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MPC8314EVRAGDA

Microprocessors - MPU ENCRYPT

器件类别:嵌入式处理器和控制器    微控制器和处理器   

厂商名称:NXP(恩智浦)

厂商官网:https://www.nxp.com

器件标准:

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器件参数
参数名称
属性值
Brand Name
Freescale
是否无铅
不含铅
是否Rohs认证
符合
厂商名称
NXP(恩智浦)
零件包装代码
BGA
包装说明
29 X 29 MM, 2.23 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, TEBGA-620
针数
620
Reach Compliance Code
unknown
ECCN代码
5A002
位大小
32
边界扫描
YES
最大时钟频率
66.67 MHz
格式
FLOATING POINT
集成缓存
YES
JESD-30 代码
S-PBGA-B620
JESD-609代码
e2
长度
29 mm
低功率模式
YES
湿度敏感等级
3
端子数量
620
最高工作温度
105 °C
最低工作温度
封装主体材料
PLASTIC/EPOXY
封装代码
HBGA
封装等效代码
BGA620,28X28,40
封装形状
SQUARE
封装形式
GRID ARRAY, HEAT SINK/SLUG
峰值回流温度(摄氏度)
260
电源
1,3.3 V
认证状态
Not Qualified
座面最大高度
2.46 mm
速度
400 MHz
最大供电电压
1.05 V
最小供电电压
0.95 V
标称供电电压
1 V
表面贴装
YES
技术
CMOS
温度等级
OTHER
端子面层
Tin/Silver (Sn/Ag)
端子形式
BALL
端子节距
1 mm
端子位置
BOTTOM
处于峰值回流温度下的最长时间
40
宽度
29 mm
uPs/uCs/外围集成电路类型
MICROPROCESSOR
Base Number Matches
1
文档预览
Freescale Semiconductor
Data Sheet: Technical Data
Document Number: MPC8314EEC
Rev. 2, 11/2011
MPC8314E
PowerQUICC II Pro Processor
Hardware Specifications
This document provides an overview of the MPC8314E
PowerQUICC™ II Pro processor features, including a block
diagram showing the major functional components. The
MPC8314E contains a core built on Power Architecture™
technology. It is a cost-effective, low-power, highly
integrated host processor that addresses the requirements of
several storage, consumer, and industrial applications,
including main CPUs and I/O processors in network attached
storage (NAS), voice over IP (VoIP) router/gateway,
intelligent wireless LAN (WLAN), set top boxes, industrial
controllers, and wireless access points. The MPC8314E
extends the PowerQUICC II Pro family, adding higher CPU
performance, new functionality, and faster interfaces while
addressing the requirements related to time-to-market, price,
power consumption, and package size. Note that while the
MPC8314E supports a security engine, the MPC8314 does
not.
Contents
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
MPC8314E Features . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . 7
Power Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 12
Clock Input Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 13
RESET Initialization . . . . . . . . . . . . . . . . . . . . . . . . . 15
DDR and DDR2 SDRAM . . . . . . . . . . . . . . . . . . . . . 16
DUART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Ethernet: Three-Speed Ethernet, MII Management . 22
USB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Local Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
I
2
C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
PCI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
High-Speed Serial Interfaces (HSSI) . . . . . . . . . . . . 49
PCI Express . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
IPIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
TDM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
Package and Pin Listings . . . . . . . . . . . . . . . . . . . . . 72
Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
Thermal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
System Design Information . . . . . . . . . . . . . . . . . . . 95
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 98
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
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© Freescale Semiconductor, Inc., 2011. All rights reserved.
Overview
1
Overview
The MPC8314E incorporates the e300c3 (MPC603e-based) core, which includes 16 Kbytes of L1
instruction and data caches, on-chip memory management units (MMUs), and floating-point support. In
addition to the e300 core, the SoC platform includes features such as dual enhanced three-speed 10, 100,
1000 Mbps Ethernet controllers (eTSECs) with SGMII support, a 32- or 16-bit DDR1/DDR2 SDRAM
memory controller, a security engine to accelerate control and data plane security protocols, and a high
degree of software compatibility with previous-generation PowerQUICC processor-based designs for
backward compatibility and easier software migration. The MPC8314E also offers peripheral interfaces
such as a 32-bit PCI interface with up to 66 MHz operation, 16-bit enhanced local bus interface with up to
66 MHz operation, TDM interface, and USB 2.0 with an on-chip USB 2.0 PHY.
8314E offers additional high-speed interconnect support with dual single-lane PCI Express interfaces.
When not used for PCI Express, the SerDes interface may be configured to support SGMII. The
MPC8314E security engine (SEC 3.3) allows CPU-intensive cryptographic operations to be offloaded
from the main CPU core. This figure shows a block diagram of the MPC8314E.
MPC8314E
e300c3 Core with
Power Management
DUART
I
2
C
Timers
GPIO
16-KB
I-Cache
Interrupt
Controller
FPU
16-KB
D-Cache
TDM
Enhanced
Local Bus,
SPI
DDR1/DDR2
Controller
Security
Engine 3.3
I/O
Sequencer
(IOS)
PCI
Express
x1
PCI
Express
x1
USB 2.0 HS
Host/Device/OTG
ULPI
On-Chip
HS PHY
eTSEC
eTSEC
RGMII, (R)MII
RTBI, SGMII
RGMII, (R)MII
RTBI, SGMII
PCI
DMA
Note:
The MPC8314 do not include a security engine.
Figure 1. MPC8314E Block Diagram
2
2.1
MPC8314E Features
e300 Core
The following features are supported in the MPC8314E.
The e300 core has the following features:
• Operates at up to 400 MHz
• 16-Kbyte instruction cache, 16-Kbyte data cache
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
2
Freescale Semiconductor
MPC8314E Features
One floating point unit and two integer units
Software-compatible with the Freescale processor families implementing the PowerPC
Architecture
Performance monitor
2.2
Serial Interfaces
The following interfaces are supported in the MPC8314E.
• Two enhanced TSECs (eTSECs)
• Two Ethernet interfaces using one RGMII/MII/RMII/RTBI or SGMII (no GMII)
• Dual UART, one I
2
C, and one SPI interface
2.3
Security Engine
The security engine is optimized to handle all the algorithms associated with IPSec, 802.11i, and iSCSI.
The security engine contains one crypto-channel, a controller, and a set of crypto execution units (EUs).
The execution units are:
• Public key execution unit (PKEU)
— RSA and Diffie-Hellman (to 4096 bits)
— Programmable field size up to 2048 bits
— Elliptic curve cryptography (1023 bits)
— F2m and F(p) modes
— Programmable field size up to 511 bits
• Data encryption standard execution unit (DEU)
— DES, 3DES
— Two key (K1, K2) or three key (K1, K2, K3)
— ECB, CBC, CFB-64 and OFB-64 modes for both DES and 3DES
• Advanced encryption standard unit (AESU)
— Implements the Rinjdael symmetric key cipher
— Key lengths of 128, 192, and 256 bits
— ECB, CBC, CCM, CTR, GCM, CMAC, OFB, CFB, XCBC-MAC and LRW modes
— XOR acceleration
• Message digest execution unit (MDEU)
— SHA with 160-bit, 256-bit, 384-bit and 512-bit message digest
— SHA-384/512
— MD5 with 128-bit message digest
— HMAC with either algorithm
• Random number generator (RNG)
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
3
MPC8314E Features
— Combines a True Random Number Generator (TRNG) and a NIST-approved Pseudo-Random
Number Generator (PRNG) (as described in Annex C of FIPS140-2 and ANSI X9.62).
Cyclical Redundancy Check Hardware Accelerator (CRCA)
— Implements CRC32C as required for iSCSI header and payload checksums, CRC32 as required
for IEEE 802 packets, as well as for programmable 32 bit CRC polynomials
2.4
DDR Memory Controller
The DDR1/DDR2 memory controller includes the following features:
• Single 16- or 32-bit interface supporting both DDR1 and DDR2 SDRAM
• Support for up to 266 MHz data rate
• Support for two physical banks (chip selects), each bank independently addressable
• 64-Mbit to 2-Gbit (for DDR1) and to 4-Gbit (for DDR2) devices with x8/x16 data ports (no direct
x4 support)
• Support for one 16-bit device or two 8-bit devices on a 16-bit bus or two 16-bit devices on a 32-bit
bus
• Support for up to 16 simultaneous open pages
• Supports auto refresh
• On-the-fly power management using CKE
• 1.8-/2.5-V SSTL2 compatible I/O
2.5
PCI Controller
The PCI controller includes the following features:
• Designed to comply with
PCI Local Bus Specification Revision 2.3
• Single 32-bit data PCI interface operates at up to 66 MHz
• PCI 3.3-V compatible (not 5-V compatible)
• Support for host and agent modes
• On-chip arbitration, supporting three external masters on PCI
• Selectable hardware-enforced coherency
2.6
TDM Interface
The TDM interface includes the following features:
• Independent receive and transmit with dedicated data, clock and frame sync line
• Separate or shared RCK and TCK whose source can be either internal or external
• Glueless interface to E1/T1 frames and MVIP, SCAS, and H.110 buses
• Up to 128 time slots, where each slot can be programmed to be active or inactive
• 8- or 16-bit word widths
• The TDM Transmitter Sync Signal (TFS), Transmitter Clock Signal (TCK) and Receiver Clock
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
4
Freescale Semiconductor
MPC8314E Features
Signal (RCK) can be configured as either input or output
Frame sync and data signals can be programmed to be sampled either on the rising edge or on the
falling edge of the clock
Frame sync can be programmed as active low or active high
Selectable delay (0–3 bits) between the Frame Sync signal and the beginning of the frame
MSB or LSB first support
2.7
USB Dual-Role Controller
The USB controller includes the following features:
• Designed to comply with
USB Specification, Rev. 2.0
• Supports operation as a stand-alone USB device
— Supports one upstream facing port
— Supports three programmable USB endpoints
• Supports operation as a stand-alone USB host controller
— Supports USB root hub with one downstream-facing port
— Enhanced host controller interface (EHCI) compatible
• Supports high-speed (480 Mbps), full-speed (12 Mbps), and low-speed (1.5 Mbps) operation.
Low-speed operation is supported only in host mode.
• Supports UTMI+ low pin interface (ULPI) or on-chip USB-2.0 full-speed/high-speed PHY
• Supports USB on-the-go mode, which includes both device and host functionality, when using an
external ULPI PHY
2.8
Dual PCI Express Interfaces
The PCI Express interfaces have the following features:
• PCI Express 1.0a compatible
• x1 link width
• Selectable operation as root complex or endpoint
• Both 32- and 64-bit addressing
• 128-byte maximum payload size
• Support for MSI and INTx interrupt messages
• Virtual channel 0 only
• Selectable Traffic Class
• Full 64-bit decode with 32-bit wide windows
• Dedicated descriptor based DMA engine per interface with separate read and write channels
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
5
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参数对比
与MPC8314EVRAGDA相近的元器件有:MPC8314CVRAGDA、MPC8314CVRADDA、MPC8314VRADDA、MPC8314ECVRADDA、MPC8314EVRAFDA、MPC8314CVRAFDA、MPC8314VRAGDA、MPC8314ECVRAGDA、MPC8314VRAFDA。描述及对比如下:
型号 MPC8314EVRAGDA MPC8314CVRAGDA MPC8314CVRADDA MPC8314VRADDA MPC8314ECVRADDA MPC8314EVRAFDA MPC8314CVRAFDA MPC8314VRAGDA MPC8314ECVRAGDA MPC8314VRAFDA
描述 Microprocessors - MPU ENCRYPT Microprocessors - MPU NON-ENCRYPT Microprocessors - MPU NON-ENCRYPT Microprocessors - MPU NON-ENCRYPT Microprocessors - MPU ENCRYPT Microprocessors - MPU ENCRYPT Microprocessors - MPU NON-ENCRYPT Microprocessors - MPU NON-ENCRYPT Microprocessors - MPU ENCRYPT Microprocessors - MPU NON-ENCRYPT
是否无铅 不含铅 不含铅 不含铅 不含铅 不含铅 不含铅 不含铅 不含铅 不含铅 不含铅
是否Rohs认证 符合 符合 符合 符合 符合 符合 符合 符合 符合 符合
厂商名称 NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦)
零件包装代码 BGA BGA BGA BGA BGA BGA BGA BGA BGA BGA
包装说明 29 X 29 MM, 2.23 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, TEBGA-620 29 X 29 MM, 2.23 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, TEBGA-620 29 X 29 MM, 2.23 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, TEBGA-620 29 X 29 MM, 2.23 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, TEBGA-620 29 X 29 MM, 2.23 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, TEBGA-620 29 X 29 MM, 2.23 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, TEBGA-620 29 X 29 MM, 2.23 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, TEBGA-620 29 X 29 MM, 2.23 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, TEBGA-620 29 X 29 MM, 2.23 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, TEBGA-620 29 X 29 MM, 2.23 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, TEBGA-620
针数 620 620 620 620 620 620 620 620 620 620
Reach Compliance Code unknown compliant compliant compliant compliant compliant compliant compliant compliant compliant
ECCN代码 5A002 3A991.A.2 3A991.A.2 3A991.A.2 5A002 5A002 3A991.A.2 3A991.A.2 5A002 3A991.A.2
位大小 32 32 32 32 32 32 32 32 32 32
边界扫描 YES YES YES YES YES YES YES YES YES YES
最大时钟频率 66.67 MHz 66.67 MHz 66.67 MHz 66.67 MHz 66.67 MHz 66.67 MHz 66.67 MHz 66.67 MHz 66.67 MHz 66.67 MHz
格式 FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT
集成缓存 YES YES YES YES YES YES YES YES YES YES
JESD-30 代码 S-PBGA-B620 S-PBGA-B620 S-PBGA-B620 S-PBGA-B620 S-PBGA-B620 S-PBGA-B620 S-PBGA-B620 S-PBGA-B620 S-PBGA-B620 S-PBGA-B620
JESD-609代码 e2 e2 e2 e2 e2 e2 e2 e2 e2 e2
长度 29 mm 29 mm 29 mm 29 mm 29 mm 29 mm 29 mm 29 mm 29 mm 29 mm
低功率模式 YES YES YES YES YES YES YES YES YES YES
湿度敏感等级 3 3 3 3 3 3 3 3 3 3
端子数量 620 620 620 620 620 620 620 620 620 620
最高工作温度 105 °C 105 °C 105 °C 105 °C 105 °C 105 °C 105 °C 105 °C 105 °C 105 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 HBGA HBGA HBGA HBGA HBGA HBGA HBGA HBGA HBGA HBGA
封装等效代码 BGA620,28X28,40 BGA620,28X28,40 BGA620,28X28,40 BGA620,28X28,40 BGA620,28X28,40 BGA620,28X28,40 BGA620,28X28,40 BGA620,28X28,40 BGA620,28X28,40 BGA620,28X28,40
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 GRID ARRAY, HEAT SINK/SLUG GRID ARRAY, HEAT SINK/SLUG GRID ARRAY, HEAT SINK/SLUG GRID ARRAY, HEAT SINK/SLUG GRID ARRAY, HEAT SINK/SLUG GRID ARRAY, HEAT SINK/SLUG GRID ARRAY, HEAT SINK/SLUG GRID ARRAY, HEAT SINK/SLUG GRID ARRAY, HEAT SINK/SLUG GRID ARRAY, HEAT SINK/SLUG
峰值回流温度(摄氏度) 260 260 260 260 260 260 260 260 260 260
电源 1,3.3 V 1,3.3 V 1,3.3 V 1,3.3 V 1,3.3 V 1,3.3 V 1,3.3 V 1,3.3 V 1,3.3 V 1,3.3 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 2.46 mm 2.46 mm 2.46 mm 2.46 mm 2.46 mm 2.46 mm 2.46 mm 2.46 mm 2.46 mm 2.46 mm
速度 400 MHz 400 MHz 266 MHz 266 MHz 266 MHz 333 MHz 333 MHz 400 MHz 400 MHz 333 MHz
最大供电电压 1.05 V 1.05 V 1.05 V 1.05 V 1.05 V 1.05 V 1.05 V 1.05 V 1.05 V 1.05 V
最小供电电压 0.95 V 0.95 V 0.95 V 0.95 V 0.95 V 0.95 V 0.95 V 0.95 V 0.95 V 0.95 V
标称供电电压 1 V 1 V 1 V 1 V 1 V 1 V 1 V 1 V 1 V 1 V
表面贴装 YES YES YES YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 OTHER INDUSTRIAL INDUSTRIAL OTHER INDUSTRIAL OTHER INDUSTRIAL OTHER INDUSTRIAL OTHER
端子面层 Tin/Silver (Sn/Ag) Tin/Silver (Sn/Ag) Tin/Silver (Sn/Ag) Tin/Silver (Sn/Ag) Tin/Silver (Sn/Ag) Tin/Silver (Sn/Ag) Tin/Silver (Sn/Ag) Tin/Silver (Sn/Ag) Tin/Silver (Sn/Ag) Tin/Silver (Sn/Ag)
端子形式 BALL BALL BALL BALL BALL BALL BALL BALL BALL BALL
端子节距 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
处于峰值回流温度下的最长时间 40 40 40 40 40 40 40 40 40 40
宽度 29 mm 29 mm 29 mm 29 mm 29 mm 29 mm 29 mm 29 mm 29 mm 29 mm
uPs/uCs/外围集成电路类型 MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR
Brand Name Freescale Freescale Freescale Freescale - Freescale Freescale Freescale Freescale Freescale
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