型号
- 型号
- 关键词
| 型号 | MSM511000A-70RS | MSM511000A-10ZS | MSM511000A-10RS | MSM511000A-80JS | MSM511000A-10JS | MSM511000A-80ZS |
|---|---|---|---|---|---|---|
| 描述 | Fast Page DRAM, 1MX1, 70ns, CMOS, PDIP18 | Fast Page DRAM, 1MX1, 100ns, CMOS, PZIP20 | Fast Page DRAM, 1MX1, 100ns, CMOS, PDIP18 | Fast Page DRAM, 1MX1, 80ns, CMOS, PDSO20 | Fast Page DRAM, 1MX1, 100ns, CMOS, PDSO20 | Fast Page DRAM, 1MX1, 80ns, CMOS, PZIP20 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd |
| 包装说明 | DIP, DIP18,.3 | ZIP, ZIP20,.1 | DIP, DIP18,.3 | SOJ, SOJ20/26,.34 | SOJ, SOJ20/26,.34 | ZIP, ZIP20,.1 |
| Reach Compliance Code | unknow | unknown | unknown | unknown | unknown | unknown |
| 最长访问时间 | 70 ns | 100 ns | 100 ns | 80 ns | 100 ns | 80 ns |
| I/O 类型 | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE |
| JESD-30 代码 | R-PDIP-T18 | R-PZIP-T20 | R-PDIP-T18 | R-PDSO-J20 | R-PDSO-J20 | R-PZIP-T20 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 内存密度 | 1048576 bi | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit |
| 内存集成电路类型 | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM |
| 内存宽度 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 18 | 20 | 18 | 20 | 20 | 20 |
| 字数 | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
| 字数代码 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 1MX1 | 1MX1 | 1MX1 | 1MX1 | 1MX1 | 1MX1 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | ZIP | DIP | SOJ | SOJ | ZIP |
| 封装等效代码 | DIP18,.3 | ZIP20,.1 | DIP18,.3 | SOJ20/26,.34 | SOJ20/26,.34 | ZIP20,.1 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 刷新周期 | 512 | 512 | 512 | 512 | 512 | 512 |
| 最大待机电流 | 0.001 A | 0.001 A | 0.001 A | 0.001 A | 0.001 A | 0.001 A |
| 最大压摆率 | 0.085 mA | 0.065 mA | 0.065 mA | 0.075 mA | 0.065 mA | 0.075 mA |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | YES | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND | J BEND | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | ZIG-ZAG | DUAL | DUAL | DUAL | ZIG-ZAG |
模拟电子
电源技术
电源技术
工业自动化与控制
嵌入式系统
微控制器 MCU
