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DISCRETE SEMICONDUCTORS
DATA SHEET
fpage
M3D087
PBSS5540Z
40 V low V
CEsat
PNP transistor
Product data sheet
Supersedes data of 2001 Jan 26
2001 Sep 21
NXP Semiconductors
Product data sheet
40 V low V
CEsat
PNP transistor
FEATURES
•
Low collector-emitter saturation voltage
•
High current capability
•
Improved device reliability due to reduced heat
generation.
APPLICATIONS
•
Supply line switching circuits
•
Battery management applications
•
DC/DC converter applications
•
Strobe flash units
•
Heavy duty battery powered equipment (motor and lamp
drivers)
•
MOSFET driver applications.
DESCRIPTION
PNP low V
CEsat
transistor in a SOT223 plastic package.
NPN complement: PBSS4540Z.
MARKING
TYPE NUMBER
PBSS5540Z
MARKING CODE
PB5540
1
Top view
2
3
PBSS5540Z
QUICK REFERENCE DATA
SYMBOL
V
CEO
I
C
I
CM
R
CEsat
PINNING
PIN
1
2
3
4
base
collector
emitter
collector
DESCRIPTION
PARAMETER
emitter-collector voltage
collector current (DC)
peak collector current
equivalent on-resistance
MAX
−40
−5
−10
<80
UNIT
V
A
A
mΩ
handbook, halfpage
4
2, 4
1
3
MAM288
Fig.1 Simplified outline (SOT223) and symbol.
2001 Sep 21
2
NXP Semiconductors
Product data sheet
40 V low V
CEsat
PNP transistor
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
V
CBO
V
CEO
V
EBO
I
C
I
CM
I
BM
P
tot
T
stg
T
j
T
amb
Notes
PARAMETER
collector-base voltage
collector-emitter voltage
emitter-base voltage
collector current (DC)
peak collector current
peak base current
total power dissipation
storage temperature
junction temperature
operating ambient temperature
T
amb
≤
25
°C;
note 1
T
amb
≤
25
°C;
note 2
CONDITIONS
open emitter
open base
open collector
−
−
−
−
−
−
−
−
−65
−
−65
MIN.
PBSS5540Z
MAX.
−40
−40
−6
−5
−10
−2
1.35
2
+150
150
+150
V
V
V
A
A
A
W
W
UNIT
°C
°C
°C
1. Device mounted on a printed-circuit board, single-sided copper, tinplated, mounting pad for collector 1 cm
2
.
2. Device mounted on a printed-circuit board, single-sided copper, tinplated, mounting pad for collector 6 cm
2
.
For other mounting conditions, see
“Thermal considerations for SOT223 in the General Part of associated
Handbook”.
THERMAL CHARACTERISTICS
SYMBOL
R
th j-a
Note
1. Device mounted on a printed-circuit board, single-sided copper, tinplated, mounting pad for collector 1 cm
2
.
PARAMETER
thermal resistance from junction to
ambient
CONDITIONS
in free air; note 1
VALUE
92
UNIT
K/W
2001 Sep 21
3
NXP Semiconductors
Product data sheet
40 V low V
CEsat
PNP transistor
CHARACTERISTICS
T
amb
= 25
°C
unless otherwise specified.
SYMBOL
I
CBO
I
EBO
h
FE
PARAMETER
collector-base cut-off current
emitter-base cut-off current
DC current gain
CONDITIONS
V
CB
=
−30
V; I
E
= 0
V
CB
=
−30
V; I
E
= 0; T
j
= 150
°C
V
EB
=
−5
V; I
C
= 0
V
CE
=
−2
V; I
C
=
−500
mA
V
CE
=
−2
V; I
C
=
−1
A; note 1
V
CE
=
−2
V; I
C
=
−2
A; note 1
V
CE
=
−2
V; I
C
=
−5
A; note 1
V
CEsat
collector-emitter saturation voltage
I
C
=
−500
mA; I
B
=
−5
mA
I
C
=
−1
A; I
B
=
−10
mA
I
C
=
−2
A; I
B
=
−200
mA
R
CEsat
V
CEsat
V
BEsat
V
BEon
f
T
C
c
Note
1. Pulse test: t
p
≤
300
μs; δ ≤
0.02.
equivalent on-resistance
collector-emitter saturation voltage
base-emitter saturation voltage
base-emitter turn-on voltage
transition frequency
collector capacitance
I
C
=
−2
A; I
B
=
−200
mA; note 1
I
C
=
−5
A; I
B
=
−500
mA
I
C
=
−5
A; I
B
=
−500
mA
V
CE
=
−2
V; I
C
=
−2
A
I
C
=
−100
mA; V
CE
=
−10
V;
f = 100 MHz
V
CB
=
−10
V; I
E
= I
e
= 0;
f = 1 MHz
MIN.
−
−
−
250
200
150
50
−
−
−
−
−
−
−
60
−
PBSS5540Z
TYP.
−
−
−
350
300
250
150
−80
−120
−110
<55
−250
−
−0.8
120
90
MAX.
−100
−50
−100
−
−
−
−
−120
−170
−160
<80
−375
−1.3
−1.25
−
105
UNIT
nA
μA
nA
mV
mV
mV
mΩ
mV
V
V
MHz
pF
2001 Sep 21
4