MR1A16ACMA35,MR1A16ACMA35 pdf中文资料,MR1A16ACMA35引脚图,MR1A16ACMA35电路-Datasheet-电子工程世界

器件参数

参数名称

属性值

是否Rohs认证

符合

零件包装代码

BGA

包装说明

LFBGA,

针数

Reach Compliance Code

compliant

ECCN代码

EAR99

JESD-30 代码

S-PBGA-B48

长度

8 mm

内存密度

2097152 bit

内存集成电路类型

MEMORY CIRCUIT

内存宽度

功能数量

端子数量

字数

131072 words

字数代码

128000

工作模式

ASYNCHRONOUS

最高工作温度

85 °C

最低工作温度

-40 °C

组织

128KX16

封装主体材料

PLASTIC/EPOXY

封装代码

LFBGA

封装形状

SQUARE

封装形式

GRID ARRAY, LOW PROFILE, FINE PITCH

峰值回流温度（摄氏度）

260

认证状态

Not Qualified

座面最大高度

1.35 mm

最大供电电压 (Vsup)

3.6 V

最小供电电压 (Vsup)

3 V

标称供电电压 (Vsup)

3.3 V

表面贴装

YES

技术

CMOS

温度等级

INDUSTRIAL

端子形式

BALL

端子节距

0.75 mm

端子位置

BOTTOM

处于峰值回流温度下的最长时间

宽度

8 mm

Base Number Matches

文档预览

MR1A16A

128Kx16 MRAM Memory

Features

•Fast 35 ns Read/Write Cycle

• SRAM Compatible Timing and Pin-out Uses Existing SRAM

Controllers Without Redesign

• Unlimited Read & Write Endurance

• Data Always Non-volatile for >20-years at Temperature

• One Memory Replaces Flash, SRAM, EEPROM and BBRAM in System

for Simpler, More Efficient Design

• Replace battery-backed SRAM solutions with MRAM to eliminate

battery assembly, reliability, and liability issues

• 3.3 Volt Power Supply

• Automatic Data Protection on Power Loss

• Commercial, Industrial, Extended Temperatures

• RoHS-Compliant SRAM-compatible TSOPII Package

• RoHS-Compliant SRAM-compatible BGA Package Shrinks Board Area

By Three Times

44-TSOP

48-BGA

Introduction

The MR1A16A is a 2,097,152-bit magnetoresistive random access memory (MRAM) device organized as

131,072 words of 16 bits. The MR1A16A offers SRAM compatible 35 ns read/write timing with

unlimited endurance. Data is always non-volatile for greater than 20-years. Data is automatically

protected on power loss by low-voltage inhibit circuitry to prevent writes with voltage out of

specification. The MR1A16A is the ideal memory solution for applications that must permanently store

and retrieve critical data and programs quickly.

The MR1A16A is available in small footprint 400-mil, 44-lead plastic small-outline TSOP type-II package

or 8 mm x 8 mm, 48-pin ball grid array (BGA) package with 0.75 mm ball centers. These packages are

compatible with similar low-power SRAM products and other non-volatile RAM products.

The MR1A16A provides highly reliable data storage over a wide range of temperatures. The product is

∘

offered with commercial temperature (0 to +70 C), industrial temperature (-40 to +85 C), and

∘

extended temperature (-40 to +105 C) range options.

EverSpin Technologies

Data Sheet: Advance Information

Document Number: MR1A16A

Rev. 4, 9/2008

Device Pin Assignment

48-Pin BGA

44-Pin TSOP Type II

EverSpin Technologies

Data Sheet: Advance Information

Document Number: MR1A16A

Rev. 4, 9/2008

Electrical Specifications

Absolute Maximum Ratings

This device contains circuitry to protect the inputs against damage caused by high static voltages or

electric fields; however, it is advised that normal precautions be taken to avoid application of any

voltage greater than maximum rated voltages to these high-impedance (Hi-Z) circuits.

The device also contains protection against external magnetic fields. Precautions should be taken

to avoid application of any magnetic field more intense than the maximum field intensity specified

in the maximum ratings.

EverSpin Technologies

Data Sheet: Advance Information

Document Number: MR1A16A

Rev. 4, 9/2008

Power Up and Power Down Sequencing

MRAM is protected from write operations whenever V

is less than V

. As soon as V

exceeds V

DDmin

, there is a startup time of 2 ms before read or write operations can start.

This time allows memory power supplies to stabilize. The /E and /W control signals should

track V

on power up to V

-0.2v or V

(whichever is lower) and remain high for the

startup time. In most systems, this means that these signals should be pulled up with a

resistor so that signal remains high if the driving signal is Hi-Z during power up. Any logic

that drives /E and /W should hold the signals high with a power-on reset signal for longer

than the startup time. During power loss or brownout where V

goes below V

, writes are

protected and a startup time must be observed when power returns above V

DDmin

EverSpin Technologies

Data Sheet: Advance Information

Document Number: MR1A16A

Rev. 4, 9/2008

EverSpin Technologies

Data Sheet: Advance Information

Document Number: MR1A16A

Rev. 4, 9/2008

参数对比

与MR1A16ACMA35相近的元器件有：MR1A16ACYS35、MR1A16ACYS35R、MR1A16AVYS35、MR1A16AVYS35R、MR1A16AVMA35、MR1A16AYS35、MR1A16AYS35R、MR1A16AMA35。描述及对比如下：

型号	MR1A16ACMA35	MR1A16ACYS35	MR1A16ACYS35R	MR1A16AVYS35	MR1A16AVYS35R	MR1A16AVMA35	MR1A16AYS35	MR1A16AYS35R	MR1A16AMA35
描述	Memory Circuit, 128KX16, CMOS, PBGA48, 8 X 8 MM, ROHS COMPLIANT, FBGA-48	Memory Circuit, 128KX16, CMOS, PDSO44, 0.400 INCH, ROHS COMPLIANT, PLASTIC, TSOP2-44	Memory Circuit, 128KX16, CMOS, PDSO44, 0.400 INCH, ROHS COMPLIANT, PLASTIC, TSOP2-44	Memory Circuit, 128KX16, CMOS, PDSO44, 0.400 INCH, ROHS COMPLIANT, PLASTIC, TSOP2-44	Memory Circuit, 128KX16, CMOS, PDSO44, 0.400 INCH, ROHS COMPLIANT, PLASTIC, TSOP2-44	Memory Circuit, 128KX16, CMOS, PBGA48, 8 X 8 MM, ROHS COMPLIANT, FBGA-48	Memory Circuit, 128KX16, CMOS, PDSO44, 0.400 INCH, ROHS COMPLIANT, PLASTIC, TSOP2-44	Memory Circuit, 128KX16, CMOS, PDSO44, 0.400 INCH, ROHS COMPLIANT, PLASTIC, TSOP2-44	Memory Circuit, 128KX16, CMOS, PBGA48, 8 X 8 MM, ROHS COMPLIANT, FBGA-48
是否Rohs认证	符合	符合	符合	符合	符合	符合	符合	符合	符合
零件包装代码	BGA	TSOP2	TSOP2	TSOP2	TSOP2	BGA	TSOP2	TSOP2	BGA
包装说明	LFBGA,	TSOP2, TSOP44,.46,32	TSOP2,	TSOP2, TSOP44,.46,32	TSOP2,	LFBGA,	TSOP2, TSOP44,.46,32	TSOP2,	LFBGA,
针数	48	44	44	44	44	48	44	44	48
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
JESD-30 代码	S-PBGA-B48	R-PDSO-G44	R-PDSO-G44	R-PDSO-G44	R-PDSO-G44	S-PBGA-B48	R-PDSO-G44	R-PDSO-G44	S-PBGA-B48
长度	8 mm	18.41 mm	18.41 mm	18.41 mm	18.41 mm	8 mm	18.41 mm	18.41 mm	8 mm
内存密度	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit
内存集成电路类型	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT
内存宽度	16	16	16	16	16	16	16	16	16
功能数量	1	1	1	1	1	1	1	1	1
端子数量	48	44	44	44	44	48	44	44	48
字数	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words
字数代码	128000	128000	128000	128000	128000	128000	128000	128000	128000
工作模式	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	85 °C	85 °C	85 °C	105 °C	105 °C	105 °C	70 °C	70 °C	70 °C
最低工作温度	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-	-	-
组织	128KX16	128KX16	128KX16	128KX16	128KX16	128KX16	128KX16	128KX16	128KX16
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	LFBGA	TSOP2	TSOP2	TSOP2	TSOP2	LFBGA	TSOP2	TSOP2	LFBGA
封装形状	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	SQUARE
封装形式	GRID ARRAY, LOW PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	GRID ARRAY, LOW PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	GRID ARRAY, LOW PROFILE, FINE PITCH
峰值回流温度（摄氏度）	260	NOT SPECIFIED	260	NOT SPECIFIED	260	260	NOT SPECIFIED	260	260
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	1.35 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.35 mm	1.2 mm	1.2 mm	1.35 mm
最大供电电压 (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
最小供电电压 (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
标称供电电压 (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
端子形式	BALL	GULL WING	GULL WING	GULL WING	GULL WING	BALL	GULL WING	GULL WING	BALL
端子节距	0.75 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.75 mm	0.8 mm	0.8 mm	0.75 mm
端子位置	BOTTOM	DUAL	DUAL	DUAL	DUAL	BOTTOM	DUAL	DUAL	BOTTOM
处于峰值回流温度下的最长时间	40	NOT SPECIFIED	40	NOT SPECIFIED	40	40	NOT SPECIFIED	40	40
宽度	8 mm	10.16 mm	10.16 mm	10.16 mm	10.16 mm	8 mm	10.16 mm	10.16 mm	8 mm
厂商名称	-	Everspin Technologies	Everspin Technologies	Everspin Technologies	Everspin Technologies	Everspin Technologies	Everspin Technologies	Everspin Technologies	Everspin Technologies