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S9S08QD2VSC

8-BIT, FLASH, 16MHz, MICROCONTROLLER, PDSO8, ROHS COMPLIANT, MS-012AA, SOIC-8

器件类别:嵌入式处理器和控制器    微控制器和处理器   

厂商名称:NXP(恩智浦)

厂商官网:https://www.nxp.com

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器件参数
参数名称
属性值
厂商名称
NXP(恩智浦)
零件包装代码
SOIC
包装说明
SOP,
针数
8
Reach Compliance Code
unknown
ECCN代码
EAR99
具有ADC
YES
位大小
8
最大时钟频率
16 MHz
DAC 通道
NO
DMA 通道
NO
JESD-30 代码
R-PDSO-G8
长度
4.9 mm
I/O 线路数量
4
端子数量
8
最高工作温度
105 °C
最低工作温度
-40 °C
PWM 通道
YES
封装主体材料
PLASTIC/EPOXY
封装代码
SOP
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE
认证状态
Not Qualified
ROM可编程性
FLASH
座面最大高度
1.75 mm
速度
16 MHz
最大供电电压
5.5 V
最小供电电压
2.7 V
标称供电电压
3 V
表面贴装
YES
技术
CMOS
温度等级
INDUSTRIAL
端子形式
GULL WING
端子节距
1.27 mm
端子位置
DUAL
宽度
3.9 mm
uPs/uCs/外围集成电路类型
MICROCONTROLLER
文档预览
MC9S08QD4
MC9S08QD2
S9S08QD4
S9S08QD2
Data Sheet
HCS08
Microcontrollers
MC9S08QD4
Rev. 3
11/2007
freescale.com
MC9S08QD4 Series Features
8-Bit HCS08 Central Processor Unit (CPU)
Flash block protect
16 MHz HCS08 CPU (central processor
unit)
HC08 instruction set with added BGND
instruction
Background debugging system
Breakpoint capability to allow single
breakpoint setting during in-circuit
debugging (plus two more breakpoints in
on-chip debug module)
Support for up to 32 interrupt/reset sources
Peripherals
Memory
Flash read/program/erase over full
operating voltage and temperature
Flash size:
— MC9S08QD4/S9S08QD4: 4096 bytes
— MC9S08QD2/S9S08QD2: 2048 bytes
RAM size
— MC9S08QD4/S9S08QD4: 256 bytes
— MC9S08QD2/S9S08QD2: 128 bytes
ADC
— 4-channel, 10-bit analog-to-digital
converter with automatic compare
function, asynchronous clock source,
temperature sensor and internal bandgap
reference channel. ADC is hardware
triggerable using the RTI counter.
TIM1
— 2-channel timer/pulse-width
modulator; each channel can be used for
input capture, output compare, buffered
edge-aligned PWM, or buffered
center-aligned PWM
TIM2
— 1-channel timer/pulse-width
modulator; each channel can be used for
input capture, output compare, buffered
edge-aligned PWM, or buffered
center-aligned PWM
KBI
— 4-pin keyboard interrupt module
with software selectable polarity on edge or
edge/level modes
Input/Output
Power-Saving Modes
Wait plus three stops
Clock Source Options
ICS
— Internal clock source module (ICS)
containing a frequency-locked-loop (FLL)
controlled by internal. Precision trimming
of internal reference allows 0.2% resolution
and 2% deviation over temperature and
voltage.
Four General-purpose input/output (I/O)
pins, one input-only pin and one
output-only pin. Outputs 10 mA each, 60
mA maximum for package.
Software selectable pullups on ports when
used as input
Software selectable slew rate control and
drive strength on ports when used as output
Internal pullup on RESET and IRQ pin to
reduce customer system cost
System Protection
Development Support
Watchdog computer operating properly
(COP) reset with option to run from
dedicated 32 kHz internal clock source or
bus clock
Low-voltage detection with reset or
interrupt
Illegal opcode detection with reset
Illegal address detection with reset
Single-wire background debug interface
Package Options
8-pin SOIC package
8-pin PDIP (Only for MC9S08QD4 and
MC9S08QD2)
All package options are RoHS compliant
MC9S08QD4 Data Sheet
Covers:
MC9S08QD4
MC9S08QD2
S9S08QD4
S9S08QD2
MC9S08QD4
Rev. 3
11/2007
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参数对比
与S9S08QD2VSC相近的元器件有:S9S08QD4VSC、S9S08QD2CSC、S9S08QD4CSC。描述及对比如下:
型号 S9S08QD2VSC S9S08QD4VSC S9S08QD2CSC S9S08QD4CSC
描述 8-BIT, FLASH, 16MHz, MICROCONTROLLER, PDSO8, ROHS COMPLIANT, MS-012AA, SOIC-8 8-BIT, FLASH, 16MHz, MICROCONTROLLER, PDSO8, ROHS COMPLIANT, MS-012AA, SOIC-8 8-BIT, FLASH, 16MHz, MICROCONTROLLER, PDSO8, ROHS COMPLIANT, MS-012AA, SOIC-8 8-BIT, FLASH, 16MHz, MICROCONTROLLER, PDSO8, ROHS COMPLIANT, MS-012AA, SOIC-8
厂商名称 NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦)
零件包装代码 SOIC SOIC SOIC SOIC
包装说明 SOP, SOP, SOP, SOP,
针数 8 8 8 8
Reach Compliance Code unknown unknown unknow unknow
ECCN代码 EAR99 EAR99 EAR99 EAR99
具有ADC YES YES YES YES
位大小 8 8 8 8
最大时钟频率 16 MHz 16 MHz 16 MHz 16 MHz
DAC 通道 NO NO NO NO
DMA 通道 NO NO NO NO
JESD-30 代码 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8
长度 4.9 mm 4.9 mm 4.9 mm 4.9 mm
I/O 线路数量 4 4 4 4
端子数量 8 8 8 8
最高工作温度 105 °C 105 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C
PWM 通道 YES YES YES YES
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 SOP SOP SOP SOP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified
ROM可编程性 FLASH FLASH FLASH FLASH
座面最大高度 1.75 mm 1.75 mm 1.75 mm 1.75 mm
速度 16 MHz 16 MHz 16 MHz 16 MHz
最大供电电压 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 2.7 V 2.7 V 2.7 V 2.7 V
标称供电电压 3 V 3 V 3 V 3 V
表面贴装 YES YES YES YES
技术 CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子形式 GULL WING GULL WING GULL WING GULL WING
端子节距 1.27 mm 1.27 mm 1.27 mm 1.27 mm
端子位置 DUAL DUAL DUAL DUAL
宽度 3.9 mm 3.9 mm 3.9 mm 3.9 mm
uPs/uCs/外围集成电路类型 MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER
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