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NE5517AN

Transconductance Amplifiers Transconductance

器件类别:模拟混合信号IC    放大器电路   

厂商名称:ON Semiconductor(安森美)

厂商官网:http://www.onsemi.cn

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器件参数
参数名称
属性值
Brand Name
ON Semiconductor
是否无铅
含铅
是否Rohs认证
不符合
厂商名称
ON Semiconductor(安森美)
零件包装代码
DIP
包装说明
PLASTIC, DIP-16
针数
16
制造商包装代码
648-08
Reach Compliance Code
not_compliant
ECCN代码
EAR99
Is Samacsys
N
放大器类型
OPERATIONAL AMPLIFIER
架构
TRANSCONDUCTANCE
最大平均偏置电流 (IIB)
7 µA
25C 时的最大偏置电流 (IIB)
5 µA
标称共模抑制比
110 dB
频率补偿
YES
最大输入失调电压
5000 µV
JESD-30 代码
R-PDIP-T16
JESD-609代码
e0
长度
19.175 mm
低-失调
NO
负供电电压上限
-22 V
标称负供电电压 (Vsup)
-15 V
功能数量
2
端子数量
16
最高工作温度
70 °C
最低工作温度
封装主体材料
PLASTIC/EPOXY
封装代码
DIP
封装等效代码
DIP16,.3
封装形状
RECTANGULAR
封装形式
IN-LINE
包装方法
RAIL
峰值回流温度(摄氏度)
NOT SPECIFIED
电源
+-15 V
认证状态
Not Qualified
座面最大高度
4.4 mm
标称压摆率
50 V/us
最大压摆率
4 mA
供电电压上限
22 V
标称供电电压 (Vsup)
15 V
表面贴装
NO
技术
BIPOLAR
温度等级
COMMERCIAL
端子面层
Tin/Lead (Sn/Pb)
端子形式
THROUGH-HOLE
端子节距
2.54 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
NOT SPECIFIED
标称均一增益带宽
2000 kHz
宽度
7.62 mm
Base Number Matches
1
文档预览
NE5517, NE5517A, AU5517
Dual Operational
Transconductance Amplifier
The AU5517 and NE5517 contain two current-controlled
transconductance amplifiers, each with a differential input and
push-pull output. The AU5517/NE5517 offers significant design and
performance advantages over similar devices for all types of
programmable gain applications. Circuit performance is enhanced
through the use of linearizing diodes at the inputs which enable a
10 dB signal-to-noise improvement referenced to 0.5% THD. The
AU5517/NE5517 is suited for a wide variety of industrial and
consumer applications.
Constant impedance of the buffers on the chip allow general use of
the AU5517/NE5517. These buffers are made of Darlington
transistors and a biasing network that virtually eliminate the change of
offset voltage due to a burst in the bias current I
ABC
, hence eliminating
the audible noise that could otherwise be heard in high quality audio
applications.
Features
http://onsemi.com
MARKING
DIAGRAMS
1
SOIC−16
D SUFFIX
CASE 751B
xx5517DG
AWLYWW
1
Constant Impedance Buffers
DV
BE
of Buffer is Constant with Amplifier I
BIAS
Change
Excellent Matching Between Amplifiers
Linearizing Diodes
High Output Signal-to-Noise Ratio
Pb−Free Packages are Available*
1
PDIP−16
N SUFFIX
CASE 648
NE5517yy
AWLYYWWG
1
Applications
Multiplexers
Timers
Electronic Music Synthesizers
Dolby® HX Systems
Current-Controlled Amplifiers, Filters
Current-Controlled Oscillators, Impedances
xx
yy
A
WL
YY, Y
WW
G
= AU or NE
= AN or N
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
PIN CONNECTIONS
N, D Packages
I
ABCa
1
D
a
2
+IN
a
3
−IN
a
4
VO
a
5
V− 6
IN
BUFFERa
7
VO
BUFFERa
8
16
15
14
13
12
11
10
9
I
ABCb
D
b
+IN
b
−IN
b
VO
b
V+
IN
BUFFERb
VO
BUFFERb
(Top View)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 13 of this data sheet.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
©
Semiconductor Components Industries, LLC, 2013
June, 2013
Rev. 4
1
Publication Order Number:
NE5517/D
NE5517, NE5517A, AU5517
PIN DESCRIPTION
Pin No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
Symbol
I
ABCa
D
a
+IN
a
−IN
a
VO
a
V−
IN
BUFFERa
VO
BUFFERa
VO
BUFFERb
IN
BUFFERb
V+
VO
b
−IN
b
+IN
b
D
b
I
ABCb
Amplifier Bias Input A
Diode Bias A
Non-inverted Input A
Inverted Input A
Output A
Negative Supply
Buffer Input A
Buffer Output A
Buffer Output B
Buffer Input B
Positive Supply
Output B
Inverted Input B
Non-inverted Input B
Diode Bias B
Amplifier Bias Input B
Description
V+
11
D4
Q6
Q10
D6
Q14
7,10
Q12
Q13
8,9
Q7
Q11
2,15
D2
−INPUT
4,13
1,16
AMP BIAS
INPUT
Q1
D1
V−
6
Q4
Q5
D3
+INPUT
3,14
VOUTPUT
5,12
Q15
Q2
Q9
R1
Q8
D5
D8
Q16
D7
Q3
Figure 1. Circuit Schematic
http://onsemi.com
2
NE5517, NE5517A, AU5517
B
AMP
BIAS
INPUT
16
B
DIODE
BIAS
15
B
INPUT
(+)
14
B
INPUT
(−)
13
B
OUTPUT
12
B
BUFFER
INPUT
10
B
BUFFER
OUTPUT
9
V+ (1)
11
B
+
+
A
1
AMP
BIAS
INPUT
A
2
DIODE
BIAS
A
3
INPUT
(+)
A
4
INPUT
(−)
A
5
OUTPUT
A
6
V−
7
BUFFER
INPUT
A
8
BUFFER
OUTPUT
A
NOTE:
V+ of output buffers and amplifiers are internally connected.
Figure 2. Connection Diagram
MAXIMUM RATINGS
Rating
Supply Voltage (Note 1)
Power Dissipation, T
amb
= 25
°C
(Still Air) (Note 2)
NE5517N, NE5517AN
NE5517D, AU5517D
Thermal Resistance, Junction−to−Ambient
D Package
N Package
Differential Input Voltage
Diode Bias Current
Amplifier Bias Current
Output Short-Circuit Duration
Buffer Output Current (Note 3)
Operating Temperature Range
NE5517N, NE5517AN
AU5517T
Operating Junction Temperature
DC Input Voltage
Storage Temperature Range
Lead Soldering Temperature (10 sec max)
Symbol
V
S
P
D
Value
44 V
DC
or
±22
1500
1125
140
94
±5.0
2.0
2.0
Indefinite
20
0
°C
to +70
°C
−40
°C
to +125
°C
150
+V
S
to
−V
S
−65
°C
to +150
°C
230
°C
°C
mA
°C
Unit
V
mW
R
qJA
°C/W
V
IN
I
D
I
ABC
I
SC
I
OUT
T
amb
V
mA
mA
T
J
V
DC
T
stg
T
sld
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. For selections to a supply voltage above
±22
V, contact factory.
2. The following derating factors should be applied above 25
°C
N package at 10.6 mW/°C
D package at 7.1 mW/°C.
3. Buffer output current should be limited so as to not exceed package dissipation.
http://onsemi.com
3
NE5517, NE5517A, AU5517
ELECTRICAL CHARACTERISTICS
(Note 4)
AU5517/NE5517
Characteristic
Input Offset Voltage
Test Conditions
Overtemperature Range
I
ABC
5.0
mA
Avg. TC of Input Offset Voltage
Diode Bias Current
(I
D
) = 500
mA
5.0
mA
I
ABC
500
mA
Avg. TC of Input Offset Current
Overtemperature Range
Avg. TC of Input Current
Overtemperature Range
g
M
6700
5400
I
BIAS
V
OS
I
OS
Symbol
V
OS
Min
Typ
0.4
0.3
7.0
0.5
0.1
0.1
0.001
0.4
1.0
0.01
9600
0.3
R
L
= 0, I
ABC
= 5.0
mA
R
L
= 0, I
ABC
= 500
mA
R
L
= 0, Overtemperature
Range
R
L
=
∞,
5.0
mA
I
ABC
500
mA
R
L
=
∞,
5.0
mA
I
ABC
500
mA
I
ABC
= 500
mA,
both channels
D
V
OS
/D V+
D
V
OS
/D V−
CMRR
80
±12
Referred to Input (Note 5)
20 Hz < f < 20 kHz
I
ABC
= 0, Input =
±4.0
V
I
ABC
= 0 (Refer to Test Circuit)
R
IN
B
W
Unity Gain Compensated
5
5
Refer to Buffer V
BE
Test
Circuit (Note 6)
SR
IN
BUFFER
VO
BUFFER
10
0.5
5.0
10
I
IN
I
OUT
350
300
5.0
500
650
3.0
350
300
13000
7700
4000
5.0
8.0
0.6
5
Max
5.0
5.0
Min
NE5517A
Typ
0.4
0.3
7.0
0.5
0.1
0.1
0.001
0.4
1.0
0.01
9600
0.3
5.0
500
7.0
650
12000
5.0
7.0
2.0
3.0
0.6
Max
2.0
5.0
2.0
Unit
mV
DV
OS
/DT
V
OS
Including Diodes
Input Offset Change
Input Offset Current
DI
OS
/DT
Input Bias Current
DI
B
/DT
Forward Transconductance
g
M
Tracking
Peak Output Current
mV/°C
mV
mV
mA
mA/°C
mA
mA/°C
mmho
dB
mA
Peak Output Voltage
Positive
Negative
Supply Current
V
OS
Sensitivity
Positive
Negative
V
OUT
+12
−12
+14.2
−14.4
2.6
20
20
110
±13.5
100
0.02
0.2
26
2.0
50
0.4
5.0
100
100
4.0
150
150
+12
−12
+14.2
−14.4
2.6
20
20
4.0
150
150
V
I
CC
mA
mV/V
Common-mode Rejection
Ration
Common-mode Range
Crosstalk
Differential Input Current
Leakage Current
Input Resistance
Open-loop Bandwidth
Slew Rate
Buffer Input Current
Peak Buffer Output Voltage
DV
BE
of Buffer
80
±12
110
±13.5
100
0.02
0.2
10
5.0
dB
V
dB
nA
nA
kW
MHz
V/ms
5.0
mA
V
mV
10
26
2.0
50
0.4
10
0.5
5.0
4. These specifications apply for V
S
=
±15
V, T
amb
= 25°C, amplifier bias current (I
ABC
) = 500
mA,
Pins 2 and 15 open unless otherwise
specified. The inputs to the buffers are grounded and outputs are open.
5. These specifications apply for V
S
=
±15
V, I
ABC
= 500
mA,
R
OUT
= 5.0 kW connected from the buffer output to
−V
S
and the input of the buffer
is connected to the transconductance amplifier output.
6. V
S
=
±15,
R
OUT
= 5.0 kW connected from Buffer output to
−V
S
and 5.0
mA
I
ABC
500
mA.
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4
NE5517, NE5517A, AU5517
TYPICAL PERFORMANCE CHARACTERISTICS
10 3
INPUT OFFSET CURRENT (nA)
V
S
=
±15V
+125°C
-55°C
+25°C
5
4
INPUT OFFSET VOLTAGE (mV)
3
2
1
0
-1
-2
-3
-4
-5
-6
-7
-8
0.1mA
1mA
10mA
100mA
1000mA
10 4
V
S
=
±15V
V
S
=
±15V
INPUT BIAS CURRENT (nA)
10
3
10
2
-55°C
+125°C
10
+25°C
+125°C
10
2
-55°C
1
10
+25°C
+125°C
0.1
0.1mA
1mA
10mA
100mA
1000mA
AMPLIFIER BIAS CURRENT (I
ABC
)
AMPLIFIER BIAS CURRENT (I
ABC
)
1
0.1mA
1mA
10mA
100mA
1000mA
AMPLIFIER BIAS CURRENT (I
ABC
)
Figure 3. Input Offset Voltage
10 4
PEAK OUTPUT CURRENT (
μ
A)
V
S
=
±15V
+125°C
Figure 4. Input Bias Current
5
4
PEAK OUTPUT VOLTAGE AND
COMMON-MODE RANGE (V)
3
2
1
0
-1
-2
-3
-4
-5
-6
-7
-8
V
OUT
V
CMR
10 5
V
OUT
LEAKAGE CURRENT (pA)
V
CMR
V
S
=
±15V
RLOAD =
T
amb
= 25°C
Figure 5. Input Bias Current
(+)V
IN
= (−)V
IN
= V
OUT
= 36V
10 4
10 3
+25°C
10 2
-55°C
10 3
0V
10 2
10
1
0.1mA
1mA
10mA
100mA
1000mA
0.1mA
1mA
10mA
100mA
1000mA
10
-50°C -25°C
0°C 25°C 50°C 75°C100°C125°C
AMPLIFIER BIAS CURRENT (I
ABC
)
AMPLIFIER BIAS CURRENT (I
ABC
)
AMBIENT TEMPERATURE (T
A
)
Figure 6. Peak Output Current
Figure 7. Peak Output Voltage and
Common-Mode Range
10 5
gM
10 4
mq
m
M
10 2
INPUT RESISTANCE (MEG
Ω
)
Figure 8. Leakage Current
TRANSCONDUCTANCE (gM) — (
μ
ohm)
10 4
INPUT LEAKAGE CURRENT (pA)
+125°C
PINS 2, 15
OPEN
V
S
=
±15V
PINS 2, 15
OPEN
10
1
10 3
10 2
+25°C
10 3
-55°C
+125°C
1
10
10 2
+25°C
0.1
1
10
0
1
2
3
4
5
6
INPUT DIFFERENTIAL VOLTAGE
7
0.1mA
1mA
10mA
100mA
1000mA
0.01
0.1mA
1mA
10mA
100mA
1000mA
AMPLIFIER BIAS CURRENT (I
ABC
)
AMPLIFIER BIAS CURRENT (I
ABC
)
Figure 9. Input Leakage
Figure 10. Transconductance
Figure 11. Input Resistance
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参数对比
与NE5517AN相近的元器件有:NE5517DR2。描述及对比如下:
型号 NE5517AN NE5517DR2
描述 Transconductance Amplifiers Transconductance Transconductance Amplifiers Transconductance
Brand Name ON Semiconductor ON Semiconductor
是否无铅 含铅 含铅
是否Rohs认证 不符合 不符合
厂商名称 ON Semiconductor(安森美) ON Semiconductor(安森美)
零件包装代码 DIP SOIC
包装说明 PLASTIC, DIP-16 SOIC-16
针数 16 16
制造商包装代码 648-08 751B-05
Reach Compliance Code not_compliant not_compliant
ECCN代码 EAR99 EAR99
Is Samacsys N N
放大器类型 OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
架构 TRANSCONDUCTANCE TRANSCONDUCTANCE
最大平均偏置电流 (IIB) 7 µA 8 µA
25C 时的最大偏置电流 (IIB) 5 µA 5 µA
标称共模抑制比 110 dB 110 dB
频率补偿 YES YES
最大输入失调电压 5000 µV 5000 µV
JESD-30 代码 R-PDIP-T16 R-PDSO-G16
JESD-609代码 e0 e0
长度 19.175 mm 9.9 mm
低-失调 NO NO
负供电电压上限 -22 V -22 V
标称负供电电压 (Vsup) -15 V -15 V
功能数量 2 2
端子数量 16 16
最高工作温度 70 °C 70 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 DIP SOP
封装等效代码 DIP16,.3 SOP16,.25
封装形状 RECTANGULAR RECTANGULAR
封装形式 IN-LINE SMALL OUTLINE
包装方法 RAIL TAPE AND REEL
峰值回流温度(摄氏度) NOT SPECIFIED 240
电源 +-15 V +-15 V
认证状态 Not Qualified Not Qualified
座面最大高度 4.4 mm 1.75 mm
标称压摆率 50 V/us 50 V/us
最大压摆率 4 mA 4 mA
供电电压上限 22 V 22 V
标称供电电压 (Vsup) 15 V 15 V
表面贴装 NO YES
技术 BIPOLAR BIPOLAR
温度等级 COMMERCIAL COMMERCIAL
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 THROUGH-HOLE GULL WING
端子节距 2.54 mm 1.27 mm
端子位置 DUAL DUAL
处于峰值回流温度下的最长时间 NOT SPECIFIED 30
标称均一增益带宽 2000 kHz 2000 kHz
宽度 7.62 mm 3.9 mm
Base Number Matches 1 1
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器件捷径:
00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W
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