to initiate a
new READ, WRITE, or chip deselect (exception — chip deselect
does not occur when ADSP is asserted and SE1 is high).
Synchronous Address Advance: Increments address count in
accordance with counter type selected (linear/interleaved).
Synchronous Data I/O: “x” refers to the byte being read or written
(byte a, b, c, d).
84
ADSP
Input
83
(a) 52, 53, 56, 57, 58, 59, 62, 63
(b) 68, 69, 72, 73, 74, 75, 78, 79
(c) 2, 3, 6, 7, 8, 9, 12, 13
(d) 18, 19, 22, 23, 24, 25, 28, 29
86
89
31
ADV
DQx
Input
I/O
G
K
LBO
Input
Input
Input
Asynchronous Output Enable Input.
Clock: This signal registers the address, data in, and all control
signals except G, LBO, and ZZ.
Linear Burst Order Input: This pin may be left floating; it will default
as interleaved.
Low — linear burst counter.
High — interleaved burst counter.
Synchronous Address Inputs: These inputs are registered and must
meet setup and hold times.
Synchronous Address Inputs: These pins must be wired to the two
LSBs of the address bus for proper burst operation. These inputs
are registered and must meet setup and hold times.
Synchronous Byte Write Inputs: “x” refers to the byte being written
(byte a, b, c, d). SGW overrides SBx.
Synchronous Chip Enable: Active low to enable chip.
Negated high — blocks ADSP or deselects chip when ADSC is
asserted.
Synchronous Chip Enable: Active high for depth expansion.
Synchronous Chip Enable: Active low for depth expansion.
Synchronous Global Write: This signal writes all bytes regardless of
the status of the SBx and SW signals. If only byte write signals SBx
are being used, tie this pin high.
Synchronous Write: This signal writes only those bytes that have
been selected using the byte write SBx pins. If only byte write
signals SBx are being used, tie this pin low.
Sleep Mode: This active high asynchronous signal places the RAM
into the lowest power mode. The ZZ pin disables the RAMs internal
clock when placed in this mode. When ZZ is negated, the RAM
remains in low power mode until it is commanded to READ or
WRITE. Data integrity is maintained upon returning to normal
operation.
Core Power Supply.
I/O Power Supply.
Ground.
No Connection: There is no connection to the chip.
32, 33, 34, 35, 44, 45, 46, 47, 48, 49, 50,
81, 82, 99, 100
36, 37
SA
SA1, SA0
Input
Input
93, 94, 95, 96
(a) (b) (c) (d)
98
SBx
SE1
Input
Input
97
92
88
SE2
SE3
SGW
Input
Input
Input
87
SW
Input
64
ZZ
Input
15, 41, 65, 91
4, 11, 20, 27, 54, 61, 70, 77
5, 10, 17, 21, 26, 40, 55, 60, 67,
71, 76, 90
1, 14, 16, 30, 38, 39, 42, 43, 51, 66, 80
VDD
VDDQ
VSS
NC
Supply
Supply
Supply
MCM63P733A•SCM63P733A
4
MOTOROLA FAST SRAM
TRUTH TABLE
(See Notes 1 through 5)
Next Cycle
Deselect
Deselect
Deselect
Deselect
Deselect
Begin Read
Begin Read
Continue Read
Continue Read
Continue Read
Continue Read
Suspend Read
Suspend Read
Suspend Read
Suspend Read
Begin Write
Continue Write
Continue Write
Suspend Write
Suspend Write
Address
Used
None
None
None
None
None
External
External
Next
Next
Next
Next
Current
Current
Current
Current
External
Next
Next
Current
Current
SE1
1
0
0
X
X
0
0
X
X
1
1
X
X
1
1
0
X
1
X
1
SE2
X
X
0
X
0
1
1
X
X
X
X
X
X
X
X
1
X
X
X
X
SE3
X
1
X
1
X
0
0
X
X
X
X
X
X
X
X
0
X
X
X
X
ADSP
X
0
0
1
1
0
1
1
1
X
X
1
1
X
X
1
1
X
1
X
ADSC
0
X
X
0
0
X
0
1
1
1
1
1
1
1
1
0
1
1
1
1
ADV
X
X
X
X
X
X
X
0
0
0
0
1
1
1
1
X
0
0
1
1
G3
X
X
X
X
X
X
X
1
0
1
0
1
0
1
0
X
X
X
X
X
DQx
High–Z
High–Z
High–Z
High–Z
High–Z
High–Z
High–Z
High–Z
DQ
High–Z
DQ
High–Z
DQ
High–Z
DQ
High–Z
High–Z
High–Z
High–Z
High–Z
Write 2, 4
X
X
X
X
X
X
READ
READ
READ
READ
READ
READ
READ
READ
READ
WRITE
WRITE
WRITE
WRITE
WRITE
NOTES:
1. X = Don’t Care. 1 = logic high. 0 = logic low.
2. Write is defined as either 1) any SBx and SW low, or 2) SGW is low.
3. G is an asynchronous signal and is not sampled by the clock K. G drives the bus immediately (tGLQX) following G going low.
4. On write cycles that follow read cycles, G must be negated prior to the start of the write cycle to ensure proper write data setup times.
G must also remain negated at the completion of the write cycle to ensure proper write data hold times.
ASYNCHRONOUS TRUTH TABLE
Operation
Read
Read
Write
Deselected
Selected
ZZ
L
L
L
L
H
G
L
H
X
X
X
I/O Status
Data Out (DQx)
High–Z
High–Z
High–Z
High–Z
LINEAR BURST ADDRESS TABLE
(LBO = VSS)
1st Address (External)
X . . . X00
X . . . X01
X . . . X10
X . . . X11
2nd Address (Internal)
X . . . X01
X . . . X10
X . . . X11
X . . . X00
3rd Address (Internal)
X . . . X10
X . . . X11
X . . . X00
X . . . X01
4th Address (Internal)
X . . . X11
X . . . X00
X . . . X01
X . . . X10
MOTOROLA FAST SRAM
MCM63P733A•SCM63P733A
5
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参数对比
与MCM63P733ATQ150R相近的元器件有:SCM63P733ATQ133R、MCM63P733ATQ150。描述及对比如下:
型号 MCM63P733ATQ150R SCM63P733ATQ133R MCM63P733ATQ150
描述 128KX32 CACHE SRAM, 3.8ns, PQFP100, TQFP-100 128KX32 CACHE SRAM, 4ns, PQFP100, TQFP-100 128KX32 CACHE SRAM, 3.8ns, PQFP100, TQFP-100
厂商名称 Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP )
零件包装代码 QFP QFP QFP
包装说明 LQFP, LQFP, LQFP,
针数 100 100 100
Reach Compliance Code unknown unknown unknown
ECCN代码 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
最长访问时间 3.8 ns 4 ns 3.8 ns
JESD-30 代码 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100
长度 20 mm 20 mm 20 mm
内存密度 4194304 bit 4194304 bit 4194304 bit
内存集成电路类型 CACHE SRAM CACHE SRAM CACHE SRAM
内存宽度 32 32 32
功能数量 1 1 1
端子数量 100 100 100
字数 131072 words 131072 words 131072 words
字数代码 128000 128000 128000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 70 °C 85 °C 70 °C
组织 128KX32 128KX32 128KX32
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 LQFP LQFP LQFP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
并行/串行 PARALLEL PARALLEL PARALLEL
认证状态 Not Qualified Not Qualified Not Qualified
座面最大高度 1.6 mm 1.6 mm 1.6 mm
最大供电电压 (Vsup) 3.63 V 3.63 V 3.63 V
最小供电电压 (Vsup) 3.135 V 3.135 V 3.135 V
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES
技术 CMOS CMOS CMOS
温度等级 COMMERCIAL INDUSTRIAL COMMERCIAL
端子形式 GULL WING GULL WING GULL WING
端子节距 0.65 mm 0.65 mm 0.65 mm
端子位置 QUAD QUAD QUAD
宽度 14 mm 14 mm 14 mm
是否Rohs认证 不符合 - 不符合
其他特性 SELF-TIMED WRITE CYCLE - SELF-TIMED WRITE CYCLE
JESD-609代码 e0 - e0
峰值回流温度(摄氏度) NOT SPECIFIED - NOT SPECIFIED
端子面层 Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb)
处于峰值回流温度下的最长时间 NOT SPECIFIED - NOT SPECIFIED
热门器件
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器件捷径:
L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ
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