Cache SRAM, 128KX9, 8.5ns, CMOS, PQFP100, PLASTIC, MS-026, TQFP-100
厂商名称:Micron Technology
厂商官网:http://www.mdtic.com.tw/
下载文档型号 | MT58LC32K36B4LG-8.5 | MT58LC32K36B4LG-10 | MT58LC32K36B4LG-9 | MT58LC32K32B4LG-8.5 | MT58LC32K32B4LG-7.5 | MT58LC64K18B4LG-8.5 | MT58LC64K18B4LG-7.5 | MT58LC32K36B4LG-7.5 |
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描述 | Cache SRAM, 128KX9, 8.5ns, CMOS, PQFP100, PLASTIC, MS-026, TQFP-100 | Cache SRAM, 128KX9, 10ns, CMOS, PQFP100, PLASTIC, MS-026, TQFP-100 | Standard SRAM, 128KX9, 9ns, CMOS, PQFP100, PLASTIC, MS-026, TQFP-100 | Cache SRAM, 128KX8, 8.5ns, CMOS, PQFP100, PLASTIC, MS-026, TQFP-100 | Cache SRAM, 128KX8, 7.5ns, CMOS, PQFP100, PLASTIC, MS-026, TQFP-100 | Cache SRAM, 64KX18, 8.5ns, CMOS, PQFP100, PLASTIC, MS-026, TQFP-100 | Cache SRAM, 64KX18, 7.5ns, CMOS, PQFP100, PLASTIC, MS-026, TQFP-100 | Cache SRAM, 128KX9, 7.5ns, CMOS, PQFP100, PLASTIC, MS-026, TQFP-100 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
零件包装代码 | QFP | QFP | QFP | QFP | QFP | QFP | QFP | QFP |
包装说明 | PLASTIC, MS-026, TQFP-100 | PLASTIC, MS-026, TQFP-100 | PLASTIC, MS-026, TQFP-100 | PLASTIC, MS-026, TQFP-100 | PLASTIC, MS-026, TQFP-100 | PLASTIC, MS-026, TQFP-100 | PLASTIC, MS-026, TQFP-100 | PLASTIC, MS-026, TQFP-100 |
针数 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | unknown | not_compliant | not_compliant | not_compliant | not_compliant |
ECCN代码 | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
最长访问时间 | 8.5 ns | 10 ns | 9 ns | 8.5 ns | 7.5 ns | 8.5 ns | 7.5 ns | 7.5 ns |
I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 代码 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
长度 | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm |
内存密度 | 1179648 bit | 1179648 bit | 1179648 bit | 1048576 bit | 1048576 bit | 1179648 bit | 1179648 bit | 1179648 bit |
内存集成电路类型 | CACHE SRAM | CACHE SRAM | STANDARD SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM |
内存宽度 | 9 | 9 | 9 | 8 | 8 | 18 | 18 | 9 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 |
字数 | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 65536 words | 65536 words | 131072 words |
字数代码 | 128000 | 128000 | 128000 | 128000 | 128000 | 64000 | 64000 | 128000 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 128KX9 | 128KX9 | 128KX9 | 128KX8 | 128KX8 | 64KX18 | 64KX18 | 128KX9 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | LQFP | LQFP | LQFP | LQFP | LQFP | LQFP | LQFP | LQFP |
封装等效代码 | QFP100,.63X.87 | QFP100,.63X.87 | QFP100,.63X.87 | QFP100,.63X.87 | QFP100,.63X.87 | QFP100,.63X.87 | QFP100,.63X.87 | QFP100,.63X.87 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm |
最大待机电流 | 0.01 A | 0.01 A | 0.01 A | 0.01 A | 0.01 A | 0.01 A | 0.01 A | 0.01 A |
最小待机电流 | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V |
最大压摆率 | 0.25 mA | 0.2 mA | 0.25 mA | 0.25 mA | 0.28 mA | 0.25 mA | 0.28 mA | 0.28 mA |
最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V |
标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
宽度 | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm |