| 描述 |
Memory Circuit, 256KX16, CMOS, PDSO64 |
Memory Circuit, 256KX16, CMOS, PDSO64 |
Memory Circuit, 256KX16, CMOS, PDSO64 |
Memory Circuit, 256KX16, CMOS, PDSO64 |
Memory Circuit, 256KX16, CMOS, PDSO64 |
Memory Circuit, 256KX16, CMOS, PDSO64 |
| 是否Rohs认证 |
不符合 |
不符合 |
不符合 |
不符合 |
不符合 |
不符合 |
| 厂商名称 |
LAPIS Semiconductor Co Ltd |
LAPIS Semiconductor Co Ltd |
LAPIS Semiconductor Co Ltd |
LAPIS Semiconductor Co Ltd |
LAPIS Semiconductor Co Ltd |
LAPIS Semiconductor Co Ltd |
| 包装说明 |
TSSOP, TSSOP64/70,.46 |
TSSOP, TSSOP64/70,.46 |
TSSOP, TSSOP64/70,.46 |
TSSOP, TSSOP64/70,.46 |
TSSOP, TSSOP64/70,.46 |
TSSOP, TSSOP64/70,.46 |
| Reach Compliance Code |
unknow |
unknow |
unknow |
unknow |
unknow |
unknow |
| 最长访问时间 |
50 ns |
50 ns |
60 ns |
60 ns |
70 ns |
70 ns |
| JESD-30 代码 |
R-PDSO-G64 |
R-PDSO-G64 |
R-PDSO-G64 |
R-PDSO-G64 |
R-PDSO-G64 |
R-PDSO-G64 |
| JESD-609代码 |
e0 |
e0 |
e0 |
e0 |
e0 |
e0 |
| 内存密度 |
4194304 bi |
4194304 bi |
4194304 bi |
4194304 bi |
4194304 bi |
4194304 bi |
| 内存集成电路类型 |
MEMORY CIRCUIT |
MEMORY CIRCUIT |
MEMORY CIRCUIT |
MEMORY CIRCUIT |
MEMORY CIRCUIT |
MEMORY CIRCUIT |
| 内存宽度 |
16 |
16 |
16 |
16 |
16 |
16 |
| 端子数量 |
64 |
64 |
64 |
64 |
64 |
64 |
| 字数 |
262144 words |
262144 words |
262144 words |
262144 words |
262144 words |
262144 words |
| 字数代码 |
256000 |
256000 |
256000 |
256000 |
256000 |
256000 |
| 最高工作温度 |
70 °C |
70 °C |
70 °C |
70 °C |
70 °C |
70 °C |
| 组织 |
256KX16 |
256KX16 |
256KX16 |
256KX16 |
256KX16 |
256KX16 |
| 封装主体材料 |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| 封装代码 |
TSSOP |
TSSOP |
TSSOP |
TSSOP |
TSSOP |
TSSOP |
| 封装等效代码 |
TSSOP64/70,.46 |
TSSOP64/70,.46 |
TSSOP64/70,.46 |
TSSOP64/70,.46 |
TSSOP64/70,.46 |
TSSOP64/70,.46 |
| 封装形状 |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
| 封装形式 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 电源 |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
| 认证状态 |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| 最大待机电流 |
0.008 A |
0.008 A |
0.008 A |
0.008 A |
0.008 A |
0.008 A |
| 最大压摆率 |
0.16 mA |
0.16 mA |
0.15 mA |
0.15 mA |
0.14 mA |
0.14 mA |
| 标称供电电压 (Vsup) |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
| 表面贴装 |
YES |
YES |
YES |
YES |
YES |
YES |
| 技术 |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
| 温度等级 |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
| 端子面层 |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
| 端子形式 |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
| 端子节距 |
0.635 mm |
0.635 mm |
0.635 mm |
0.635 mm |
0.635 mm |
0.635 mm |
| 端子位置 |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |