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MRF6V3090NBR5

RF MOSFET Transistors VHV6 860MHz 90W TO 272WB4

器件类别:分立半导体    晶体管   

厂商名称:NXP(恩智浦)

厂商官网:https://www.nxp.com

器件标准:

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器件参数
参数名称
属性值
是否无铅
含铅
是否Rohs认证
符合
厂商名称
NXP(恩智浦)
零件包装代码
TO-272
包装说明
ROHS COMPLIANT, PLASTIC, CASE 1484-04, WB-4
针数
4
制造商包装代码
CASE 1484-04
Reach Compliance Code
not_compliant
ECCN代码
EAR99
其他特性
ESD PROTECTION
外壳连接
SOURCE
配置
SINGLE
最小漏源击穿电压
115 V
FET 技术
METAL-OXIDE SEMICONDUCTOR
最高频带
ULTRA HIGH FREQUENCY BAND
JEDEC-95代码
TO-272
JESD-30 代码
R-PDFM-F4
JESD-609代码
e3
湿度敏感等级
3
元件数量
1
端子数量
4
工作模式
ENHANCEMENT MODE
最高工作温度
225 °C
封装主体材料
PLASTIC/EPOXY
封装形状
RECTANGULAR
封装形式
FLANGE MOUNT
峰值回流温度(摄氏度)
260
极性/信道类型
N-CHANNEL
认证状态
Not Qualified
表面贴装
YES
端子面层
Matte Tin (Sn)
端子形式
FLAT
端子位置
DUAL
处于峰值回流温度下的最长时间
40
晶体管应用
AMPLIFIER
晶体管元件材料
SILICON
文档预览
Freescale Semiconductor
Technical Data
Document Number: MRF6V3090N
Rev. 2, 10/2015
RF Power LDMOS Transistors
N--Channel Enhancement--Mode Lateral MOSFETs
Designed for broadcast and commercial aerospace broadband applications
with frequencies from 470 to 1215 MHz.
Typical Performance (UHF 470--860 Reference Circuit): V
DD
= 50 Volts,
I
DQ
= 450 mA, 64 QAM, Input Signal PAR = 9.5 dB @ 0.01% Probability
on CCDF.
P
out
(W)
18 Avg.
f
(MHz)
470
650
860
G
ps
(dB)
21.6
22.9
21.9
D
(%)
26.8
28.0
28.3
Output
Signal PAR
(dB)
8.6
8.7
7.9
IMD
Shoulder
(dBc)
--31.8
--34.4
--29.2
MRF6V3090N
MRF6V3090NB
Signal Type
DVB--T (8k OFDM)
470-
-1215 MHz, 90 W, 50 V
BROADBAND
RF POWER LDMOS TRANSISTORS
Typical Performance (L--Band 960--1215 MHz Reference Circuit):
V
DD
= 50 Volts, I
DQ
= 100 mA.
Signal Type
Pulse
(128
sec,
10% Duty
Cycle)
P
out
(W)
90 Peak
f
(MHz)
960
1030
1090
1215
P
in
(W)
1.3
1.41
1.65
1.68
G
ps
(dB)
18.4
18
17.4
17.3
D
(%)
55.3
56.9
50.7
51.0
TO-
-270WB-
-4
PLASTIC
MRF6V3090N
Features
Capable of Handling 10:1 VSWR, All Phase Angles, @ 50 Vdc, 860 MHz,
90 Watts CW Output Power
Characterized with Series Equivalent Large--Signal Impedance Parameters
Internally Input Matched for Ease of Use
Qualified Up to a Maximum of 50 V
DD
Operation
Integrated ESD Protection
Excellent Thermal Stability
Greater Negative Gate--Source Voltage Range for Improved Class C
Operation
TO-
-272WB-
-4
PLASTIC
MRF6V3090NB
PARTS ARE SINGLE-
-ENDED
Gate
Drain
Gate
Drain
(Top View)
Note: Exposed backside of the package is
the source terminal for the transistor.
Figure 1. Pin Connections
Freescale Semiconductor, Inc., 2010--2011, 2015. All rights reserved.
MRF6V3090N MRF6V3090NB
1
RF Device Data
Freescale Semiconductor, Inc.
Table 1. Maximum Ratings
Rating
Drain--Source Voltage
Gate--Source Voltage
Storage Temperature Range
Case Operating Temperature
Operating Junction Temperature
(1,2)
Symbol
V
DSS
V
GS
T
stg
T
C
T
J
Symbol
R
JC
Value
--0.5, +110
--6.0, +10
-- 65 to +150
150
225
Value
(2,3)
0.79
0.82
Unit
Vdc
Vdc
C
C
C
Unit
C/W
Table 2. Thermal Characteristics
Characteristic
Thermal Resistance, Junction to Case
Case Temperature 76C, 18 W CW, 50 Vdc, I
DQ
= 350 mA, 860 MHz
Case Temperature 80C, 90 W CW, 50 Vdc, I
DQ
= 350 mA, 860 MHz
Table 3. ESD Protection Characteristics
Test Methodology
Human Body Model (per JESD22--A114)
Machine Model (per EIA/JESD22--A115)
Charge Device Model (per JESD22--C101)
Class
2 (2001--4000 V)
B (201--400 V)
IV (>1000 V)
Table 4. Moisture Sensitivity Level
Test Methodology
Per JESD22--A113, IPC/JEDEC J--STD--020
Rating
3
Package Peak Temperature
260
Unit
C
Table 5. Electrical Characteristics
(T
A
= 25C unless otherwise noted)
Characteristic
Off Characteristics
Gate--Source Leakage Current
(V
GS
= 5 Vdc, V
DS
= 0 Vdc)
Drain--Source Breakdown Voltage
(I
D
= 50 mA, V
GS
= 0 Vdc)
Zero Gate Voltage Drain Leakage Current
(V
DS
= 50 Vdc, V
GS
= 0 Vdc)
Zero Gate Voltage Drain Leakage Current
(V
DS
= 100 Vdc, V
GS
= 0 Vdc)
On Characteristics
Gate Threshold Voltage
(V
DS
= 10 Vdc, I
D
= 200
Adc)
Gate Quiescent Voltage
(V
DD
= 50 Vdc, I
D
= 350 mAdc, Measured in Functional Test)
Drain--Source On--Voltage
(V
GS
= 10 Vdc, I
D
= 0.5 Adc)
Dynamic Characteristics
Reverse Transfer Capacitance
(V
DS
= 50 Vdc
30 mV(rms)ac @ 1 MHz, V
GS
= 0 Vdc)
Output Capacitance
(V
DS
= 50 Vdc
30 mV(rms)ac @ 1 MHz, V
GS
= 0 Vdc)
Input Capacitance
(4)
(V
DS
= 50 Vdc, V
GS
= 0 Vdc
30 mV(rms)ac @ 1 MHz)
C
rss
C
oss
C
iss
41
65.4
591
pF
pF
pF
V
GS(th)
V
GS(Q)
V
DS(on)
0.9
2.0
1.6
2.7
0.2
2.4
3.5
Vdc
Vdc
Vdc
I
GSS
V
(BR)DSS
I
DSS
I
DSS
115
0.5
10
20
Adc
Vdc
Adc
Adc
Symbol
Min
Typ
Max
Unit
1. Continuous use at maximum temperature will affect MTTF.
2. MTTF calculator available at http://www.freescale.com/rf. Select Software & Tools/Development Tools/Calculators to access MTTF
calculators by product.
3. Refer to AN1955,
Thermal Measurement Methodology of RF Power Amplifiers.
Go to http://www.freescale.com/rf.
Select Documentation/Application Notes -- AN1955.
4. Part internally input matched.
(continued)
MRF6V3090N MRF6V3090NB
2
RF Device Data
Freescale Semiconductor, Inc.
Table 5. Electrical Characteristics
(T
A
= 25C unless otherwise noted)
(continued)
Characteristic
Symbol
Min
Typ
Max
Unit
Functional Tests
(In Freescale DVB--T Narrowband Test Fixture, 50 ohm system) V
DD
= 50 Vdc, I
DQ
= 350 mA, P
out
= 18 W Avg.,
f = 860 MHz, DVB--T (8k OFDM) Single Channel. ACPR measured in 7.61 MHz Channel Bandwidth @
4
MHz Offset @ 4 kHz Bandwidth.
Power Gain
Drain Efficiency
Adjacent Channel Power Ratio
Input Return Loss
G
ps
D
ACPR
IRL
21.0
27.5
22.0
28.5
--62.0
--14
24.0
--60.0
--9
dB
%
dBc
dB
Table 6. Ordering Information
Device
MRF6V3090NR1
MRF6V3090NBR1
MRF6V3090NR5
MRF6V3090NBR5
Tape and Reel Information
R1 Suffix = 500 Units, 44 mm Tape Width, 13--inch Reel
R5 Suffix = 50 Units, 56 mm Tape Width, 13--inch Reel
Package
TO--270WB--4
TO--272WB--4
TO--270WB--4
TO--272WB--4
MRF6V3090N MRF6V3090NB
RF Device Data
Freescale Semiconductor, Inc.
3
V
BIAS
+
+
C1
R1
C2
C3
Z8
Z10
C8
C9
C10
V
SUPPLY
RF
INPUT
C4 R2
Z1
C5
C6
C7
Z2
Z3
Z4
Z5
Z6
Z7
Z9
Z12
Z13
Z14
Z15 Z16
Z17
C14
Z18
RF
OUTPUT
C15
DUT
Z11
C11
C12
C13
+
C16
C17
C18
Z1
Z2
Z3
Z4
Z5
Z6
Z7
Z8
Z9
0.266
0.067 Microstrip
0.331
0.067 Microstrip
0.598
0.067 Microstrip
0.315
0.276 Microstrip
0.054
0.669 Microstrip
0.419
0.669 Microstrip
0.256
0.669 Microstrip
0.986
0.071 Microstrip
0.201
0.571 Microstrip
Z10, Z11
Z12
Z13
Z14
Z15
Z16
Z17
Z18
1.292
0.079 Microstrip
0.680
0.571 Microstrip
0.132
0.117 Microstrip
0.705
0.117 Microstrip
0.159
0.117 Microstrip
0.140
0.067 Microstrip
0.077
0.067 Microstrip
0.163
0.067 Microstrip
Figure 2. MRF6V3090N 860 MHz Narrowband Test Circuit Schematic
Table 7. MRF6V3090N 860 MHz Narrowband Test Circuit Component Designations and Values
Part
C1
C2, C9, C17
C3, C5, C8, C14, C16
C4
C6
C7
C10, C18
C11, C15
C12
C13
R1
R2
PCB
Description
22
F,
35 V Tantalum Capacitor
10
F,
50 V Chip Capacitors
43 pF Chip Capacitors
6.2 pF Chip Capacitor
2.2 pF Chip Capacitor
9.1 pF Chip Capacitor
220
F,
100 V Electrolytic Capacitors
7.5 pF Chip Capacitors
3.0 pF Chip Capacitor
0.7 pF Chip Capacitor
10 k, 1/4 W Chip Resistor
10
,
1/4 W Chip Resistor
0.030,
r
= 3.5
Part Number
T491X226K035AT
GRM55DR61H106KA88L
ATC100B430JT500XT
ATC100B6R2BT500XT
ATC100B2R2JT500XT
ATC100B9R1CT500XT
EEVFK2A221M
ATC100B7R5CT500XT
ATC100B3R0CT500XT
ATC100B0R7BT500XT
CRCW120610KOJNEA
CRCW120610ROJNEA
RF--35
Manufacturer
Kermet
Murata
ATC
ATC
ATC
ATC
Panasonic--ECG
ATC
ATC
ATC
Vishay
Vishay
Taconic
MRF6V3090N MRF6V3090NB
4
RF Device Data
Freescale Semiconductor, Inc.
C1
C10
C8
R1
C2
C3
C9
C4
R2
CUT OUT AREA
C15
C11
C5
C6
C7
MRF6V3090N
Rev. 0
C12
C16
C17
C18
--
Figure 3. MRF6V3090N 860 MHz Narrowband Test Circuit Component Layout
MRF6V3090N MRF6V3090NB
RF Device Data
Freescale Semiconductor, Inc.
5
--
C14
C13
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参数对比
与MRF6V3090NBR5相近的元器件有:MRF6V3090NR1、MRF6V3090NBR1。描述及对比如下:
型号 MRF6V3090NBR5 MRF6V3090NR1 MRF6V3090NBR1
描述 RF MOSFET Transistors VHV6 860MHz 90W TO 272WB4 RF MOSFET Transistors VHV6 860MHz 90W TO 270WB4 RF MOSFET Transistors VHV6 860MHz 90W TO 272WB4
是否无铅 含铅 含铅 含铅
是否Rohs认证 符合 符合 符合
厂商名称 NXP(恩智浦) NXP(恩智浦) NXP(恩智浦)
零件包装代码 TO-272 TO-270 TO-272
包装说明 ROHS COMPLIANT, PLASTIC, CASE 1484-04, WB-4 FLANGE MOUNT, R-PDFM-F4 FLANGE MOUNT, R-PDFM-F4
针数 4 2 4
制造商包装代码 CASE 1484-04 CASE 1486-03 CASE 1484-04
Reach Compliance Code not_compliant not_compliant not_compliant
ECCN代码 EAR99 EAR99 EAR99
其他特性 ESD PROTECTION ESD PROTECTION ESD PROTECTION
外壳连接 SOURCE SOURCE SOURCE
配置 SINGLE SINGLE SINGLE
最小漏源击穿电压 115 V 115 V 115 V
FET 技术 METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
最高频带 ULTRA HIGH FREQUENCY BAND ULTRA HIGH FREQUENCY BAND ULTRA HIGH FREQUENCY BAND
JEDEC-95代码 TO-272 TO-270 TO-272
JESD-30 代码 R-PDFM-F4 R-PDFM-F4 R-PDFM-F4
JESD-609代码 e3 e3 e3
湿度敏感等级 3 3 3
元件数量 1 1 1
端子数量 4 4 4
工作模式 ENHANCEMENT MODE ENHANCEMENT MODE ENHANCEMENT MODE
最高工作温度 225 °C 225 °C 225 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 FLANGE MOUNT FLANGE MOUNT FLANGE MOUNT
峰值回流温度(摄氏度) 260 260 260
极性/信道类型 N-CHANNEL N-CHANNEL N-CHANNEL
认证状态 Not Qualified Not Qualified Not Qualified
表面贴装 YES YES YES
端子面层 Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn)
端子形式 FLAT FLAT FLAT
端子位置 DUAL DUAL DUAL
处于峰值回流温度下的最长时间 40 40 40
晶体管应用 AMPLIFIER AMPLIFIER AMPLIFIER
晶体管元件材料 SILICON SILICON SILICON
Brand Name - Freescale Freescale
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