型号 | RM54AC574SSA | JM38510/75604BS | JM38510/75604B2 |
---|---|---|---|
描述 | AC SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDFP20, CERAMIC, DFP-20 | IC AC SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDFP20, CERAMIC, DFP-20, Bus Driver/Transceiver | IC AC SERIES, 8-BIT DRIVER, TRUE OUTPUT, CQCC20, CERAMIC, LCC-20, Bus Driver/Transceiver |
厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
零件包装代码 | DFP | DFP | QLCC |
包装说明 | DFP, | DFP, | QCCN, |
针数 | 20 | 20 | 20 |
Reach Compliance Code | unknown | compliant | compliant |
系列 | AC | AC | AC |
JESD-30 代码 | R-GDFP-F20 | R-GDFP-F20 | S-CQCC-N20 |
长度 | 13.716 mm | 13.716 mm | 8.89 mm |
逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER |
位数 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 |
端口数量 | 2 | 2 | 2 |
端子数量 | 20 | 20 | 20 |
最高工作温度 | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C |
输出特性 | 3-STATE | 3-STATE | 3-STATE |
输出极性 | TRUE | TRUE | TRUE |
封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
封装代码 | DFP | DFP | QCCN |
封装形状 | RECTANGULAR | RECTANGULAR | SQUARE |
封装形式 | FLATPACK | FLATPACK | CHIP CARRIER |
传播延迟(tpd) | 16.5 ns | 16.5 ns | 16.5 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 2.286 mm | 2.286 mm | 1.905 mm |
最大供电电压 (Vsup) | 6 V | 6 V | 6 V |
最小供电电压 (Vsup) | 2 V | 2 V | 2 V |
标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES |
技术 | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY |
端子形式 | FLAT | FLAT | NO LEAD |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | QUAD |
宽度 | 6.731 mm | 6.731 mm | 8.89 mm |
其他特性 | LG_MAX | LG_MAX | - |
控制类型 | - | INDEPENDENT CONTROL | INDEPENDENT CONTROL |
计数方向 | - | UNIDIRECTIONAL | UNIDIRECTIONAL |
负载电容(CL) | - | 50 pF | 50 pF |
最大I(ol) | - | 0.024 A | 0.024 A |
最大电源电流(ICC) | - | 0.08 mA | 0.08 mA |
Prop。Delay @ Nom-Sup | - | 16.5 ns | 16.5 ns |
筛选级别 | - | MIL-M-38510 Class B | MIL-M-38510 Class B |
翻译 | - | N/A | N/A |
触发器类型 | - | POSITIVE EDGE | POSITIVE EDGE |