描述 |
|
Power Supply Support Circuit, Adjustable, 1 Channel, PDSO10 |
Power Supply Support Circuit, Adjustable, 1 Channel, PDSO10 |
Power Supply Support Circuit, Adjustable, 1 Channel, PDSO10 |
Power Supply Support Circuit, Adjustable, 1 Channel, PDSO10 |
厂商名称 |
Microchip(微芯科技) |
Microchip(微芯科技) |
Microchip(微芯科技) |
Microchip(微芯科技) |
Microchip(微芯科技) |
包装说明 |
TSSOP, TSSOP10,.19,20 |
DFN-10 |
DFN-10 |
DFN-10 |
DFN-10 |
Reach Compliance Code |
compliant |
compliant |
compliant |
compliant |
compliant |
可调阈值 |
YES |
YES |
YES |
YES |
YES |
模拟集成电路 - 其他类型 |
POWER SUPPLY SUPPORT CIRCUIT |
POWER SUPPLY SUPPORT CIRCUIT |
POWER SUPPLY SUPPORT CIRCUIT |
POWER SUPPLY SUPPORT CIRCUIT |
POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 代码 |
S-PDSO-G10 |
S-PDSO-N10 |
S-PDSO-N10 |
S-PDSO-N10 |
S-PDSO-N10 |
长度 |
3 mm |
3 mm |
3 mm |
3 mm |
3 mm |
信道数量 |
1 |
1 |
1 |
1 |
1 |
功能数量 |
1 |
1 |
1 |
1 |
1 |
端子数量 |
10 |
10 |
10 |
10 |
10 |
最高工作温度 |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
最低工作温度 |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
封装主体材料 |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
封装代码 |
TSSOP |
SON |
HVSON |
HVSON |
HVSON |
封装形状 |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
封装形式 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
座面最大高度 |
1.1 mm |
1.1 mm |
1 mm |
1 mm |
1 mm |
最大供电电压 (Vsup) |
6 V |
6 V |
6 V |
6 V |
6 V |
最小供电电压 (Vsup) |
3.75 V |
3.75 V |
3.75 V |
3.75 V |
3.75 V |
标称供电电压 (Vsup) |
5.2 V |
5.2 V |
5.2 V |
5.2 V |
5.2 V |
表面贴装 |
YES |
YES |
YES |
YES |
YES |
温度等级 |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
端子形式 |
GULL WING |
NO LEAD |
NO LEAD |
NO LEAD |
NO LEAD |
端子节距 |
0.5 mm |
0.5 mm |
0.5 mm |
0.5 mm |
0.5 mm |
端子位置 |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
宽度 |
3 mm |
3 mm |
3 mm |
3 mm |
3 mm |
筛选级别 |
- |
TS 16949 |
TS 16949 |
TS 16949 |
TS 16949 |