型号
- 型号
- 关键词
Standard SRAM, 128KX8, 20ns, CMOS, PDIP32, 0.300 INCH, PLASTIC, DIP-32
厂商名称：Pyramid Semiconductor Corporation
厂商官网：http://www.pyramidsemiconductor.com/
下载文档| 型号 | P4C1024-20P3C | P4C1024-25P3I | P4C1024-20J3I | P4C1024-35J4I |
|---|---|---|---|---|
| 描述 | Standard SRAM, 128KX8, 20ns, CMOS, PDIP32, 0.300 INCH, PLASTIC, DIP-32 | Standard SRAM, 128KX8, 25ns, CMOS, PDIP32, 0.300 INCH, PLASTIC, DIP-32 | Standard SRAM, 128KX8, 20ns, CMOS, PDSO32, 0.300 INCH, PLASTIC, SOJ-32 | Standard SRAM, 128KX8, 35ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, SOJ-32 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | DIP | DIP | SOJ | SOJ |
| 包装说明 | DIP, DIP32,.3 | DIP, DIP32,.3 | 0.300 INCH, PLASTIC, SOJ-32 | SOJ, SOJ32,.44 |
| 针数 | 32 | 32 | 32 | 32 |
| Reach Compliance Code | compliant | compliant | compliant | compliant |
| ECCN代码 | 3A991.B.2.B | EAR99 | 3A991.B.2.B | EAR99 |
| 最长访问时间 | 20 ns | 25 ns | 20 ns | 35 ns |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | R-PDIP-T32 | R-PDIP-T32 | R-PDSO-J32 | R-PDSO-J32 |
| JESD-609代码 | e0 | e0 | e0 | e0 |
| 长度 | 40.64 mm | 40.64 mm | 20.955 mm | 20.955 mm |
| 内存密度 | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit |
| 内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| 内存宽度 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 32 | 32 | 32 | 32 |
| 字数 | 131072 words | 131072 words | 131072 words | 131072 words |
| 字数代码 | 128000 | 128000 | 128000 | 128000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | - | -40 °C | -40 °C | -40 °C |
| 组织 | 128KX8 | 128KX8 | 128KX8 | 128KX8 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | SOJ | SOJ |
| 封装等效代码 | DIP32,.3 | DIP32,.3 | SOJ32,.34 | SOJ32,.44 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | 5.08 mm | 3.7592 mm | 3.7592 mm |
| 最大待机电流 | 0.02 A | 0.02 A | 0.02 A | 0.02 A |
| 最小待机电流 | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 最大压摆率 | 0.16 mA | 0.165 mA | 0.175 mA | 0.16 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | J BEND | J BEND |
| 端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 7.62 mm | 7.62 mm | 8.56 mm | 11.76 mm |
| 厂商名称 | - | Pyramid Semiconductor Corporation | Pyramid Semiconductor Corporation | Pyramid Semiconductor Corporation |