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Dear customers,

About the change in the name such as "Oki Electric Industry Co. Ltd." and

"OKI" in documents to OKI Semiconductor Co., Ltd.

The semiconductor business of Oki Electric Industry Co., Ltd. was succeeded to OKI

Semiconductor Co., Ltd. on October 1, 2008.

Therefore, please accept that although

the terms and marks of "Oki Electric Industry Co., Ltd.", “Oki Electric”, and "OKI"

remain in the documents, they all have been changed to "OKI Semiconductor Co., Ltd.".

It is a change of the company name, the company trademark, and the logo, etc. , and

NOT a content change in documents.

October 1, 2008

OKI Semiconductor Co., Ltd.

550-1 Higashiasakawa-cho, Hachioji-shi, Tokyo 193-8550, Japan

http://www.okisemi.com/en/

FEUL66525-02

ML66525 Family

User’s Manual

CMOS 16-bit microcontroller

Issue Date: July 26, 2002

Preface

This user’s manual describes the hardware of Oki-original CMOS 16-bit microcontrollers ML66525 family. In addition

to this manual, Oki also provides the following manuals which should be read with regard to the ML66525 family.

nX-8/500S Core Instruction Manual

•

nX-8/500S core instruction set

•

Addressing modes

CC665S User’s Manual

•

Optimized compiler CC665S operation

•

C-language specifications in CC665S

CL665S User’s Manual

•

Compiler loader CL665S operation

RTL665S Run Time Library Reference

•

C run time library explanation

MAC66K Assembler Package User’s Manual

•

Package overview

•

RAS66K (relocatable assembler) operation

•

RAS66K assembly language explanation

•

RL66K (linker) operation

•

LIB66K (librarian) operation

•

OH66K (object converter) operation

Macroprocessor MP User’s Manual

•

MP operation

•

Macro language

Ultra-66K/E502 User’s Manual

•

Ultra-66K (Emulator) explanation

•

PathFinder-66K (Debugger) explanation

PW66K Flash Writer System User’s Manual

•

PW66K Flash Writer System operation

This document is subject to change without notice.

Notation

Classification

■

Numeric value

■

Unit

Notation

xxH, xxhex

xxb

Word, W

byte, B

nibble, N

mega-, M

kilo-, K

kilo-, k

milli-, m

micro-,

nano-, n

second, s

Description

Represents a hexadecimal number

Represents a binary number

1 word = 16 bits

1 byte = 2 nibbles = 8 bits

1 nibble = 4 bits

= 1024

= 1000

–3

–6

–9

second

1 KB = 1 kilobyte = 1024 bytes

1 MB = 1 megabyte = 2

bytes

= 1,048,576 bytes

The signal level of the high side of the voltage; indicates the

voltage level of V

and V

described in the electrical

characteristics.

The signal level of the low side of the voltage; indicates

voltage level of V

and V

described in the electrical

characteristics.

Operation code trap. Occurs when an empty area that has

not been assigned an instruction is fetched, or when an

instruction code combination that does not contain an

instruction is addressed.

■

Terminology

“H” level

“L” level

Opcode trap

■

Fixed bit

Bit name Bit number

SCNC0

SNEX0

ADRUN0

“0”

ADCON0L

At reset

—

ADSNM02 ADSNM01 ASSNM00

Address: 009C [H]

R/W access: R/W

Initial value when reset

Read/Write attribute

: Indicates that the bit does not exist. Writing into this bit is invalid.

: When writing, always write the specified value. If read, the specified value will be read.

Values of fixed bits are specified as “0” or “1”.

Read/write attribute : R indicates that reading is possible and W indicates that writing is possible.

Invalid bit

Fixed bit

Contents

Chapter 1

Overview

1.1 Overview............................................................................................................................ 1-1

1.2 Features .............................................................................................................................. 1-1

1.3 Block Diagram ................................................................................................................... 1-5

1.4 Pin Configuration (Top View) ........................................................................................... 1-6

1.5 Pin Descriptions ................................................................................................................. 1-8

1.5.1

Description of Each Pin ............................................................................................. 1-8

1.5.2

Pin Configuration..................................................................................................... 1-11

1.5.3

Connections for Unused Pins ................................................................................... 1-12

1.6 Basic Operational Timing ................................................................................................ 1-13

Chapter 2

CPU Architecture

2.1 Overview............................................................................................................................ 2-1

2.2 Memory Space ................................................................................................................... 2-1

2.2.1

Memory Space Expansion ......................................................................................... 2-1

2.2.2

Program Memory Space............................................................................................. 2-3

(1)

Accessing program memory space............................................................................. 2-5

(2)

Vector table area ........................................................................................................ 2-5

(3)

VCAL table area ........................................................................................................ 2-7

(4)

ACAL area ................................................................................................................. 2-8

2.2.3

(1)

(2)

(3)

(4)

(5)

(6)

(7)

(8)

2.2.4

(1)

(2)

Data Memory Space................................................................................................... 2-9

Special function register (SFR) area ........................................................................ 2-11

Reserved area ........................................................................................................... 2-11

Internal RAM area ................................................................................................... 2-11

Fixed page (FIX) area .............................................................................................. 2-11

Local register setting area ........................................................................................ 2-13

External data memory area ...................................................................................... 2-13

Common area ........................................................................................................... 2-14

EXPANDED RAM area .......................................................................................... 2-14

Data Memory Access ............................................................................................... 2-15

Byte operations ........................................................................................................ 2-15

Word operations....................................................................................................... 2-15

2.3 Registers........................................................................................................................... 2-16

2.3.1

Arithmetic Register (ACC) ...................................................................................... 2-16

2.3.2

Control Registers ..................................................................................................... 2-17

Contents - 1

参数对比

与ML66525-XXLA相近的元器件有：ML66525B-XXTB、ML66525A-XXLA、ML66Q525-NLA、ML66525-XXTB、ML66525A-XXTB、ML66525B-XXLA、ML66Q525B-NTB、ML66Q525B-NLA、ML66Q525-NTB。描述及对比如下：

型号	ML66525-XXLA	ML66525B-XXTB	ML66525A-XXLA	ML66Q525-NLA	ML66525-XXTB	ML66525A-XXTB	ML66525B-XXLA	ML66Q525B-NTB	ML66Q525B-NLA	ML66Q525-NTB
描述	Microcontroller, 16-Bit, MROM, 24MHz, CMOS, PBGA144, 11 X 11 MM, 0.80 MM PITCH, PLASTIC, LFBGA-144	Microcontroller, 16-Bit, MROM, OLMS-66K CPU, 24MHz, CMOS, PQFP100, 14 X 14 MM, 0.50 MM PITCH, PLASTIC, TQFP-100	Microcontroller, 16-Bit, MROM, 24MHz, CMOS, PBGA144, 11 X 11 MM, 0.80 MM PITCH, PLASTIC, LFBGA-144	Microcontroller, 16-Bit, FLASH, 24MHz, CMOS, PBGA144, 11 X 11 MM, 0.80 MM PITCH, PLASTIC, LFBGA-144	Microcontroller, 16-Bit, MROM, 24MHz, CMOS, PQFP100, 14 X 14 MM, 0.50 MM PITCH, PLASTIC, TQFP-100	Microcontroller, 16-Bit, MROM, 24MHz, CMOS, PQFP100, 14 X 14 MM, 0.50 MM PITCH, PLASTIC, TQFP-100	Microcontroller, 16-Bit, MROM, OLMS-66K CPU, 24MHz, CMOS, PBGA144, 11 X 11 MM, 0.80 MM PITCH, PLASTIC, LFBGA-144	Microcontroller, 16-Bit, FLASH, OLMS-66K CPU, 24MHz, CMOS, PQFP100, 14 X 14 MM, 0.50 MM PITCH, PLASTIC, TQFP-100	Microcontroller, 16-Bit, FLASH, OLMS-66K CPU, 24MHz, CMOS, PBGA144, 11 X 11 MM, 0.80 MM PITCH, PLASTIC, LFBGA-144	Microcontroller, 16-Bit, FLASH, 24MHz, CMOS, PQFP100, 14 X 14 MM, 0.50 MM PITCH, PLASTIC, TQFP-100
零件包装代码	BGA	QFP	BGA	BGA	QFP	QFP	BGA	QFP	BGA	QFP
包装说明	LFBGA,	TFQFP, TQFP100,.63SQ	LFBGA,	LFBGA,	TFQFP,	TFQFP,	LFBGA, BGA144,13X13,32	TFQFP, TQFP100,.63SQ	LFBGA, BGA144,13X13,32	TFQFP,
针数	144	100	144	144	100	100	144	100	144	100
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
具有ADC	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
地址总线宽度	20	20	20	20	20	20	20	20	20	20
位大小	16	16	16	16	16	16	16	16	16	16
最大时钟频率	24 MHz	24 MHz	24 MHz	24 MHz	24 MHz	24 MHz	24 MHz	24 MHz	24 MHz	24 MHz
DAC 通道	NO	NO	NO	NO	NO	NO	NO	NO	NO	NO
DMA 通道	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
外部数据总线宽度	8	8	8	8	8	8	8	8	8	8
JESD-30 代码	S-PBGA-B144	S-PQFP-G100	S-PBGA-B144	S-PBGA-B144	S-PQFP-G100	S-PQFP-G100	S-PBGA-B144	S-PQFP-G100	S-PBGA-B144	S-PQFP-G100
长度	11 mm	14 mm	11 mm	11 mm	14 mm	14 mm	11 mm	14 mm	11 mm	14 mm
I/O 线路数量	71	71	64	71	71	64	71	71	71	71
端子数量	144	100	144	144	100	100	144	100	144	100
最高工作温度	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
最低工作温度	-30 °C	-30 °C	-30 °C	-30 °C	-30 °C	-30 °C	-30 °C	-30 °C	-30 °C	-30 °C
PWM 通道	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	LFBGA	TFQFP	LFBGA	LFBGA	TFQFP	TFQFP	LFBGA	TFQFP	LFBGA	TFQFP
封装形状	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
封装形式	GRID ARRAY, LOW PROFILE, FINE PITCH	FLATPACK, THIN PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	FLATPACK, THIN PROFILE, FINE PITCH	FLATPACK, THIN PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	FLATPACK, THIN PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	FLATPACK, THIN PROFILE, FINE PITCH
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
ROM可编程性	MROM	MROM	MROM	FLASH	MROM	MROM	MROM	FLASH	FLASH	FLASH
座面最大高度	1.5 mm	1.2 mm	1.5 mm	1.5 mm	1.2 mm	1.2 mm	1.5 mm	1.2 mm	1.5 mm	1.2 mm
速度	24 MHz	24 MHz	24 MHz	24 MHz	24 MHz	24 MHz	24 MHz	24 MHz	24 MHz	24 MHz
最大供电电压	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
最小供电电压	2.4 V	2.4 V	2.4 V	2.4 V	2.4 V	2.4 V	2.4 V	2.4 V	2.4 V	2.4 V
标称供电电压	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER
端子形式	BALL	GULL WING	BALL	BALL	GULL WING	GULL WING	BALL	GULL WING	BALL	GULL WING
端子节距	0.8 mm	0.5 mm	0.8 mm	0.8 mm	0.5 mm	0.5 mm	0.8 mm	0.5 mm	0.8 mm	0.5 mm
端子位置	BOTTOM	QUAD	BOTTOM	BOTTOM	QUAD	QUAD	BOTTOM	QUAD	BOTTOM	QUAD
宽度	11 mm	14 mm	11 mm	11 mm	14 mm	14 mm	11 mm	14 mm	11 mm	14 mm
uPs/uCs/外围集成电路类型	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER
厂商名称	LAPIS Semiconductor Co Ltd	LAPIS Semiconductor Co Ltd	LAPIS Semiconductor Co Ltd	-	LAPIS Semiconductor Co Ltd	LAPIS Semiconductor Co Ltd	LAPIS Semiconductor Co Ltd	LAPIS Semiconductor Co Ltd	LAPIS Semiconductor Co Ltd	LAPIS Semiconductor Co Ltd