型号
- 型号
- 关键词
16,384-Bit (2048 x 8) CMOS EPROM
厂商名称：Fairchild
厂商官网：http://www.fairchildsemi.com/
下载文档| 型号 | NMC27C16BQ200 | NMC27C16BQ | NMC27C16BQ150 | NMC27C16BQE200 | NMC27C16B |
|---|---|---|---|---|---|
| 描述 | 16,384-Bit (2048 x 8) CMOS EPROM | 16,384-Bit (2048 x 8) CMOS EPROM | 16,384-Bit (2048 x 8) CMOS EPROM | 16,384-Bit (2048 x 8) CMOS EPROM | 16,384-Bit (2048 x 8) CMOS EPROM |
| 是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | - |
| 厂商名称 | Fairchild | - | Fairchild | Fairchild | - |
| 零件包装代码 | DIP | - | DIP | DIP | - |
| 包装说明 | WDIP, DIP24,.6 | - | WDIP, DIP24,.6 | WDIP, DIP24,.6 | - |
| 针数 | 24 | - | 24 | 24 | - |
| Reach Compliance Code | unknow | - | unknow | unknow | - |
| ECCN代码 | EAR99 | - | EAR99 | EAR99 | - |
| 最长访问时间 | 200 ns | - | 150 ns | 200 ns | - |
| 其他特性 | TTL COMPATIBLE INPUTS/OUTPUTS | - | TTL COMPATIBLE INPUTS/OUTPUTS | TTL COMPATIBLE INPUTS/OUTPUTS | - |
| I/O 类型 | COMMON | - | COMMON | COMMON | - |
| JESD-30 代码 | R-GDIP-T24 | - | R-GDIP-T24 | R-GDIP-T24 | - |
| JESD-609代码 | e0 | - | e0 | e0 | - |
| 内存密度 | 16384 bi | - | 16384 bi | 16384 bi | - |
| 内存集成电路类型 | UVPROM | - | UVPROM | UVPROM | - |
| 内存宽度 | 8 | - | 8 | 8 | - |
| 功能数量 | 1 | - | 1 | 1 | - |
| 端子数量 | 24 | - | 24 | 24 | - |
| 字数 | 2048 words | - | 2048 words | 2048 words | - |
| 字数代码 | 2000 | - | 2000 | 2000 | - |
| 工作模式 | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS | - |
| 最高工作温度 | 70 °C | - | 70 °C | 85 °C | - |
| 组织 | 2KX8 | - | 2KX8 | 2KX8 | - |
| 输出特性 | 3-STATE | - | 3-STATE | 3-STATE | - |
| 封装主体材料 | CERAMIC, GLASS-SEALED | - | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | - |
| 封装代码 | WDIP | - | WDIP | WDIP | - |
| 封装等效代码 | DIP24,.6 | - | DIP24,.6 | DIP24,.6 | - |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | IN-LINE, WINDOW | - | IN-LINE, WINDOW | IN-LINE, WINDOW | - |
| 并行/串行 | PARALLEL | - | PARALLEL | PARALLEL | - |
| 电源 | 5 V | - | 5 V | 5 V | - |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | - |
| 座面最大高度 | 5.969 mm | - | 5.969 mm | 5.969 mm | - |
| 最大待机电流 | 0.0001 A | - | 0.0001 A | 0.0001 A | - |
| 最大压摆率 | 0.02 mA | - | 0.02 mA | 0.02 mA | - |
| 最大供电电压 (Vsup) | 5.5 V | - | 5.5 V | 5.5 V | - |
| 最小供电电压 (Vsup) | 4.5 V | - | 4.5 V | 4.5 V | - |
| 标称供电电压 (Vsup) | 5 V | - | 5 V | 5 V | - |
| 表面贴装 | NO | - | NO | NO | - |
| 技术 | CMOS | - | CMOS | CMOS | - |
| 温度等级 | COMMERCIAL | - | COMMERCIAL | INDUSTRIAL | - |
| 端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| 端子形式 | THROUGH-HOLE | - | THROUGH-HOLE | THROUGH-HOLE | - |
| 端子节距 | 2.54 mm | - | 2.54 mm | 2.54 mm | - |
| 端子位置 | DUAL | - | DUAL | DUAL | - |
| 宽度 | 15.24 mm | - | 15.24 mm | 15.24 mm | - |