型号
- 型号
- 关键词
Modular Connectors / Ethernet Connectors VERT PCB 8/8 RJ45 SMALL PANEL CUTOUT
厂商名称：Microchip(微芯科技)
厂商官网：https://www.microchip.com
器件标准：
| 型号 | MIC4422AYN | MIC4421AZN | MIC4421AYM | MIC4421AZM-TR |
|---|---|---|---|---|
| 描述 | Modular Connectors / Ethernet Connectors VERT PCB 8/8 RJ45 SMALL PANEL CUTOUT | IGBT Transistors 600V ULTRAFAST 8-60 KHZ COPACK IGBT | Board Mount Temperature Sensors Digital Thermometer u0026 Memory | Gate Drivers |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) |
| 包装说明 | DIP, DIP8,.3 | DIP, DIP8,.3 | SOP, SOP8,.25 | SOP, SOP8,.25 |
| Reach Compliance Code | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
| Factory Lead Time | 9 weeks | 9 weeks | 13 weeks | 7 weeks |
| 高边驱动器 | NO | NO | NO | NO |
| 输入特性 | STANDARD | STANDARD | STANDARD | STANDARD |
| 接口集成电路类型 | BUFFER OR INVERTER BASED MOSFET DRIVER | BUFFER OR INVERTER BASED MOSFET DRIVER | BUFFER OR INVERTER BASED MOSFET DRIVER | BUFFER OR INVERTER BASED MOSFET DRIVER |
| JESD-30 代码 | R-PDIP-T8 | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G8 |
| JESD-609代码 | e3 | e3 | e4 | e4 |
| 长度 | 9.525 mm | 9.525 mm | 4.9 mm | 4.9 mm |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 85 °C | 70 °C | 85 °C | 70 °C |
| 输出特性 | TOTEM-POLE | TOTEM-POLE | TOTEM-POLE | TOTEM-POLE |
| 标称输出峰值电流 | 9 A | 9 A | 9 A | 9 A |
| 输出极性 | TRUE | INVERTED | INVERTED | INVERTED |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | SOP | SOP |
| 封装等效代码 | DIP8,.3 | DIP8,.3 | SOP8,.25 | SOP8,.25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | NOT APPLICABLE | NOT APPLICABLE | 260 | 260 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 3.43 mm | 3.43 mm | 1.73 mm | 1.73 mm |
| 最大压摆率 | 3 mA | 3 mA | 3 mA | 3 mA |
| 最大供电电压 | 18 V | 18 V | 18 V | 18 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 表面贴装 | NO | NO | YES | YES |
| 技术 | BCDMOS | BCDMOS | BCDMOS | BCDMOS |
| 温度等级 | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL |
| 端子面层 | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING |
| 端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT APPLICABLE | NOT APPLICABLE | 40 | 40 |
| 断开时间 | 0.08 µs | 0.08 µs | 0.08 µs | 0.08 µs |
| 接通时间 | 0.08 µs | 0.08 µs | 0.08 µs | 0.08 µs |
| 宽度 | 7.62 mm | 7.62 mm | 3.9 mm | 3.9 mm |
