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器件参数

参数名称

属性值

Brand Name

Texas Instruments

是否Rohs认证

符合

厂商名称

Texas Instruments(德州仪器)

零件包装代码

BGA

包装说明

VFBGA, BGA515,26X26,20

针数

515

Reach Compliance Code

compli

ECCN代码

3A001.A.3

地址总线宽度

边界扫描

YES

最大时钟频率

59 MHz

外部数据总线宽度

格式

FLOATING POINT

集成缓存

YES

JESD-30 代码

S-PBGA-B515

JESD-609代码

长度

14 mm

低功率模式

YES

湿度敏感等级

端子数量

515

最高工作温度

105 °C

最低工作温度

-40 °C

封装主体材料

PLASTIC/EPOXY

封装代码

VFBGA

封装等效代码

BGA515,26X26,20

封装形状

SQUARE

封装形式

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

峰值回流温度（摄氏度）

260

电源

1.1,1.8,3.3 V

认证状态

Not Qualified

座面最大高度

1 mm

速度

600 MHz

表面贴装

YES

技术

CMOS

温度等级

INDUSTRIAL

端子面层

Tin/Silver/Copper (Sn/Ag/Cu)

端子形式

BALL

端子节距

0.5 mm

端子位置

BOTTOM

处于峰值回流温度下的最长时间

NOT SPECIFIED

宽度

14 mm

uPs/uCs/外围集成电路类型

MICROPROCESSOR, RISC

参数对比

与OMAP3525DZCBCA相近的元器件有：OMAP3530DZCBB、OMAP3525DZCBC、OMAP3530DZCBBA、OMAP3525EZCBC、OMAP3525EZCBCA、OMAP3530EZCBB、OMAP3530EZCBBA。描述及对比如下：

型号	OMAP3525DZCBCA	OMAP3530DZCBB	OMAP3525DZCBC	OMAP3530DZCBBA	OMAP3525EZCBC	OMAP3525EZCBCA	OMAP3530EZCBB	OMAP3530EZCBBA
描述	Processors - Application Specialized HiRel and OMAP3525	Processors - Application Specialized OMAP3530-HiRel OMAP 3525-HiRel App Proc	Processors - Application Specialized Applications Proc	Processors - Application Specialized HiRel and OMAP3525	OMAP3525-HiRel Applications Processor 515-POP-FCBGA -40 to 90	OMAP3525-HiRel Applications Processor 515-POP-FCBGA -40 to 105	OMAP3530-HiRel Applications Processor 515-POP-FCBGA 0 to 90	OMAP3530-HiRel Applications Processor 515-POP-FCBGA -40 to 105
Brand Name	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
是否Rohs认证	符合	符合	符合	符合	符合	符合	符合	符合
零件包装代码	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
包装说明	VFBGA, BGA515,26X26,20	0.40 MM PITCH, GREEN, PLASTIC, BGA-515	0.50 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-515	0.40 MM PITCH, GREEN, PLASTIC, BGA-515	VFBGA, BGA515,26X26,20	VFBGA, BGA515,26X26,20	VFBGA, BGA515,28X28,16	VFBGA, BGA515,28X28,16
针数	515	515	515	515	515	515	515	515
Reach Compliance Code	compli	compli	compli	compli	compli	compli	compli	compli
ECCN代码	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A991.A.2	3A991.A.2	3A991.A.2	3A991.A.2
地址总线宽度	26	26	26	26	26	26	26	26
边界扫描	YES	YES	YES	YES	YES	YES	YES	YES
最大时钟频率	59 MHz	59 MHz	59 MHz	59 MHz	38.4 MHz	38.4 MHz	38.4 MHz	38.4 MHz
外部数据总线宽度	16	16	16	16	16	16	16	16
格式	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT
集成缓存	YES	YES	YES	YES	YES	YES	YES	YES
JESD-30 代码	S-PBGA-B515	S-PBGA-B515	S-PBGA-B515	S-PBGA-B515	S-PBGA-B515	S-PBGA-B515	S-PBGA-B515	S-PBGA-B515
JESD-609代码	e1	e1	e1	e1	e1	e1	e1	e1
长度	14 mm	12 mm	14 mm	12 mm	14 mm	14 mm	12 mm	12 mm
低功率模式	YES	YES	YES	YES	YES	YES	YES	YES
湿度敏感等级	3	3	3	3	3	3	3	3
端子数量	515	515	515	515	515	515	515	515
最高工作温度	105 °C	90 °C	90 °C	105 °C	90 °C	105 °C	90 °C	105 °C
最低工作温度	-40 °C	-	-40 °C	-40 °C	-40 °C	-40 °C	-	-40 °C
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	VFBGA	VFBGA	VFBGA	VFBGA	VFBGA	VFBGA	VFBGA	VFBGA
封装等效代码	BGA515,26X26,20	BGA515,28X28,16	BGA515,26X26,20	BGA515,28X28,16	BGA515,26X26,20	BGA515,26X26,20	BGA515,28X28,16	BGA515,28X28,16
封装形状	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
封装形式	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
峰值回流温度（摄氏度）	260	260	260	260	260	260	260	260
电源	1.1,1.8,3.3 V	1.1,1.8,3.3 V	1.1,1.8,3.3 V	1.1,1.8,3.3 V	1.1,1.2,1.8,1.8/3 V	1.1,1.2,1.8,1.8/3 V	1.1,1.2,1.8,1.8/3 V	1.1,1.2,1.8,1.8/3 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	1 mm	0.9 mm	1 mm	0.9 mm	0.95 mm	0.95 mm	0.9 mm	0.9 mm
速度	600 MHz	600 MHz	600 MHz	600 MHz	600 MHz	600 MHz	600 MHz	600 MHz
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	INDUSTRIAL	OTHER	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	OTHER	INDUSTRIAL
端子面层	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	TIN SILVER COPPER	TIN SILVER COPPER	TIN SILVER COPPER	TIN SILVER COPPER
端子形式	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
端子节距	0.5 mm	0.4 mm	0.5 mm	0.4 mm	0.5 mm	0.5 mm	0.4 mm	0.4 mm
端子位置	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
处于峰值回流温度下的最长时间	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
宽度	14 mm	12 mm	14 mm	12 mm	14 mm	14 mm	12 mm	12 mm
uPs/uCs/外围集成电路类型	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC
最大供电电压	-	1.91 V	1.91 V	-	1.35 V	1.35 V	1.35 V	1.35 V
最小供电电压	-	1.71 V	1.71 V	-	0.985 V	0.985 V	0.985 V	0.985 V
标称供电电压	-	1.8 V	1.8 V	-	1 V	1 V	1 V	1 V