型号
- 型号
- 关键词
Power Switch ICs - Power Distribution
厂商名称：Microchip(微芯科技)
厂商官网：https://www.microchip.com
下载文档| 型号 | MIC2039AYMT-TR | MIC2039AYM6-TR | MIC2039AYM6-T5 | MIC2039BYM6-TR |
|---|---|---|---|---|
| 描述 | Power Switch ICs - Power Distribution | Power Switch ICs - Power Distribution | Power Switch ICs - Power Distribution | Power Switch ICs - Power Distribution |
| 包装说明 | HVSON, | LSSOP, | LSSOP, | LSSOP, |
| Reach Compliance Code | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
| Factory Lead Time | 3 weeks | 11 weeks | 11 weeks | 15 weeks |
| 可调阈值 | YES | YES | YES | YES |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | S-PDSO-N6 | R-PDSO-G6 | R-PDSO-G6 | R-PDSO-G6 |
| 长度 | 2 mm | 2.9 mm | 2.9 mm | 2.9 mm |
| 信道数量 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 6 | 6 | 6 | 6 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HVSON | LSSOP | LSSOP | LSSOP |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
| 座面最大高度 | 0.6 mm | 1.45 mm | 1.45 mm | 1.45 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子形式 | NO LEAD | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | 0.95 mm | 0.95 mm | 0.95 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 2 mm | 1.6 mm | 1.6 mm | 1.6 mm |
| Base Number Matches | 1 | 1 | 1 | 1 |
| 是否Rohs认证 | - | 符合 | 符合 | 符合 |
| JESD-609代码 | - | e4 | e4 | e4 |
| 湿度敏感等级 | - | 1 | 1 | 1 |
| 峰值回流温度（摄氏度） | - | 260 | 260 | 260 |
| 端子面层 | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 处于峰值回流温度下的最长时间 | - | 40 | 40 | 40 |
