与MSM6352RS40相近的元器件有:MSM6352GS-K、MSM6352RS28。描述及对比如下:
| 型号 |
MSM6352RS40 |
MSM6352GS-K |
MSM6352RS28 |
| 描述 |
Microcontroller, 4-Bit, MROM, OLMS-63 CPU, 3.58MHz, CMOS, PDIP40 |
Microcontroller, 4-Bit, MROM, OLMS-63 CPU, 3.58MHz, CMOS, PQFP44 |
Microcontroller, 4-Bit, MROM, OLMS-63 CPU, 3.58MHz, CMOS, PDIP28 |
| 是否Rohs认证 |
不符合 |
不符合 |
不符合 |
| 厂商名称 |
LAPIS Semiconductor Co Ltd |
LAPIS Semiconductor Co Ltd |
LAPIS Semiconductor Co Ltd |
| 包装说明 |
DIP, DIP40,.6 |
QFP, QFP44,.53X.57,32 |
DIP, DIP28,.6 |
| Reach Compliance Code |
unknown |
unknown |
unknown |
| 位大小 |
4 |
4 |
4 |
| CPU系列 |
OLMS-63 |
OLMS-63 |
OLMS-63 |
| JESD-30 代码 |
R-PDIP-T40 |
R-PQFP-G44 |
R-PDIP-T28 |
| JESD-609代码 |
e0 |
e0 |
e0 |
| 端子数量 |
40 |
44 |
28 |
| 最高工作温度 |
70 °C |
70 °C |
70 °C |
| 最低工作温度 |
-20 °C |
-20 °C |
-20 °C |
| 封装主体材料 |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| 封装代码 |
DIP |
QFP |
DIP |
| 封装等效代码 |
DIP40,.6 |
QFP44,.53X.57,32 |
DIP28,.6 |
| 封装形状 |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
| 封装形式 |
IN-LINE |
FLATPACK |
IN-LINE |
| 电源 |
2.2/5.5 V |
2.2/5.5 V |
2.2/5.5 V |
| 认证状态 |
Not Qualified |
Not Qualified |
Not Qualified |
| RAM(字节) |
320 |
320 |
320 |
| ROM(单词) |
2048 |
2048 |
2048 |
| ROM可编程性 |
MROM |
MROM |
MROM |
| 速度 |
3.58 MHz |
3.58 MHz |
3.58 MHz |
| 最大压摆率 |
6.8 mA |
6.8 mA |
6.8 mA |
| 表面贴装 |
NO |
YES |
NO |
| 技术 |
CMOS |
CMOS |
CMOS |
| 温度等级 |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
| 端子面层 |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
| 端子形式 |
THROUGH-HOLE |
GULL WING |
THROUGH-HOLE |
| 端子节距 |
2.54 mm |
0.8 mm |
2.54 mm |
| 端子位置 |
DUAL |
QUAD |
DUAL |