型号
- 型号
- 关键词
Fast Page DRAM Module, 1MX32, 70ns, CMOS, PDMA72,
厂商名称：Micron Technology
厂商官网：http://www.mdtic.com.tw/
下载文档| 型号 | MT2LD132HG-7L | MT8LD132M8SX | MT16D232G-10 | MT16D232Z-8 | MT16D232Z-10 | MT16D232Z-7 | MT16D232M-10 | MT8LD132M7SX | MT16LD232M7SX |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Fast Page DRAM Module, 1MX32, 70ns, CMOS, PDMA72, | Memory IC | MEMORY MODULE,DRAM,FAST PAGE,2MX32,CMOS,SSIM,72PIN,PLASTIC | MEMORY MODULE,DRAM,FAST PAGE,2MX32,CMOS,ZIP,72PIN,PLASTIC | MEMORY MODULE,DRAM,FAST PAGE,2MX32,CMOS,ZIP,72PIN,PLASTIC | MEMORY MODULE,DRAM,FAST PAGE,2MX32,CMOS,ZIP,72PIN,PLASTIC | MEMORY MODULE,DRAM,FAST PAGE,2MX32,CMOS,SSIM,72PIN,PLASTIC | Memory IC | Memory IC |
| Reach Compliance Code | unknown | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| 是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | - | - |
| 最长访问时间 | 70 ns | - | 100 ns | 80 ns | 100 ns | 70 ns | 100 ns | - | - |
| I/O 类型 | COMMON | - | COMMON | COMMON | COMMON | COMMON | COMMON | - | - |
| JESD-30 代码 | R-PDMA-N72 | - | R-PSMA-N72 | R-PZIP-T72 | R-PZIP-T72 | R-PZIP-T72 | R-PSMA-N72 | - | - |
| 内存密度 | 33554432 bit | - | 67108864 bit | 67108864 bit | 67108864 bit | 67108864 bit | 67108864 bit | - | - |
| 内存集成电路类型 | FAST PAGE DRAM MODULE | - | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | - | - |
| 端子数量 | 72 | - | 72 | 72 | 72 | 72 | 72 | - | - |
| 字数 | 1048576 words | - | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | - | - |
| 字数代码 | 1000000 | - | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | - | - |
| 最高工作温度 | 70 °C | - | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | - | - |
| 组织 | 1MX32 | - | 2MX32 | 2MX32 | 2MX32 | 2MX32 | 2MX32 | - | - |
| 输出特性 | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - | - |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - |
| 封装代码 | DIMM | - | SIMM | ZIP | ZIP | ZIP | SIMM | - | - |
| 封装等效代码 | DIMM72 | - | SSIM72 | ZIP72/76,.1,.1 | ZIP72/76,.1,.1 | ZIP72/76,.1,.1 | SSIM72 | - | - |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | - |
| 封装形式 | MICROELECTRONIC ASSEMBLY | - | MICROELECTRONIC ASSEMBLY | IN-LINE | IN-LINE | IN-LINE | MICROELECTRONIC ASSEMBLY | - | - |
| 电源 | 3.3 V | - | 5 V | 5 V | 5 V | 5 V | 5 V | - | - |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | - |
| 刷新周期 | 1024 | - | 1024 | 1024 | 1024 | 1024 | 1024 | - | - |
| 座面最大高度 | 25.654 mm | - | 25.527 mm | 26.416 mm | 26.416 mm | 26.416 mm | 25.527 mm | - | - |
| 自我刷新 | NO | - | NO | NO | NO | NO | NO | - | - |
| 最大待机电流 | 0.0003 A | - | 0.016 A | 0.016 A | 0.016 A | 0.016 A | 0.016 A | - | - |
| 最大压摆率 | 0.31 mA | - | 0.656 mA | 0.736 mA | 0.656 mA | 0.816 mA | 0.656 mA | - | - |
| 标称供电电压 (Vsup) | 3.3 V | - | 5 V | 5 V | 5 V | 5 V | 5 V | - | - |
| 表面贴装 | NO | - | NO | NO | NO | NO | NO | - | - |
| 技术 | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS | - | - |
| 温度等级 | COMMERCIAL | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | - | - |
| 端子形式 | NO LEAD | - | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | - | - |
| 端子节距 | 1.27 mm | - | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | - | - |
| 端子位置 | DUAL | - | SINGLE | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG | SINGLE | - | - |
| Base Number Matches | - | 1 | 1 | 1 | 1 | 1 | 1 | - | - |
