型号 | MT8LD132M8SX | MT16D232G-10 | MT16D232Z-8 | MT16D232Z-10 | MT16D232Z-7 | MT16D232M-10 | MT8LD132M7SX | MT16LD232M7SX | MT2LD132HG-7L |
---|---|---|---|---|---|---|---|---|---|
描述 | Memory IC | MEMORY MODULE,DRAM,FAST PAGE,2MX32,CMOS,SSIM,72PIN,PLASTIC | MEMORY MODULE,DRAM,FAST PAGE,2MX32,CMOS,ZIP,72PIN,PLASTIC | MEMORY MODULE,DRAM,FAST PAGE,2MX32,CMOS,ZIP,72PIN,PLASTIC | MEMORY MODULE,DRAM,FAST PAGE,2MX32,CMOS,ZIP,72PIN,PLASTIC | MEMORY MODULE,DRAM,FAST PAGE,2MX32,CMOS,SSIM,72PIN,PLASTIC | Memory IC | Memory IC | Fast Page DRAM Module, 1MX32, 70ns, CMOS, PDMA72, |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | unknown |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | - | - | - |
是否Rohs认证 | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | - | - | 不符合 |
最长访问时间 | - | 100 ns | 80 ns | 100 ns | 70 ns | 100 ns | - | - | 70 ns |
I/O 类型 | - | COMMON | COMMON | COMMON | COMMON | COMMON | - | - | COMMON |
JESD-30 代码 | - | R-PSMA-N72 | R-PZIP-T72 | R-PZIP-T72 | R-PZIP-T72 | R-PSMA-N72 | - | - | R-PDMA-N72 |
内存密度 | - | 67108864 bit | 67108864 bit | 67108864 bit | 67108864 bit | 67108864 bit | - | - | 33554432 bit |
内存集成电路类型 | - | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | - | - | FAST PAGE DRAM MODULE |
端子数量 | - | 72 | 72 | 72 | 72 | 72 | - | - | 72 |
字数 | - | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | - | - | 1048576 words |
字数代码 | - | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | - | - | 1000000 |
最高工作温度 | - | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | - | - | 70 °C |
组织 | - | 2MX32 | 2MX32 | 2MX32 | 2MX32 | 2MX32 | - | - | 1MX32 |
输出特性 | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - | - | 3-STATE |
封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY |
封装代码 | - | SIMM | ZIP | ZIP | ZIP | SIMM | - | - | DIMM |
封装等效代码 | - | SSIM72 | ZIP72/76,.1,.1 | ZIP72/76,.1,.1 | ZIP72/76,.1,.1 | SSIM72 | - | - | DIMM72 |
封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | - | RECTANGULAR |
封装形式 | - | MICROELECTRONIC ASSEMBLY | IN-LINE | IN-LINE | IN-LINE | MICROELECTRONIC ASSEMBLY | - | - | MICROELECTRONIC ASSEMBLY |
电源 | - | 5 V | 5 V | 5 V | 5 V | 5 V | - | - | 3.3 V |
认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | - | Not Qualified |
刷新周期 | - | 1024 | 1024 | 1024 | 1024 | 1024 | - | - | 1024 |
座面最大高度 | - | 25.527 mm | 26.416 mm | 26.416 mm | 26.416 mm | 25.527 mm | - | - | 25.654 mm |
自我刷新 | - | NO | NO | NO | NO | NO | - | - | NO |
最大待机电流 | - | 0.016 A | 0.016 A | 0.016 A | 0.016 A | 0.016 A | - | - | 0.0003 A |
最大压摆率 | - | 0.656 mA | 0.736 mA | 0.656 mA | 0.816 mA | 0.656 mA | - | - | 0.31 mA |
标称供电电压 (Vsup) | - | 5 V | 5 V | 5 V | 5 V | 5 V | - | - | 3.3 V |
表面贴装 | - | NO | NO | NO | NO | NO | - | - | NO |
技术 | - | CMOS | CMOS | CMOS | CMOS | CMOS | - | - | CMOS |
温度等级 | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | - | - | COMMERCIAL |
端子形式 | - | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | - | - | NO LEAD |
端子节距 | - | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | - | - | 1.27 mm |
端子位置 | - | SINGLE | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG | SINGLE | - | - | DUAL |