MF436
1300 nm - 50 MHz High Performance LED
Data Sheet
October 2004
Ordering Information
MF436
MF436 ST
MF436 FC
TO-46 Package
ST Housing
FC Housing
-40°C to +85°C
Note: Rated Fiber coupled power apply only on the TO-46
package, for housing options fiber coupled power is
typically 10% less.
Features
•
•
•
•
1310 nm Surface-Emitting LED
50 MHz Bandwidth
Designed for 62.5/125 µm fiber
High power
Description
This device generates very high power which makes it
ideal for many sensors and signal transmission
applications. It operates in a wide range of
temperatures, and can satisfy virtually any
environmental specification. The double-lens optical
system results in optimum coupling of power into the
fiber.
Applications
•
•
•
Sensors
Test Equipment
Signal transmission
CASE
ANODE
CATHODE
ANODE
CATHODE
Bottom View
Figure 1 - Pin Diagram
Figure 2 - Functional Schematic
1
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Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc.
Copyright 2003-2004, Zarlink Semiconductor Inc. All Rights Reserved.
MF436
Optical and Electrical Characteristics - Case Temperature 25°C
Parameter
Fiber-Coupled Power
(Figures 3, 4 and 5) (Table 1)
Symbol
P
fiber
Min.
20
Typ.
27
Max.
Unit
µW
Data Sheet
Test Condition
I
F
=80mA, Note 1
Fiber: 50/125µm
NA=0.20
I
F
=80mA, Note 1
Fiber: 62.5/125µm
NA=0.275
I
F
=80mA (no bias)
I
F
=80mA
I
F
=80mA
I
F
=80mA
I
F
=80mA
V
R
=1V
V
R
-0V, f=1MHz
70
80
µW
Rise and Fall Time (10-90%)
Bandwidth (3 dB
el
)
Peak Wavelength
Spectral Width (FWHM)
Forward Voltage (Figure 5)
Reverse Current
Capacitance
Note 1:
t
r
,t
f
f
c
λ
p
∆λ
V
F
I
R
C
1270
7
50
1300
145
1.5
200
10
1350
165
2
100
ns
MHz
nm
nm
V
µA
pF
Measured at the exit of 100 meters of fiber.
Absolute Maximum Ratings
Parameter
Storage Temperature
Operating Temperature
Electrical Power Dissipation (Figure 4)
Continuous Forward Current (f<10 kHz)
Peak Forward Current (duty cycle<50%,f>1 MHz
Reverse Voltage
Soldering Temperature (2mm from the case for 10 sec.)
Symbol
T
stg
T
op
P
tot
I
F
I
FRM
V
R
T
sld
Limit
-55 to +125
°
C
-40 to +85
°
C
160 mW
90 mA
130 mA
0.5 V
260
°
C
Thermal Characteristics
Parameter
Thermal Resistance - Infinite Heat Sink
Thermal Resistance - No Heat Sink
Temperature Coefficient - Optical Power
Temperature Coefficient - Wavelength
Temperature Coefficient - Spectral Width
Symbol
R
thjc
R
thja
dP/dT
j
d
λ
/dT
j
d∆
λ
/dT
j
-0.6
0.45
0.25
Min.
Typ.
Max.
150
450
Unit
°
C/W
°
C/W
%/
°
C
nm/
°
C
nm/
°
C
2
Zarlink Semiconductor Inc.
MF436
Typical Fiber-Coupled Power
Core Diameter/Cladding Diameter Numerical Aperture
50/125
µm
0.20
27
µW
62.5/125
µm
0.275
80
µW
Data Sheet
100/140
µm
0.29
140
µW
100
Relative Fiber-coupled Power (%)
r
z
80
r - optimal
Ø
C
= 62.5
µm
60
40
20
0
0.5
0.75
1
1.25
1.5
1.75
2
2.25
2.5
2.75
3
z - axial Displacement of Fiber (mm)
Figure 3 - z - Axial Displacement of Fiber
3
Zarlink Semiconductor Inc.
MF436
100
90
Data Sheet
r
z
Relative Fiber-coupled Power (%)
80
70
60
50
40
30
20
10
0
0
10
20
30
40
50
60
70
80
90
100
z - optimal
Ø
C
= 62.5
µm
r - Radial Displacem ent of Fiber (
µ
m )
Figure 4 - r - Radial Displacement of Fiber
100
Relative Fiber-coupled Power (%)
80
50% Duty Cycle
60
40
DC
20
Heat Sinked
0
0
20
40
60
80
100
120
140
160
180
200
Forw ard Current (m A)
Figure 5 - Relative Fiber-coupled Power vs. Forward Current
4
Zarlink Semiconductor Inc.
MF436
Data Sheet
300
Max. Electrical Power Dissipation (mW)
250
200
150
No Heat Sink
Infinite
Heat Sink
100
50
0
0
15
30
45
60
75
90
Operating Tem perature (
o
C)
105
120
135
150
Figure 6 - Max. Electrical Power Dissipation vs. Operating Temperature
200
175
150
125
100
75
50
25
0
0
0.25
0.5
0.75
1
1.25
1.5
1.75
2
2.25
2.5
2.75
3
Forward Current (mA)
Forw ard Voltage (V)
Figure 7 - Forward Current vs. Forward Voltage
5
Zarlink Semiconductor Inc.
