Microprocessors - MPU ENCRYPT
器件类别:嵌入式处理器和控制器 微控制器和处理器
厂商名称:NXP(恩智浦)
厂商官网:https://www.nxp.com
器件标准:
下载文档型号 | MPC8314EVRAFDA | MPC8314EVRAGDA | MPC8314CVRAGDA | MPC8314CVRADDA | MPC8314VRADDA | MPC8314ECVRADDA | MPC8314CVRAFDA | MPC8314VRAGDA | MPC8314ECVRAGDA | MPC8314VRAFDA |
---|---|---|---|---|---|---|---|---|---|---|
描述 | Microprocessors - MPU ENCRYPT | Microprocessors - MPU ENCRYPT | Microprocessors - MPU NON-ENCRYPT | Microprocessors - MPU NON-ENCRYPT | Microprocessors - MPU NON-ENCRYPT | Microprocessors - MPU ENCRYPT | Microprocessors - MPU NON-ENCRYPT | Microprocessors - MPU NON-ENCRYPT | Microprocessors - MPU ENCRYPT | Microprocessors - MPU NON-ENCRYPT |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
零件包装代码 | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA |
包装说明 | 29 X 29 MM, 2.23 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, TEBGA-620 | 29 X 29 MM, 2.23 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, TEBGA-620 | 29 X 29 MM, 2.23 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, TEBGA-620 | 29 X 29 MM, 2.23 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, TEBGA-620 | 29 X 29 MM, 2.23 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, TEBGA-620 | 29 X 29 MM, 2.23 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, TEBGA-620 | 29 X 29 MM, 2.23 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, TEBGA-620 | 29 X 29 MM, 2.23 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, TEBGA-620 | 29 X 29 MM, 2.23 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, TEBGA-620 | 29 X 29 MM, 2.23 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, TEBGA-620 |
针数 | 620 | 620 | 620 | 620 | 620 | 620 | 620 | 620 | 620 | 620 |
Reach Compliance Code | compliant | unknown | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
ECCN代码 | 5A002 | 5A002 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 5A002 | 3A991.A.2 | 3A991.A.2 | 5A002 | 3A991.A.2 |
位大小 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
边界扫描 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
最大时钟频率 | 66.67 MHz | 66.67 MHz | 66.67 MHz | 66.67 MHz | 66.67 MHz | 66.67 MHz | 66.67 MHz | 66.67 MHz | 66.67 MHz | 66.67 MHz |
格式 | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT |
集成缓存 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
JESD-30 代码 | S-PBGA-B620 | S-PBGA-B620 | S-PBGA-B620 | S-PBGA-B620 | S-PBGA-B620 | S-PBGA-B620 | S-PBGA-B620 | S-PBGA-B620 | S-PBGA-B620 | S-PBGA-B620 |
JESD-609代码 | e2 | e2 | e2 | e2 | e2 | e2 | e2 | e2 | e2 | e2 |
长度 | 29 mm | 29 mm | 29 mm | 29 mm | 29 mm | 29 mm | 29 mm | 29 mm | 29 mm | 29 mm |
低功率模式 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
端子数量 | 620 | 620 | 620 | 620 | 620 | 620 | 620 | 620 | 620 | 620 |
最高工作温度 | 105 °C | 105 °C | 105 °C | 105 °C | 105 °C | 105 °C | 105 °C | 105 °C | 105 °C | 105 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | HBGA | HBGA | HBGA | HBGA | HBGA | HBGA | HBGA | HBGA | HBGA | HBGA |
封装等效代码 | BGA620,28X28,40 | BGA620,28X28,40 | BGA620,28X28,40 | BGA620,28X28,40 | BGA620,28X28,40 | BGA620,28X28,40 | BGA620,28X28,40 | BGA620,28X28,40 | BGA620,28X28,40 | BGA620,28X28,40 |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | GRID ARRAY, HEAT SINK/SLUG | GRID ARRAY, HEAT SINK/SLUG | GRID ARRAY, HEAT SINK/SLUG | GRID ARRAY, HEAT SINK/SLUG | GRID ARRAY, HEAT SINK/SLUG | GRID ARRAY, HEAT SINK/SLUG | GRID ARRAY, HEAT SINK/SLUG | GRID ARRAY, HEAT SINK/SLUG | GRID ARRAY, HEAT SINK/SLUG | GRID ARRAY, HEAT SINK/SLUG |
峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
电源 | 1,3.3 V | 1,3.3 V | 1,3.3 V | 1,3.3 V | 1,3.3 V | 1,3.3 V | 1,3.3 V | 1,3.3 V | 1,3.3 V | 1,3.3 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 2.46 mm | 2.46 mm | 2.46 mm | 2.46 mm | 2.46 mm | 2.46 mm | 2.46 mm | 2.46 mm | 2.46 mm | 2.46 mm |
速度 | 333 MHz | 400 MHz | 400 MHz | 266 MHz | 266 MHz | 266 MHz | 333 MHz | 400 MHz | 400 MHz | 333 MHz |
最大供电电压 | 1.05 V | 1.05 V | 1.05 V | 1.05 V | 1.05 V | 1.05 V | 1.05 V | 1.05 V | 1.05 V | 1.05 V |
最小供电电压 | 0.95 V | 0.95 V | 0.95 V | 0.95 V | 0.95 V | 0.95 V | 0.95 V | 0.95 V | 0.95 V | 0.95 V |
标称供电电压 | 1 V | 1 V | 1 V | 1 V | 1 V | 1 V | 1 V | 1 V | 1 V | 1 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | OTHER | OTHER | INDUSTRIAL | INDUSTRIAL | OTHER | INDUSTRIAL | INDUSTRIAL | OTHER | INDUSTRIAL | OTHER |
端子面层 | Tin/Silver (Sn/Ag) | Tin/Silver (Sn/Ag) | Tin/Silver (Sn/Ag) | Tin/Silver (Sn/Ag) | Tin/Silver (Sn/Ag) | Tin/Silver (Sn/Ag) | Tin/Silver (Sn/Ag) | Tin/Silver (Sn/Ag) | Tin/Silver (Sn/Ag) | Tin/Silver (Sn/Ag) |
端子形式 | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
端子节距 | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm |
端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
处于峰值回流温度下的最长时间 | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 |
宽度 | 29 mm | 29 mm | 29 mm | 29 mm | 29 mm | 29 mm | 29 mm | 29 mm | 29 mm | 29 mm |
uPs/uCs/外围集成电路类型 | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR |
Brand Name | Freescale | Freescale | Freescale | Freescale | Freescale | - | Freescale | Freescale | Freescale | Freescale |